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Copper-based active solder for brazing diamond grinding tools

A technology of active solder and grinding tools, which is applied in the direction of manufacturing tools, metal processing equipment, welding/cutting media/materials, etc., can solve the problems of poor wear resistance diamond matching, high solder temperature, etc., and achieve wettability Good, high holding force, simple process effect

Inactive Publication Date: 2019-03-15
ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problems of this type of Cu-Sn-Ti solder are: the temperature of the solder is still high, and the wear resistance and diamond matching are poor

Method used

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  • Copper-based active solder for brazing diamond grinding tools

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The copper-based active solder of the present embodiment is composed of the following percentages: the copper accounts for 52%, the tin accounts for 22%, the titanium accounts for 11%, and the nickel accounts for 8.5%. Said chromium accounts for 5%, and said phosphorus accounts for 1.5%.

[0029] The specific preparation method of copper-based active solder is as follows: put the raw materials prepared in proportion into the furnace, heat up to the melting of the alloy, add a covering agent, then add a refining degasser, and refine for 5 minutes to obtain an alloy melt. The poured model was roasted for 30 minutes at a temperature of 1000°C, cooled to 750°C for later use, and the resulting alloy melt was cooled to 800°C and then poured into the model, fully stirred, slag removed, cast into shape, demolded to obtain an ingot, and extruded Die-casting ingot: The preheating temperature is 520°C, the holding time is 20min, the die piece preheating time is 20min, the extrusio...

Embodiment 2

[0033] The copper-based active solder of the present embodiment is composed of the following percentages: the copper accounts for 52%, the tin accounts for 22%, the titanium accounts for 11%, and the nickel accounts for 8.5%. Said chromium accounts for 5%, and said phosphorus accounts for 1.5%.

[0034] The specific preparation method of copper-based active solder is as follows: put the proportioned raw materials into the furnace, raise the temperature until the alloy melts, add the covering agent, then add the refining degasser, and refine for 10 minutes to obtain the alloy melt, which will be The poured model was roasted for 40 minutes at a temperature of 1100°C, cooled to 800°C for later use, and the resulting alloy melt was cooled to 900°C and then poured into the model, fully stirred, slag removed, cast into shape, demolded to obtain an ingot, and extruded Die-casting ingot: preheating temperature is 550°C, holding time is 30min, die preheating time is 30min, extrusion sp...

Embodiment 3

[0037] The copper-based active solder of the present embodiment is composed of the following percentages: the copper accounts for 60%, the tin accounts for 20%, the titanium accounts for 8%, and the nickel accounts for 7%. The said chromium accounts for 4%, and the said phosphorus accounts for 1%.

[0038] The specific preparation method of copper-based active solder is as follows: put the raw materials prepared in proportion into the furnace, heat up to the melting of the alloy, add a covering agent, then add a refining degasser, and refine for 5 minutes to obtain an alloy melt. The poured model was roasted for 30 minutes at a temperature of 1100°C, cooled to 750°C for later use, and the resulting alloy melt was cooled to 800°C and then poured into the model, fully stirred, slag removed, cast into shape, demolded to obtain an ingot, and extruded Die-casting ingot: The preheating temperature is 550°C, the holding time is 30min, the die piece preheating time is 30min, the extru...

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Abstract

The invention relates to copper-based active solder for brazing diamond grinding tool. The copper-based active solder is prepared by adding active elements such as nickel, chromium and phosphorus in acopper-tin-titanium-based alloy. The active elements include, by weight, 52% to 68% of copper, 17% to 23% of tin, 5% to 11% of titanium, 5% to 9% of nickel, 3% to 5% of chromium, and 0.5% to 1.5% ofphosphorus. The obtained active solder has the characteristics of low brazing temperature, good wettability, high caulking capacity and high wear resistance. Under the action that nickel has a solid solution strengthening effect and chromium is made from carbide, a diamond and a matrix can form a solid metallurgical bond, so that the holding force of the diamond is enhanced. The joint shearing strength of graphite / 45# steel brazed by using the active solder can reach 360 MPa. The addition of phosphorus makes the melting point lower, and the obtained solder can obtain a complete liquid phase at760 DEG C.

Description

technical field [0001] The invention relates to a copper-based active solder used for brazing diamond grinding tools. Background technique [0002] Diamond grinding tools are delicate, pollution-free, low-noise, low-vibration, and narrow-cut tools used in the precision electronics industry. Brazing filler metals for diamond grinding tools require low brazing temperature, high bonding force, and a wide range of active temperatures. [0003] There is no firm metallurgical bond between the substrate and the diamond bonding surface of traditional diamond abrasive tools, and the holding force is not strong. In high-efficiency grinding operations with heavy loads, it is easy to cause the diamond abrasive grains to fall off or the coating to flake off and the overall failure. Diamond has been carbonized at 800°C in the air, which seriously affects the performance of diamond. Therefore, a solder for brazing that can form a firm metallurgical bond between diamond and substrate at a t...

Claims

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Application Information

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IPC IPC(8): B23K35/30
CPCB23K35/0222B23K35/302
Inventor 龙伟民赵月钟素娟纠永涛宋克兴吴铭方刘建秀李和鑫
Owner ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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