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Electrolytic rhodium plating solution

A technique for electroplating solution and electrolysis of rhodium, which is applied in the field of electrolytic rhodium electroplating solution and can solve problems such as peeling off of substrates, cracks, etc.

Active Publication Date: 2019-11-22
EEJA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, as the rhodium plating film becomes thicker, it is considered that the internal stress causes peeling from the base material and the problem of cracking.

Method used

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  • Electrolytic rhodium plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] Use rhodium (as rhodium sulfate) concentration and phosphorus concentration (as sodium phosphite) to be the electrolytic rhodium electroplating solution (sulfuric acid 40mL / L, pH=0.6, bath temperature 60 ℃) of the number 01~06 in the left column of Table 1, in 20mm×20mm copper test piece, with 4A / dm 2 Electroplate at a current density to a thickness of 0.10 μm.

[0065] The appearances of the obtained rhodium-phosphorus electroplating test pieces were all in a silver-white amorphous state. With the rhodium-phosphorus electroplating test piece as the anode and the copper test piece of 40mm × 20mm as the cathode, apply a low voltage of 0.74V, measure the porosity in 5% sulfuric acid solution for 20 minutes, and obtain the results in the right column of Table 1. In addition, the porosity when a test piece not subjected to rhodium-phosphorus plating was used as an anode was defined as 100%.

[0066] [Table 1]

[0067]

[0068] From these results, it can be seen that i...

Embodiment 2

[0073] Then, use the electrolytic rhodium electroplating solution (pH =0.6, bath temperature 60°C), for a 20mm×20mm copper test piece, 4A / dm 2 current density, electroplating to a thickness of 0.10 μm.

[0074] [Table 2]

[0075]

[0076] From these results, it can be seen that when the concentration of rhodium (rhodium phosphate) is 4.0 g / L, the porosity becomes extremely low when the ratio of phosphorus concentration (potassium phosphite) to rhodium metal is 1 / 100 or more. In addition, when the phosphorus concentration was increased to 9.5 g / L, the porosity was 10% or less.

Embodiment 3

[0080] Use the electrolytic nickel plating solution of nickel sulfate 200g / L, sodium chloride salt 15g / L and phosphoric acid 0.15mL / L to electroplate 8μm on a 20mm×20mm copper test piece. Gold strike plating was performed on the surface of the nickel film, and its scanning electron microscope image (30,000 times) was displayed on figure 1 . It can be seen that the surface morphology of the nickel film emphatically contrasted by the gold strike plating forms an undulating pattern.

[0081] Afterwards, on the nickel film, a rhodium-phosphorus strike bath (strike bath) of 1 g / L with rhodium (as rhodium sulfate) and a phosphorus concentration (as calcium phosphite) of 1 g / L was used to implement 10V×10 seconds. After rhodium phosphorus impact plating, rhodium (as rhodium sulfate) concentration is 4.0g / L, sulfuric acid is 50mL / L, with 4A / dm 2 The current density is high, and the pure rhodium film is electroplated to a thickness of 0.5 μm.

[0082] Then, for the test piece of el...

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Abstract

In order to addresses the problem regarding generation of cracks and detachment from a substrate due to internal stress associated with an increase in the thickness of a conventional rhodium plating film, the present invention provides a rhodium plating solution from which a dense amorphous rhodium-phosphorus plating film is obtained. This electrolytic rhodium plating solution is characterized bycontaining 1-20 g / L of metal rhodium (in the form of a sulfate or a phosphate), 10-100 mL / L of sulfuric acid or phosphoric acid, and 0.001-10 g / L of at least one compound selected from the group consisting of phosphorous acid, alkali metal salts of phosphorous acid, alkaline-earth metal salts of phosphorous acid, or ammonium salts of phosphorous acid.

Description

technical field [0001] The present invention relates to an electrolytic rhodium electroplating solution, and more particularly to an electrolytic rhodium electroplating solution forming an amorphous structure of rhodium-phosphorus. Background technique [0002] Rhodium metal is widely used in optical parts such as mirrors because of its excellent reflectivity. Furthermore, rhodium metal is used in the industrial field due to its excellent properties such as high hardness, high wear resistance, low contact resistance, oxidation resistance in air, and stability against sparks due to its high melting point. . In addition, rhodium metal is among the platinum group metals, and its chemical properties are extremely stable, even aqua regia cannot dissolve it. In addition, rhodium metal has the best reflectivity among platinum group metals, and its color tone also has a beautiful white luster. The Vickers hardness of the precipitate is as high as 800 to 1,000 Hv, and it exhibits e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/56
CPCC25D3/56C25D3/567C25D3/50
Inventor 片仓宏治菊池理惠
Owner EEJA LTD
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