A kind of chip radiator and its preparation method and dbc substrate assembly

Abstract

The invention relates to the field of chip radiators, in particular to a chip radiator, a preparation method thereof, and a DBC substrate assembly. The chip radiator includes: an upper end cover, a co-fired laminated heat dissipation structure and a lower end cover sequentially laminated. The lower end cover is provided with a cooling liquid inlet and a cooling liquid outlet. The material of the co-fired laminated heat dissipation structure is Oxygen-free copper, the material of the upper end cap and the lower end cap is oxygen-free copper and / or an alloy containing copper. It also relates to a preparation method of a chip radiator and a DBC substrate assembly, the substrate assembly includes the chip radiator with any structure above. The heat sink of the present invention has good cold and heat shock resistance, thermal conductivity, and sealing performance of the chip heat sink, and the cost of the chip heat sink of the present invention is low, and the preparation process is easy to operate and realize.

Description

technical field [0001] The invention relates to the field of chip radiators, in particular to a chip radiator, a preparation method thereof, and a DBC substrate assembly. Background technique [0002] Patent application CN103295982A discloses a copper-clad ceramic heat sink for electronic packaging modules. Its co-fired laminated ceramic heat dissipation structure sinters multiple single-layer ceramic sheets into a single sintered body through metal materials. The single-layer ceramic sheets constituting the co-fired laminated ceramic structure are punched with through holes forming heat dissipation water channels, and the multi-layer monolithic ceramics are laminated to form a staggered structure, forming water channels in the co-fired laminated ceramic structure. The high-temperature co-fired laminated ceramic structure has two single-layer ceramics without a through-hole structure, and is located on the upper and lower surfaces of the co-fired laminated ceramic structure ...

AI Technical Summary

Problems solved by technology

The heat sink of this prior art is formed by filling metal materials between ceramic sheets through high-temperature sintering. Ensure the uniformity of the filler (filler area thickness, etc.), which may cause problems with the airtightness between the laminated ceramics; metal paste needs to be filled between the ceramic plates, and the cost will be relatively high

In addition, the thermal conductivity of the ceramic body is poor, the resistance to cold and heat shock is low, and cracks are prone to appear; the through-hole design between two adjacent pieces of ceramics is staggered, and the overlapping hollow parts of the two pieces form the main flow channel, and the non-overlapping areas become unsuitable. The area of ​​circulation, resulting in the flow of coolant is not smooth, resulting in the radiator's heat dissipation efficiency is not high

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