Grinding pad and preparation method and application thereof
A technology of grinding pad and grinding layer, which is applied in the field of grinding pads, can solve the problems of high cost of grinding process, cumbersome cleaning process, poor process control ability, etc., achieve green environmental protection, high precision, high process controllability, and good self-repair effect Effect
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[0031] Example 1 Preparation of the polishing pad of the present invention
[0032] Preparation of raw materials: diamond abrasive raw materials: 80%, binder raw materials: 15%, and other auxiliary materials: 5%. Substrate types: one transparent rigid substrate, one elastic substrate; two double-sided adhesives.
[0033] The diameter of the diamond abrasive is 10um; the auxiliary materials include: sodium chloride particles, graphite powder and coupling agent (3:2:1); the bonding agent is uv curing resin and its initiator (98:2).
[0034] Uv curing resin is acrylated epoxy resin;
[0035] The initiator is cumene hydroperoxide;
[0036] The coupling agent is y-propyltrimethoxysilane;
[0037] The specific preparation method is as follows:
[0038] Prepare the binding agent: put the weighed binding agent into the container, keep the container at 35°C and stir with a stir bar to fully disperse the binding agent, open the air for 20 minutes, and discharge the odor generated when the uv resin...
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