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Thermal barrier/high-temperature low infrared emissivity integrated coating, metal composite material with coating and preparation method thereof

A metal composite material, low infrared emission technology, applied in coating, metal material coating process, melt spraying and other directions, can solve the problem of high thermal barrier coating emissivity, achieve high thermal expansion coefficient, improve temperature resistance and High temperature thermal shock performance, effect of delaying coating failure

Active Publication Date: 2019-08-13
NAT UNIV OF DEFENSE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the continuous improvement of the thrust-to-weight ratio of aero-engines, coating TBCs on the surface of metal alloy substrates is one of the main means to quickly and effectively improve the high-temperature resistance of metal alloy substrates, and has excellent applicability to metal substrates. The emissivity of the lower thermal barrier coating is relatively high (0.35~0.5)

Method used

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  • Thermal barrier/high-temperature low infrared emissivity integrated coating, metal composite material with coating and preparation method thereof
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  • Thermal barrier/high-temperature low infrared emissivity integrated coating, metal composite material with coating and preparation method thereof

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Embodiment 1

[0053] Such as figure 1 As shown, a thermal barrier / high temperature low infrared emissivity integrated coating, the coating is a multi-layer superimposed structure, including CoNiCrAlY metal bonding layer, SmMgAl 11 o 19 Thermal barrier ceramic layer and low infrared emissivity layer. Among them, the low infrared emissivity layer is made of Bi 2 o 3 -Sm 2 o 3 -MgO-Al 2 o 3 -Li 2 O-SiO 2 Glass is the binding phase, and Pd powder is used as the conductive phase, and the Pd powder accounts for 82% of the total mass of the low infrared emissivity layer.

[0054] The thickness of the above-mentioned CoNiCrAlY metal bonding layer is 0.08mm, SmMgAl 11 o 19 The thickness of the thermal barrier ceramic layer is 0.35mm, the thickness of the low infrared emissivity layer is 0.025mm, and the total thickness of the coating is 0.455mm.

[0055] The coated metal composite material in this embodiment includes a high-temperature nickel-based alloy substrate and the above-mentioned...

Embodiment 2

[0069] A thermal barrier / high temperature low infrared emissivity integrated coating, the thermal barrier / high temperature low infrared emissivity integrated coating is a multi-layer superimposed structure, including CoNiCrAlY metal bonding layer, SmMgAl 11 o 19 Thermal barrier ceramic layer and low infrared emissivity layer. Among them, the low infrared emissivity layer is made of Bi 2 o 3 -Sm 2 o 3 -MgO-Al 2 o 3 -Li 2 O-SiO 2 Glass is the binding phase, and Pd powder is used as the conductive phase, and the Pd powder accounts for 82% of the total mass of the low infrared emissivity layer.

[0070] The thickness of the above-mentioned CoNiCrAlY metal bonding layer is 0.05mm, SmMgAl 11 o 19 The thickness of the thermal barrier ceramic layer is 0.08mm, the thickness of the low infrared emissivity layer is 0.02mm, and the total thickness of the coating is 0.15mm.

[0071] The coated metal composite material in this embodiment includes a high-temperature nickel-based a...

Embodiment 3

[0085] A thermal barrier / high temperature and low infrared emissivity integrated coating, the thermal barrier / high temperature and low infrared emissivity integrated coating is a multi-layer superimposed structure, including CoNiCrAlY metal bonding layer, NdMgAl 11 o 19 Thermal barrier ceramic layer and low infrared emissivity layer. Among them, the low infrared emissivity layer is made of Bi 2 o 3 -Nd 2 o 3 -MgO-Al 2 o 3 -Li 2 O-SiO 2 Glass is the bonding phase, and Pd powder is used as the conductive phase, and the Pd powder accounts for 80% of the total mass of the low infrared emissivity layer.

[0086] The thickness of the above CoNiCrAlY metal bonding layer is 0.08mm, NdMgAl 11 o 19 The thickness of the thermal barrier ceramic layer is 0.25mm, the thickness of the low infrared emissivity layer is 0.02mm, and the total thickness of the coating is 0.35mm.

[0087] The coated metal composite material in this embodiment includes a high-temperature nickel-based all...

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Abstract

The invention discloses a thermal barrier / high-temperature low infrared emissivity integrated coating. The coating is of a multilayer stacked structure. The multilayer stacked structure successively comprises a metal bonding layer, a thermal barrier ceramic layer and a low infrared emissivity layer from inside to outside. The thermal barrier ceramic layer is a rare earth hexaaluminate layer, and the low infrared emissivity layer is a Bi2O3-MgO-Al2O3-Li2O-SiO2 serial glass coating containing a conductive phase Pd powder. The integrated coating has the advantages of heat-insulating property, high-temperature low infrared emissivity, high bonding strength and the like. The metal composite material with the coating is simple and manure in process, relatively low in cost and easy for scaled production and application.

Description

technical field [0001] The invention belongs to the field of functional coatings and composite materials thereof, in particular to a composite coating, a coated metal composite material and a preparation method thereof. Background technique [0002] To reduce the surface temperature and emissivity of the target by cooling, cooling, shading or reducing the emissivity, so as to change the infrared radiation characteristics of the target, are two important technical ways to achieve infrared stealth. Among them, the low infrared emissivity coating is to use the surface coating technology to coat the coating material with low infrared emissivity characteristics on the high temperature part of the aircraft to reduce its surface emissivity. It has become a simple and effective way to improve the infrared stealth performance of aircraft. Convenient and effective technical means. Currently commonly used low-infrared emissivity materials mainly include noble metal coatings and inorga...

Claims

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Application Information

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IPC IPC(8): C23C4/134C23C4/11C23C4/02C23C4/073
CPCC23C4/02C23C4/073C23C4/11C23C4/134
Inventor 黄文质刘海韬甘霞云黄丽华
Owner NAT UNIV OF DEFENSE TECH
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