Diffusion connection method for Al2O3/Ti with biocompatibility
A technology of biocompatibility and diffusion connection, which is applied in the field of Al2O3/Ti diffusion connection, can solve the problems of difficult processing, unfavorable air tightness and strength of connection joints, etc., so as to improve joint reliability, air tightness and strength, The effect of a reliable connection
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Embodiment 1
[0027] A biocompatible Al of the present invention 2 o 3 / Ti diffusion connection method, specifically follow the steps below:
[0028] S1. Pre-treatment of the base metal: using internal circular cutting machine and wire cutting machine to cut Al 2 o 3 Ceramic and metal Ti were cut into 5mm×5mm×3mm and 10mm×8mm×3mm substrates respectively, and then the Al 2 o 3 The ceramic substrate and metal Ti substrate were ground and polished with diamond sand table (600#~1500#) and SiC water sandpaper (600#~3000#) respectively, and the polished sample was ultrasonically cleaned 3 times in acetone solution , 15min each time;
[0029] S2, Al 2 o 3 Ceramic surface metallization treatment: the Al after step S1 treatment 2 o 3 The ceramic substrate is placed in a magnetron sputtering device for metallization, and a thin layer of Pd is deposited by sputtering. The magnetron sputtering power is 100W, the sputtering time is 60min, and the thickness of the Pd metal thin layer is 40μm;
...
Embodiment 2
[0035] A biocompatible Al 2 o 3 / Ti diffusion connection method, specifically follow the steps below:
[0036] S1. Pre-treatment of the base metal: using internal circular cutting machine and wire cutting machine to cut Al 2 o 3 Ceramic and metal Ti were cut into 5mm×5mm×3mm and 10mm×8mm×3mm substrates respectively, and then the Al 2 o 3 The ceramic substrate and metal Ti substrate were ground and polished with diamond sand table (600#~1500#) and SiC water sandpaper (600#~3000#) respectively, and the polished sample was ultrasonically cleaned 3 times in acetone solution , 15min each time;
[0037] S2, Al 2 o 3 Ceramic surface metallization treatment: the Al after step S1 treatment 2 o 3 Ceramics are placed in magnetron sputtering equipment for metallization, and a thin layer of Pd is deposited by sputtering. The magnetron sputtering power is 100W, the sputtering time is 90min, and the thickness of the Pd metal thin layer is 50μm;
[0038] S3. Metallization treatment on...
Embodiment 3
[0043] A biocompatible Al 2 o 3 / Ti diffusion connection method, specifically follow the steps below:
[0044] S1. Pre-treatment of the base metal: using internal circular cutting machine and wire cutting machine to cut Al 2 o 3 Ceramic and metal Ti were cut into 5mm×5mm×3mm and 10mm×8mm×3mm substrates respectively, and then the Al 2 o 3 The ceramic substrate and metal Ti substrate were ground and polished with diamond sand table (600#~1500#) and SiC water sandpaper (600#~3000#) respectively, and the polished sample was ultrasonically cleaned once in acetone solution. , 3 minutes each time;
[0045] S2, Al 2 o 3 Ceramic surface metallization treatment: the Al after step S1 treatment 2 o 3 The ceramic substrate is placed in a magnetron sputtering device for metallization, and a thin layer of Pd is deposited by sputtering. The magnetron sputtering power is 30W, the sputtering time is 150min, and the thickness of the Pd metal thin layer is 150μm;
[0046] S3. Metallizat...
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