Heat dissipation glass with low melting point and high infrared emissivity, and preparation method thereof

A technology of infrared emissivity and low melting point, applied in glass manufacturing equipment, glass furnace equipment, manufacturing tools, etc., can solve the problems of low thermal conductivity and counteraction, and achieve low melting point, lower melting temperature, and simple and easy process. Effect

Active Publication Date: 2020-03-31
XIANGTAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Another example is the heat dissipation glass disclosed by CN206337176U, which is to fill a layer of gel in the glass plate interlayer, and through the physical characteristics of the low thermal conductivity of the airgel, the glass layer has a heat insulation effect, so this kind of glass is precisely heat insulation glass , but if our product needs to release the internal heat, this kind of glass plate will have the opposite effect and play a role of heat preservation, so this kind of glass interlayer has certain limitations

Method used

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  • Heat dissipation glass with low melting point and high infrared emissivity, and preparation method thereof
  • Heat dissipation glass with low melting point and high infrared emissivity, and preparation method thereof
  • Heat dissipation glass with low melting point and high infrared emissivity, and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The glass sample of the present embodiment, by mole percentage, comprises following components:

[0035]

[0036] (1) Take each required composition raw material respectively by molar percentage;

[0037] (2) Grind and mix the raw materials in an agate mortar, put them into a corundum crucible, and calcine at 850°C for 30 minutes to completely melt the powder mixture. It is not necessary to carry out under the protection of the atmosphere when melting at high temperature. Can be carried out in the air;

[0038] (3) Pour the material in the molten state into the graphite mold preheated in advance in the muffle furnace, and perform stress relief annealing treatment at 300 ° C for 3 hours, and then cool to room temperature with the furnace;

[0039] (4) Take out the sample from the mold, then grind the sample into a disc glass with a radius of 30 mm and a thickness of 3 mm, and then polish it with a diamond micropowder solution until the surface of the block glass is m...

Embodiment 2

[0042] The glass sample of the present embodiment, by mole percentage, comprises following components:

[0043]

[0044] (1) Take each required composition raw material respectively by molar percentage;

[0045] (2) Grind and mix the raw materials in an agate mortar, put them into a corundum crucible, and calcine at 850°C for 30 minutes to completely melt the powder mixture. It is not necessary to carry out under the protection of the atmosphere when melting at high temperature. Can be carried out in the air;

[0046] (3) Pour the material in the molten state into the graphite mold preheated in advance in the muffle furnace, and perform stress relief annealing treatment at 300 ° C for 3 hours, and then cool to room temperature with the furnace;

[0047] (4) Take out the sample from the mold, then grind the sample into a disc glass with a radius of 30 mm and a thickness of 3 mm, and then polish it with a diamond micropowder solution until the surface of the block glass is m...

Embodiment 3

[0050] The glass sample of the present embodiment, by mole percentage, comprises following components:

[0051]

[0052] (1) Take each required composition raw material respectively by molar percentage;

[0053] (2) Grind and mix the raw materials in an agate mortar, put them into a corundum crucible, and calcine at 850°C for 30 minutes to completely melt the powder mixture. It is not necessary to carry out under the protection of the atmosphere when melting at high temperature. Can be carried out in the air;

[0054] (3) Pour the material in the molten state into the graphite mold preheated in advance in the muffle furnace, and perform stress relief annealing treatment at 300 ° C for 3 hours, and then cool to room temperature with the furnace;

[0055] (4) Take out the sample from the mold, then grind the sample into a disc glass with a radius of 30 mm and a thickness of 3 mm, and then polish it with a diamond micropowder solution until the surface of the block glass is m...

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Abstract

The invention discloses heat dissipation glass with low melting point and high infrared emissivity, wherein the heat dissipation glass comprises the following components in percentage by mole: 60 to 80 mol% of TeO2, 1 to 3 mol% of Al2O3, 10 to 20 mol% of ZnF2, 5 to 15 mol% of Na2CO3 and 1 to 5 mol% of V2O5. According to the invention, the infrared radiance of the obtained heat dissipation glass ata waveband of 8-14 [mu]m is more than 0.90, especially the infrared radiance of the heat dissipation glass is up to 0.965 when the molar doping amount of V2O5 reaches 3 mol%, the heat dissipation performance is good, and good visible light transmittance can be kept; and the melting point of the heat dissipation glass is low, the temperature in the melting process only needs 800-900 DEG C, the melting time is short, the whole process is carried out in the air atmosphere, and the process is simple and easy to implement.

Description

technical field [0001] The invention belongs to the technical field of heat-dissipating glass materials, and in particular relates to a heat-dissipating glass with a low melting point and high infrared emissivity and a preparation method thereof. Background technique [0002] Infrared radiation glass material is a new type of light-to-heat conversion material under the increasingly mature infrared radiation technology. This material has high infrared emissivity and light-to-heat conversion performance at room temperature. fields have been applied to varying degrees. [0003] At present, there are more and more opportunities for people to use electronic products, and with the increasing integration and thinning of electronic products, the heat dissipation space is greatly reduced, and the heat dissipation problem has become the first issue of electronic product safety. If a large amount of heat generated by electronic products cannot be dissipated during operation, it will a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C3/23C03C4/00C03B5/16
CPCC03C3/23C03C4/00C03B5/16
Inventor 徐昌富郑诚张振杨利兵孙立忠
Owner XIANGTAN UNIV
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