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Cutting adhesive tape for processing semiconductor materials, and preparation method thereof

A technology for material processing and cutting tape, which is applied in semiconductor/solid-state device manufacturing, adhesives, adhesive types, etc., and can solve problems such as poor high temperature resistance, high energy consumption, and poor water resistance.

Active Publication Date: 2019-09-06
广东硕成科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Many common protective tapes on the market (such as those used for the surface of aluminum windows, stainless steel, and plastic shells) are mostly made of emulsion-type PSA; however, emulsion-type PSA has poor high temperature resistance, poor water resistance, and high energy consumption. Disadvantages, and this type of product has residual glue after being peeled off by heat, so solvent-based PSA is still preferred for protective tape in some special fields (such as flexible circuit boards, lithium batteries and chip protection, etc.)

Method used

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Effect test

preparation example Construction

[0041] A second aspect of the present invention provides a method for preparing the dicing tape for processing semiconductor materials, comprising the steps of:

[0042] (1) Stir the first component, the second component, the solvent, and the A component of the initiator in the alkenoic substances according to parts by weight to obtain the substance I;

[0043] (2) Vacuumize the polyisocyanate, the third component of the alkene acid and the catalyst until there are no bubbles; then place the mixture in a reactor at 75-85°C and react for 5-10 hours; the substance II is obtained;

[0044] (3) Mix substance I, substance II, crosslinking agent, heat-expandable microspheres, and initiator B, and stir evenly to obtain an adhesive composition;

[0045] (4) Coating the adhesive composition on the surface of the substrate, drying at 70-120° C. for 2-8 minutes.

[0046] Preferably, the preparation method of the dicing tape for processing semiconductor materials comprises the following ...

Embodiment 1

[0052] Embodiment 1 of the present invention provides a dicing tape for semiconductor material processing, including a base material layer and an adhesive layer. The raw materials for the preparation of the adhesive layer include 90 parts of olefinic acid substances, 4.5 parts of crosslinking agent; 0.055 parts of initiator Agent, 40 parts of polyisocyanate, 100 parts of solvent, 10 parts of expanded microspheres;

[0053] Acrylic substances include the first component, the second component, and the third component, and the weight ratio of the first component, the second component, and the third component is 3.5:1:2;

[0054] The first component is 3-ethoxy ethyl acrylate and 4-methyl-4-pentenoic acid, the weight ratio of 3-ethoxy ethyl acrylate to 4-methyl-4-pentenoic acid is 1: 1;

[0055] The second component is tert-butyl 3-hydroxy-4-pentenoate;

[0056] The third component of the acrylic acid substance is hydroxyethyl acrylate and hydroxyethyl methacrylate, and the weig...

Embodiment 2

[0071] Embodiment 2 of the present invention provides a dicing tape for semiconductor material processing, including a base material layer and an adhesive layer. The raw materials for the preparation of the adhesive layer include 100 parts of olefinic acid substances, 10 parts of crosslinking agent; 0.1 part of initiator Agent, 50 parts of polyisocyanate, 120 parts of solvent, 15 parts of expanded microspheres;

[0072] Acrylic substances include the first component, the second component, and the third component, and the weight ratio of the first component, the second component, and the third component is 5:1:3;

[0073] The first component is 3-ethoxy ethyl acrylate and 4-methyl-4-pentenoic acid, and the weight ratio of 3-ethoxy ethyl acrylate to 4-methyl-4-pentenoic acid is 1.5: 1;

[0074] The second component is tert-butyl 3-hydroxy-4-pentenoate;

[0075] The third component of the acrylic acid substance is hydroxyethyl acrylate and hydroxyethyl methacrylate, and the wei...

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PUM

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Abstract

The present invention relates to the field of adhesive tapes, and concretely relates to a cutting adhesive tape for processing semiconductor materials, and a preparation method thereof. The adhesive tape for processing semiconductor materials comprises a substrate layer and an adhesive layer, and raw materials for preparing the adhesive layer comprise 80-100 parts of an olefinic acid substance, 0.1-10 parts of a crosslinking agent, 0.05-0.1 part of an initiator, 30-50 parts of polyisocyanate, 80-120 parts of a solvent and 5-15 parts of expanded microspheres.

Description

technical field [0001] The invention relates to the field of tapes, and more specifically, the invention relates to a dicing tape for semiconductor material processing and a preparation method thereof. Background technique [0002] In recent years, in the printing and baking of circuit boards, and the assembly process of various smartphones and tablets, semiconductor components and electronic components have become smaller and smaller, and the devices have become very fragile, so ultra-thin and fragile parts ( Such as chips, etc.) processing and transportation are becoming more and more difficult. How to temporarily fix and protect these fragile tiny devices so that they will not be polluted and damaged during processing and transportation, and can be easily removed after processing has become one of the important topics with industrial application value. Emulsion-type PSA (pressure-sensitive adhesive) has the advantages of safe use, low price and environmental protection, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/24C09J7/30C09J175/04H01L21/683
CPCC09J175/04C09J2203/326C09J2427/006C09J7/245C09J7/30C09J2301/122C09J2301/412H01L21/6836
Inventor 柯跃虎曾庆明诸葛锋宋亦健
Owner 广东硕成科技股份有限公司
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