Ptfe composite resist film for lcp high temperature lamination and its production process

A technology of anti-adhesive film and high temperature, which is applied in the direction of adhesive, film/sheet release liner, film/sheet adhesive, etc. It can solve the problem that the creep resistance and bending resistance need to be further improved, which affects the use Life and other issues, to improve release and resistance to glue performance, reduce surface air bubbles, and simple production process

Active Publication Date: 2021-02-09
苏州市新广益电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the creep resistance and bending resistance of this material need to be further improved, which will affect its service life. How to further prolong the service life of PTFE becomes the prerequisite for its successful application on the barrier film.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The PTFE composite barrier film for LCP high-temperature lamination is characterized in that it includes the first release film layer, the first adhesive layer, the high-temperature resistance layer, the second adhesive layer, and the second release film layer from top to bottom. type film layer; the first adhesive layer and the second adhesive layer are independently formed of high-temperature adhesive; the high-temperature adhesive layer is PTFE / PE / hydroxyl-terminated methyl vinyl fluorosilicone blend film layer.

[0029] The release film layer is a PE release film layer; the release film is coated with a low-silicon release agent; the high-temperature adhesive is a polyimide adhesive.

[0030] The preparation method of the high-temperature adhesive layer comprises the following steps: uniformly mixing 1 kg of PTFE resin, 0.1 g of polyethylene resin, 0.2 kg of hydroxyl-terminated methyl vinyl fluorosilane, and 0.01 kg of azobisisobutyronitrile to obtain a mixed mater...

Embodiment 2

[0034] The PTFE composite barrier film for LCP high-temperature lamination is characterized in that it includes the first release film layer, the first adhesive layer, the high-temperature resistance layer, the second adhesive layer, and the second release film layer from top to bottom. type film layer; the first adhesive layer and the second adhesive layer are independently formed of high-temperature adhesive; the high-temperature adhesive layer is PTFE / PE / hydroxyl-terminated methyl vinyl fluorosilicone blend film layer.

[0035] The release film layer is a PET release film layer; the release film is coated with a low-silicon release agent; the high-temperature adhesive is a polybenzimidazole adhesive.

[0036] The preparation method of the high-temperature adhesive layer comprises the following steps: uniformly mixing 1 kg of PTFE resin, 0.1 kg of polyethylene resin, 0.23 kg of hydroxyl-terminated methyl vinyl fluorosilane, and 0.012 kg of azobisisoheptanonitrile to obtain a...

Embodiment 3

[0040] The PTFE composite barrier film for LCP high-temperature lamination is characterized in that it includes the first release film layer, the first adhesive layer, the high-temperature resistance layer, the second adhesive layer, and the second release film layer from top to bottom. type film layer; the first adhesive layer and the second adhesive layer are independently formed of high-temperature adhesive; the high-temperature adhesive layer is PTFE / PE / hydroxyl-terminated methyl vinyl fluorosilicone blend film layer.

[0041] The release film layer is an OPP release film layer; the release film is coated with a low-silicon release agent; the high-temperature adhesive is a silicone adhesive.

[0042] The preparation method of the high-temperature adhesive layer comprises the following steps: uniformly mixing 1 kg of PTFE resin, 0.1 kg of polyethylene resin, 0.25 kg of hydroxyl-terminated methyl vinyl fluorosilane, and 0.015 kg of azobisisobutyronitrile to obtain a mixed m...

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PUM

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Abstract

The invention discloses a PTFE composite adhesive-resistant film for LCP high-temperature lamination, which is characterized in that it comprises a first release film layer, a first adhesive layer, a high-temperature adhesive layer, and a second adhesive layer from top to bottom. , the second release film layer; the first adhesive layer and the second adhesive layer are independently formed of high-temperature adhesive; the high-temperature adhesive layer is PTFE / PE / hydroxyl-terminated methyl vinyl fluoride Silicone oil blend film layer. The invention also provides the production process of the PTFE composite adhesive barrier film used for LCP high-temperature lamination. The PTFE composite glue-resistance film used for LCP high-temperature lamination disclosed by the invention has remarkable release and glue-resistance effects, excellent mechanical properties, long service life and good high-temperature resistance.

Description

technical field [0001] The invention relates to the technical field of membrane materials, in particular to a PTFE composite adhesive barrier film used for LCP high-temperature lamination and a production process thereof. Background technique [0002] With the rapid development of information technology, in order to meet the needs of high-frequency and high-speed signal transmission, rapid heat dissipation and heat conduction, and minimize production costs, the design and application of various forms of mixed-pressure multilayer boards are in the ascendant. Especially in recent years, 5G technology has entered the era of millimeter waves, and 5G materials represented by liquid crystal polymer LCP materials have entered people's sight. Due to their good high-frequency characteristics and physical properties, these materials have low moisture absorption. , not easy to denature, stable dielectric constant and high-frequency performance, suitable as packaging material and substr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/24C09J7/25C09J7/40
CPCC09J2203/326C09J2423/046C09J2427/006C09J2483/006C09J7/243C09J7/245C09J7/25C09J7/40C09J2301/124
Inventor 夏超华
Owner 苏州市新广益电子股份有限公司
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