Liquid photosensitive solder resist ink for LEDs

Abstract

The invention discloses a liquid photosensitive solder resist ink for LEDs. The liquid photosensitive solder resist ink for LEDs comprises the following raw materials in parts by weight: 100 parts ofphotosensitive resin, 20-30 parts of methacrylic acid monomers, 5-10 parts of resorcinol epoxy resin, 1-2 parts of pigment, 3-6 parts of a polymerization thermal initiator, 1-2 parts of a surfactant,10-15 parts of acrylic resin emulsion, 30-40 parts of a solvent, 0.5-0.8 parts of a catalyst, 0.2-0.4 parts of a diluent, 0.4-0.8 parts of a defoaming agent, 0.03 parts of a polymerization inhibitor and 0.8-1 part of a UV preservative, wherein the weight part ratio of the diluent to the defoaming agent is 1: 2. The problems of brittleness of photosensitive resin taking linear novolac epoxy resin as an initial raw material and insufficient heat resistance, chemical resistance, corrosion resistance and foaming of photosensitive resin synthesized by taking bisphenol A epoxy resin or bisphenol F epoxy resin or hydroxymethyl bisphenol A epoxy resin as an initial raw material are solved.

Description

technical field [0001] The invention relates to the technical field of inks, in particular to a liquid photosensitive solder resist ink for LEDs. Background technique [0002] With the continuous advancement and development of the modern electronics industry, my country's printed board solder resist resin began in the late 1970s. At that time, it was mainly heat-cured solder resist resin, which began to be transferred from imports to domestic production. Type character resin, due to the influence of precision, it finally develops into liquid photosensitive solder resist resin, which has both light curing and thermal curing resins. It is prepared by reacting with acid anhydride. The resin has excellent heat resistance after curing, but because of the large shrinkage after curing, the solder mask is easy to become brittle, and the scrap rate is high in the production process. Therefore, its product quality is not only related to the external resistance of the finished printed c...

AI Technical Summary

Problems solved by technology

[0002] With the continuous advancement and development of the modern electronics industry, my country's printed board solder resist resin began in the late 1970s. At that time, it was mainly heat-cured solder resist resin, which began to be transferred from imports to domestic production. Type character resin, due to the influence of precision, it finally develops into liquid photosensitive solder resist resin, which has both light curing and thermal curing resins. It is prepared by reacting with an acid anhydride. The resin has excellent heat resistance after curing, but because of the large shrinkage after curing, the solder mask is easy to become brittle, and the scrap rate is high in the production process.

Therefore, its product quality is not only related to the external resistance of the finished printed circuit board, but also directly affects the usability, reliability and durability of the printed circuit board product. The existing photosensitive solder resist resin has poor yellowing resistance , causing the product to be easily aged and affecting the use time of the product, and the existing photosensitive solder resist resin has poor photosensitivity, poor anti-corrosion performance, and easy foaming, which reduces the use efficiency and quality, and is difficult to meet the needs of production and use