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A kind of ultraviolet light hybrid curing encapsulation adhesive composition

A technology of hybrid curing and composition, applied in the direction of adhesives, adhesive types, adhesive additives, etc., to achieve the effects of reducing brittleness, improving bonding strength, and enhancing bonding strength

Active Publication Date: 2021-04-20
SHENZHEN POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The object of the present invention is to provide a thermally conductive but non-conductive UV hybrid curing encapsulant and its preparation method. The same resin molecule in the adhesive composition has both UV curing groups (double bonds) and thermal The curing group (epoxy group) can be cured by ultraviolet light-heat hybridization. This kind of adhesive can be quickly cured under ultraviolet light to achieve a certain bonding strength, and can continue to be bonded after the ultraviolet light is withdrawn. Thermal curing, to further improve the bonding strength, realize deep curing, and solve some defects of existing single UV curing or single thermal curing adhesives

Method used

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  • A kind of ultraviolet light hybrid curing encapsulation adhesive composition
  • A kind of ultraviolet light hybrid curing encapsulation adhesive composition
  • A kind of ultraviolet light hybrid curing encapsulation adhesive composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] An ultraviolet light hybrid curing thermally conductive and non-conductive encapsulant, which contains the following components and parts by weight:

[0048]

[0049] The preparation method of the organosilicon-modified epoxy acrylate monoester resin of described graft modification rate 60% is:

[0050] In the first step, add 250g of naphthalene-based epoxy to a 1000mL three-necked flask, take an oil bath to 110°C, stir, and add 0.4% of the total mass to the measured acrylic acid (the molar ratio of epoxy group to acrylic acid is 2:1). The catalyst triethylbenzyl ammonium chloride and 0.3% polymerization inhibitor p-hydroxyanisole are added dropwise into the epoxy resin, and the acid value of the system is less than 3mgKOH / g after 4.5 hours of reaction, that is, the epoxy acrylate monoester ①;

[0051] The second step, in the there-necked flask of 1000mL, add the diphenylmethane diisocyanate (MDI) of 1mol, be heated to 60 ℃, dibutyltin dilaurate joins the hydroxyl si...

Embodiment 2

[0059] An ultraviolet light hybrid curing thermally conductive and non-conductive encapsulant, which contains the following components and parts by weight:

[0060]

[0061] The preparation method of the organosilicon-modified epoxy acrylate monoester resin with a graft modification rate of 70% is:

[0062] In the first step, add 500g novolac epoxy resin to a 1000mL three-necked flask, heat the oil bath to 90°C, stir, and add 0.5% of the total mass to the measured acrylic acid (the molar ratio of epoxy group to acrylic acid is 2:1). The catalyst tris(acetylacetonate) complex iron (Ⅲ) and 0.5% polymerization inhibitor p-hydroxyanisole are added dropwise to the epoxy resin, and after 6 hours of reaction, the acid value of the system is less than 3mgKOH / g, that is, the epoxy acrylate monoester① ;

[0063] Second step, add 1mol hexamethylene diisocyanate (HDI) in the there-necked flask of 1000mL, heat to 80 ℃, dibutyltin dilaurate joins the hydroxyl silicone oil containing 1mo...

Embodiment 3

[0071] An ultraviolet light hybrid curing thermally conductive and non-conductive encapsulant, which contains the following components and parts by weight:

[0072]

[0073]

[0074] The preparation method of the organosilicon-modified epoxy acrylate monoester resin with a graft modification rate of 80% is:

[0075] In the first step, add 500g of bisphenol F epoxy resin into a 1000mL three-necked flask, heat the oil bath to 110°C, stir, and add the total mass Add 0.8% catalyst triethanolamine and 0.8% polymerization inhibitor p-hydroxyanisole dropwise into the epoxy resin, and after 4 hours of reaction, the acid value of the system is less than 3mgKOH / g, that is, epoxy acrylate monoester ①;

[0076] In the second step, add 1mol of isophorone diisocyanate (IPDI) in a three-necked flask of 1000mL, heat to 80°C, and dibutyltin dilaurate is added to the hydroxyl silicone oil containing 1mol of hydroxyl by 0.6% of the total mass ( Hydroxyl content 6%), add dropwise in isopho...

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Abstract

The invention discloses an ultraviolet light hybrid curing encapsulation adhesive composition, which is composed of silicone-modified epoxy acrylic resin, diluent, photoinitiator, thermal curing agent, thermally conductive and non-conductive filler, coupling agent, etc. Wherein the thermally conductive and non-conductive fillers include surface grafted modified graphene oxide / graphite. The bonding strength of the composition is greater than 1.3MPa, the heat resistance temperature exceeds 190°C, the thermal conductivity is greater than 1.21W / m·K, and the volume resistivity is greater than 10 13 Ω·m, which can meet the packaging requirements of some components in the electronics industry, and can be applied to the bonding and fixing of heat dissipation devices.

Description

technical field [0001] The invention belongs to the technical field of encapsulation adhesives, and in particular relates to a thermally conductive and non-conductive ultraviolet light hybrid curing encapsulation adhesive and a preparation method thereof. Background technique [0002] With the rapid development of electronic products such as integrated circuits, electronic components are developing in the direction of miniaturization and precision, and their heat dissipation has become a key issue. Therefore, higher requirements are put forward for electronic packaging and bonding. With the miniaturization of electronic components and the integration of circuits, electronic products will generate a lot of heat during their work. If the heat is not dissipated in time, the working temperature of electronic components will rise, which will directly affect their service life and electronic products. Some of them can even lead to the burning of the entire electronic product. Acco...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/14C09J11/04C09J11/06C08G18/76C08G18/67C08G18/61C08G18/58
CPCC08G18/581C08G18/61C08G18/672C08G18/7614C08G18/7671C08L2201/08C08L2203/206C08L2205/025C09J11/04C09J11/06C09J175/14C08L75/14C08K13/06C08K9/04C08K3/042C08K3/04C08K9/06
Inventor 刘红波张霞张武英
Owner SHENZHEN POLYTECHNIC
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