Flame-retardant resin composition and prepreg and laminate prepared using same

Abstract

The invention discloses a flame-retardant resin composition, which comprises the following components by solid weight: 100 parts by weight of a modified bismaleimide prepolymer; 5-30 parts of epoxy resin; 0-20 parts of a curing agent, 0-150 parts of a filler; 0.001-5 parts of a curing accelerator; wherein the modified bismaleimide prepolymer is at least prepolymerized by bismaleimide resin and anamine compound. Compared with the prior art, a DOPO or DPPO-containing amine compound reacts not only with the bismaleimide, but also with the active hydrogen of -NH- in the structure reacts and the epoxy group, so that a small amount of epoxy resin and the curing agent are added to obtain a final cured product having high heat resistance and high modulus, the high-performance print circuit boardrequirements such as HDI multilayer substrates and ultra-thin package substrates can be satisfied, and a small amount of epoxy resin and the curing agent can be added to further improve the adhesion of the resin composition and enhances the anti-stripping intensity of a copper-clad board.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a flame-retardant resin composition and a prepreg and a laminate prepared by using the same. Background technique [0002] In recent years, with the continuous development of mobile Internet technology, multi-functionality, portability, and thinness have continuously become the pursuit goals of electronic products, which means that more components are loaded in electronic products, and more printed circuits use high-density interconnection. Technology (HDI) and the thickness of the printed circuit board is thinner. Therefore, higher requirements are put forward for the base material of the printed circuit board-copper clad laminate, and it is required to have the performance similar to the package substrate, which is the rising trend in the industry. Class packaging materials require copper clad laminates to have high heat resistance, high glass transition temperatur...

AI Technical Summary

Problems solved by technology

[0006] For example, the patent CN102276837A discloses the technical scheme of adding phosphorus-containing compounds (phosphazenes) to the double-horse resin system. Although it is possible to obtain cured products that do not contain halogens and have good flame-retardant properties, these flame-retardants do not have It forms a better cross-linked network structure with the bismaleimide resin system. Under the high temperature curing conditions (often higher than 200°C) of the bismaleimide resin, the unreacted phosphazenes are similar to "sweating". The way of floating on the surface of the substrate not only affects the heat resistance of the sheet, but also affects the bonding force between the sheet and the copper foil

[0007] For example, the patent JP2012153896 discloses the technical solution of adding phosphorus-containing epoxy resin to the double-horse resin system. This technical solution can also meet the requirements of halogen-free flame retardancy, but due to the existence of epoxy resin, the vitrification of the resin is greatly reduced. Transition temperature, heat resistance and modulus retention at high temperature

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