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Grinding pad and preparation method and application thereof

A technology of grinding pad and grinding layer, which is applied in the field of grinding pads, can solve the problems of high cost of grinding process, cumbersome cleaning process, poor process control ability, etc., achieve green environmental protection, high precision, high process controllability, and good self-repair effect Effect

Inactive Publication Date: 2020-06-09
于洋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The traditional precision double-sided grinding process adopts the free abrasive method (abrasive + water + lubricating fluid), the uneven dispersion of abrasive particles and the uncontrollable movement of abrasive particles can easily lead to uneven grinding and cutting, and the surface shape accuracy of the workpiece is difficult to be guaranteed; The utilization rate of the abrasive particles in the free grinding liquid is low, the process control ability is poor, and the cleaning process after processing is cumbersome; the free grinding liquid grinds the workpiece and also damages the shape of the bearing surface of the bearing grinding equipment, so it is necessary to frequently check the shape of the bearing surface For ordinary grinding pads, during the grinding process, due to the excessive working pressure between the grinding layer and the workpiece, the lubricating fluid will not participate in the grinding sufficiently, and when the circulating fluid system fails, short-term dry grinding will occur. Due to the above reasons, the cost of grinding process remains high
[0003] Especially with the continuous development of nanoelectronics and new materials, the requirements for the flatness, surface quality and uniformity of the ground products are constantly increasing, and the controllability of the grinding process and the feasibility of fooling large-scale production management In this context, the traditional grinding method has been difficult to adapt to the development and technical requirements of today's industrialized precision double-sided grinding

Method used

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  • Grinding pad and preparation method and application thereof
  • Grinding pad and preparation method and application thereof
  • Grinding pad and preparation method and application thereof

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Embodiment 1

[0031] Example 1 Preparation of the polishing pad of the present invention

[0032] Preparation of raw materials: diamond abrasive raw materials: 80%, binder raw materials: 15%, and other auxiliary materials: 5%. Substrate types: one transparent rigid substrate, one elastic substrate; two double-sided adhesives.

[0033] The diameter of the diamond abrasive is 10um; the auxiliary materials include: sodium chloride particles, graphite powder and coupling agent (3:2:1); the bonding agent is uv curing resin and its initiator (98:2).

[0034] Uv curing resin is acrylated epoxy resin;

[0035] The initiator is cumene hydroperoxide;

[0036] The coupling agent is y-propyltrimethoxysilane;

[0037] The specific preparation method is as follows:

[0038] Prepare the binding agent: put the weighed binding agent into the container, keep the container at 35°C and stir with a stir bar to fully disperse the binding agent, open the air for 20 minutes, and discharge the odor generated when the uv resin...

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Abstract

The invention discloses a grinding pad and a preparation method and application thereof. The grinding pad comprises a grinding layer, a transparent base plate, a first adhesive layer, an elastic layerand a second adhesive layer, wherein the grinding layer, the transparent base plate, the first adhesive layer, the elastic layer and the second adhesive layer are sequentially arranged from top to bottom; and the grinding layer is prepared from a diamond grinding material, a binding agent and an auxiliary material, wherein the auxiliary material contains sodium chloride particle powder. Accordingto the grinding pad and the preparation method and application thereof, a space three-dimensional disordered micropore structure formed by the sodium chloride powder is applied to the grinding pad, so that lubricating liquid more sufficiently permeates into the surface layer of the grinding pad to participate in grinding, a workpiece subjected to precise grinding obtains higher surface quality, and a transient dry grinding condition is avoided; and meanwhile, the particle surface of a resin abrasive curing layer of the grinding pad has great self-sharpening performance and toughness, good self-repairing effects during grinding, efficient and low-cost processing, high process controllability and environmental friendliness can be achieved, and high processing precision and high-quality workpiece surface are guaranteed.

Description

Technical field [0001] The invention relates to a consolidated abrasive polishing product, in particular to a polishing pad formed by curing resin and diamond abrasive and a preparation method thereof, and belongs to the field of polishing pads. Background technique [0002] The traditional precision double-sided grinding process adopts the free abrasive method (abrasive + water + lubricating fluid). The uneven dispersion of abrasive particles and the uncontrollability of abrasive motion can easily cause uneven grinding and cutting, and the surface accuracy of the workpiece is difficult to guarantee; The free grinding fluid has low utilization rate of abrasive particles, poor process control ability, and cumbersome cleaning procedures after processing; the free grinding fluid grinds the workpiece and also damages the shape of the bearing surface of the bearing grinding equipment, so it is necessary to frequently change the shape of the bearing surface Perform dressing work; ordin...

Claims

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Application Information

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IPC IPC(8): B24B37/22B24B37/24B24D3/32B24D3/34B24D18/00
CPCB24B37/22B24B37/245B24D3/32B24D3/34B24D18/0009B24D18/0072
Inventor 于洋
Owner 于洋
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