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Transparent conductive substrate and its preparation method and application

A technology of transparent conductive and transparent substrates, applied in cable/conductor manufacturing, conductive layers on insulating carriers, circuits, etc., can solve the problems of complex operation, low yield, inconsistent product quality, etc., and achieve high transparency and electrical conductivity. Consistent, transparent effects

Active Publication Date: 2020-06-05
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the problems of inconsistent product quality, complex operation and low yield rate in the mass production of transparent conductive substrates in the prior art, and to provide transparent conductive substrates and their preparation methods and applications, which are easy to control The thickness of the conductive layer, the preparation method is simple, and a large-area transparent conductive substrate with controllable conductivity can be quickly prepared, and the prepared transparent conductive substrate has stable transparency and conductivity, high transparency, and high yield

Method used

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  • Transparent conductive substrate and its preparation method and application
  • Transparent conductive substrate and its preparation method and application
  • Transparent conductive substrate and its preparation method and application

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preparation example Construction

[0039] The first aspect of the present invention provides a method for preparing a transparent conductive substrate, such as figure 1 As shown, wherein, the method includes the following steps:

[0040] (A) uniformly coating the dispersion liquid containing the nano metal on the surface of the transparent substrate 1, and pre-drying to obtain the substrate 2 coated with the nano metal coating;

[0041] (B) Exposing the substrate 2 coated with the nano-metal coating to ultraviolet light to form a light-cured stereotyped conductive grid 3 containing the nano-metal with a grid line width ≤ 20 μm, and then cleaning, developing, and heating, A transparent conductive substrate 4 is obtained;

[0042] The nanometer metal is an ultraviolet light sensitive substance.

[0043] According to the method of the present invention, the grid line width refers to the characteristic width of the projected grid formed by ultraviolet light exposure, that is, the characteristic width of the proje...

Embodiment 1

[0074] (1) The dispersion liquid (60 weight parts of nano-silver particles, 8 weight parts of 4-hydroxybutyl acrylate (4-HBA) , 1 weight part of hyperbranched acrylic resin, isopropyl sulfide 0.4 parts by weight of xanthone (ITX), 30 parts by weight of ethylene glycol methyl ether, 0.4 parts by weight of leveling agent BYK 333, and 0.2 parts by weight of film-forming agent ethylene glycol phenyl ether) are evenly coated on the Polyethylene terephthalate (PET) film ( figure 1 Mark 1) in the surface, the coating thickness is 2 μm, and pre-dried at 50 ° C for 18 minutes to obtain a substrate coated with a nano-metal coating ( figure 1 Mark 2).

[0075] (2) the base material ( figure 1 Mark 2) to perform ultraviolet light exposure treatment to form a light-cured stereotyped conductive grid containing the nanometer metal with a grid line width of 6 μm, a horizontal grid line spacing of 120 μm, and a longitudinal grid line spacing of 120 μm ( figure 1 Mark 3). Rinse developed ex...

Embodiment 2

[0080] (1) Dispersion liquid (50 weight parts of nano-silver particles, 1 weight part of acryloyl morpholine (ACMO), 4 weight parts of polyester acrylate, 2,4,6-trimethyl 0.25 parts by weight of benzoyl-diphenylphosphine oxide (TPO), 43.75 parts by weight of propylene glycol ethyl ether, 0.2 parts by weight of leveling agent BYK333, 0.3 parts by weight of film-forming agent propylene glycol phenyl ether, and 0.5 parts by weight of adhesion promoter BYK4510 ) was uniformly coated on the glass surface by spraying method, the coating thickness was 4 μm, and pre-dried at 80° C. for 12 minutes to obtain a substrate coated with nano-silver coating.

[0081] (2) The base material coated with the nano-silver coating is subjected to ultraviolet light exposure treatment to form a grid line width of 3 μm, a horizontal grid line spacing of 150 μm, and a vertical grid line spacing of 150 μm containing the nano-metal. Light-cured shaped conductive mesh. Rinse and develop exposed transparen...

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Abstract

The present invention discloses a transparent conductive substrate and a preparation method thereof, and applications, pertaining to the field of transparent conductive materials. The preparation method of the transparent conductive substrate comprises the following steps: (A) uniformly coating a dispersion liquid containing nano-metal on the surface of a transparent conductive substrate (1), performing pre-drying, and obtaining a substrate (2) coated with a nano-metal coating layer; and (B) performing ultraviolet exposure treatment on the substrate (2) coated with the nano-metal coating layer, forming a light-cured shaped conductive grid (3) containing the nano-metal, performing cleaning development and heating, and obtaining a transparent conductive substrate (4), wherein the grid line width of the light-cured shaped conductive grid (3) <= 20 [mu]m. The nano-metal is an ultraviolet sensitive material. According to the method, the thickness of a conductive layer is easy to control, the preparation method is simple, and the transparent conductive substrate with large area and controllable conductivity can be rapidly prepared. The prepared transparent conductive substrate has the advantages of stable transparency and conductivity, high transparency and high yield rate.

Description

technical field [0001] The invention relates to the field of transparent conductive materials, in particular to a transparent conductive substrate and a preparation method and application thereof. Background technique [0002] Transparent conductive materials are important constituent materials of the modern electronics industry, and are widely used in display, photovoltaic, touch screen, lighting and other fields. At present, the main transparent conductive substrates in the electronics industry are transparent conductive glass and transparent conductive films based on indium tin oxide (ITO). Due to the shortage of indium oxide materials in the future, low conductivity, lack of toughness and easy brittleness, the electronics industry The field has been looking for indium tin oxide alternative material solutions. [0003] The preparation of transparent conductive substrates is one of the technical solutions to replace ITO. CN104658700A discloses a preparation method of a s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B13/00H01B5/14
CPCH01B5/14H01B13/00H01B13/0016H01B13/003
Inventor 张兴业王海燕宋延林
Owner INST OF CHEM CHINESE ACAD OF SCI
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