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Resin-based composite material with low dielectric loss, and preparation method and application thereof

A composite material and resin-based technology, which is applied in the field of low dielectric loss resin-based composite materials and its preparation, can solve the problem of high dielectric loss, and achieve the effects of easy processing and molding, recycling and recycling.

Active Publication Date: 2020-02-21
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The object of the present invention is to provide a resin-based composite material with low dielectric loss and its preparation method and application, so as to solve the above-mentioned technical problem of high dielectric loss of the existing resin-based composite material

Method used

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  • Resin-based composite material with low dielectric loss, and preparation method and application thereof
  • Resin-based composite material with low dielectric loss, and preparation method and application thereof
  • Resin-based composite material with low dielectric loss, and preparation method and application thereof

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preparation example Construction

[0044] A method for preparing a low dielectric loss resin-based composite material according to an embodiment of the present invention, the specific steps include:

[0045] (1) Prepare the isocyanate-terminated prepolymer of nitrogen-containing coordinated cyclic borate, including:

[0046] Using aryl boronic acid compounds and nitrogen-containing ortho-hydroxy compounds with active hydrogen at the end group to react at room temperature, and then obtaining nitrogen-coordinated cyclic borate compounds containing active hydrogen after vacuum distillation and extraction;

[0047] A nitrogen-coordinated cyclic borate compound containing active hydrogen is reacted with an isocyanate compound to obtain a nitrogen-coordinated cyclic borate-terminated isocyanate prepolymer.

[0048] (2) The terminal isocyanate prepolymer of the nitrogen-containing coordination cyclic borate prepared in step (1) is used for crosslinking polystyrene, phenolic resin, epoxy resin or benzoxazine resin cont...

Embodiment 1

[0072] A method for preparing a low dielectric loss resin-based composite material according to an embodiment of the present invention, the specific steps include:

[0073] (1) Preparation of NCBU prepolymer: use arylboronic acid and triethanolamine (molar ratio is 1:1) to react at room temperature for 8h, and then obtain the active hydrogen (located at the end of the amino group and Hydrogen on the hydroxyl) nitrogen-coordinated cyclic borate compound;

[0074] Secondly, according to the molar ratio of the isocyanate group in the isocyanate compound to the amino group and the hydroxyl group in the nitrogen-coordinated cyclic borate compound is 1.5:1, weigh the measured nitrogen-coordinated cyclic borate compound and dissolve it in In anhydrous DMF, heat and stir at 90°C for 1 hour until completely dissolved; weigh a certain amount of diphenylmethane diisocyanate into a three-necked flask filled with anhydrous DMF, pass through nitrogen, and place in an oil bath at 50°C Heat ...

Embodiment 2

[0079] A method for preparing a low dielectric loss resin-based composite material according to an embodiment of the present invention, the specific steps include:

[0080] (1) Preparation of NCBU prepolymer: 4,4'-biphenyl diboronic acid and diethanolamine (1:1 molar ratio) were used to react at room temperature for 8 hours, and then obtained by vacuum distillation and extraction containing active hydrogen (Hydrogen on the amino group and hydroxyl at the terminal) nitrogen-coordinated cyclic borate compound; secondly, according to the isocyanate group in the isocyanate compound and the amino group and hydroxyl group in the nitrogen-coordinated cyclic borate compound The molar ratio is 1.2:1. Weigh and measure the nitrogen-coordinated cyclic borate ester compound and dissolve it in anhydrous DMF, heat and stir at 90°C for 1h until completely dissolved; weigh a certain amount of isophorone di Add isocyanate into a three-necked flask filled with anhydrous DMF, blow nitrogen into ...

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Abstract

The invention discloses a resin-based composite material with low dielectric loss, and a preparation method and an application thereof. The preparation method comprises the following steps: subjectingan arylboronic acid compound and a nitrogen-containing o-hydroxy compound with terminated active hydrogen to a reaction at a room temperature, and performing reduced pressure distillation and extraction so as to obtain a nitrogen-coordinated cyclic borate compound containing active hydrogen; subjecting the nitrogen-coordinated cyclic borate compound containing active hydrogen and an isocyanate compound to a reaction so as to obtain an isocyanate-terminated prepolymer containing nitrogen-coordinated cyclic borate; and allowing the prepared isocyanate-terminated prepolymer containing nitrogen coordinated cyclic borate to crosslink with polystyrene, phenolic resin, epoxy resin or benzoxazine resin containing a hydroxyl structural unit so as to prepare the resin-based composite material withlow dielectric loss. The resin-based composite material provided by the invention has low dielectric loss, can realize cyclic recovery and reutilization, and can greatly reduce environmental pollutionand resource waste.

Description

technical field [0001] The invention belongs to the technical field of new materials, and in particular relates to a resin-based composite material with low dielectric loss and its preparation method and application. Background technique [0002] With the wide application of high-performance ultra-large-scale integrated circuits, the electrical and electronic industry is gradually developing towards integration, miniaturization, high power and high reliability. The arrival of the fifth-generation mobile communication network has made the printed circuit boards of communication products more and more complex, and put forward higher requirements for dielectric materials for copper clad laminates, such as lower dielectric constant, dielectric loss and thermal expansion coefficient, better mechanical properties and high temperature resistance. [0003] Dielectric materials are usually divided into two categories: organic and inorganic. Traditional dielectric materials are mainl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L25/14C08L61/06C08L63/00C08L61/34C08K5/55C08J3/24
CPCC08J3/24C08K5/55C08L25/14C08L61/06C08L63/00C08L61/34
Inventor 王淑娟井新利张晓婷王斌蒋子康
Owner XI AN JIAOTONG UNIV
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