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Method for preparing soft and hard combined circuit of plug-and-pull finger dual camera module type

A dual-camera technology combined with hardware and software, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve problems such as oxidation, dirt on the gold surface of inserting and pulling out fingers, and low yield, so as to overcome oxidation and/or or dirty effect

Pending Publication Date: 2018-11-23
ZHUHAI HAIXUN SOFT MULTILAYER PROTOTYPES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for preparing a soft-hard combination circuit for inserting and pulling out a finger dual-camera module, so as to solve the problems in the existing method for preparing a soft-hard combination circuit for inserting and pulling out a finger dual-camera module proposed in the background art. Dirty and oxidized gold surfaces lead to low yield

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0036] The preparation method of the finger-plugging dual-camera module-like soft-hard circuit of the present application includes the following steps:

[0037] 1) Cut the 0.05mm thick sheet baking plate;

[0038] 2) Drilling treatment of the buried layer of the second and third layers;

[0039] 3) VCP black hole drilling;

[0040] 4) Inner line production;

[0041] 5) Press the covering film;

[0042] 6) Print high-temperature oil on the insertion and removal fingers;

[0043] 7) Plasma cleaning;

[0044] 8) PP copper foil assembly;

[0045] 9) Superimposed vacuum pressure transmission process;

[0046] 10) Drilling treatment;

[0047] 11) Remove glue and carry out VCP copper sinking treatment;

[0048] 12) Production of outer circuit;

[0049] 13) Production of solder mask;

[0050] 14) Carry out surface treatment of grinding plate-release film-sandblasting series;

[0051] 15) High-temperature ink printing and ink curing in the nickel-palladium-gold area;

[005...

Embodiment 1

[0059] Example 1: Four-layer rigid-flex board.

[0060] The company number SRF18694 is a four-layer flex-rigid board. The production and shipment size is 119*133.5mm, the unit size is 49.33*23.67, the thickness of the soft board area is 0.12±0.03mm, and the rigid board area is 0.35±0.05mm.

[0061] Raw material list:

[0062] 1 / 3OZ pure copper foil, thickness 0.012mm, used as L1, L4 layer substrate;

[0063] LPI1ED1 / 3-D copper foil, thickness 0.05mm, used as L2, L3 layer substrate;

[0064] CVL covering film, thickness 0.02mm, as L2 and L3 layer covering film;

[0065] PP sheet for lamination, thickness 0.08mm, for lamination of L1&L2, L3&L4;

[0066] PI reinforcement, thickness 0.125mm, as L3 layer reinforcement;

[0067] Solder resist pad FR4, thickness 1.6mm.

[0068] According to the above-mentioned preparation process of the process, a four-layer rigid-flex board with a yield rate of 93.5% was finally produced.

Embodiment 2

[0069] Example 2: Four-layer Gold Finger Rigid-Flex Board

[0070] Company number SRF18541 four-layer Goldfinger flex-rigid board, production and shipment size 120*98.4mm, unit size 20.54*16.7, soft board area 0.12±0.03mm thick, hard board area 0.35±0.05mm, PI reinforcement area 0.22 +0.01 / -0.02mm.

[0071] Raw materials:

[0072] 1 / 3OZ pure copper foil, thickness 0.012mm, used as L1, L4 layer pure copper substrate;

[0073] LPI1RA1 / 3-D copper foil, thickness 0.05mm, used as L2, L3 layer substrate;

[0074] CVL covering film, thickness 0.02mm, as L2 and L3 layer covering film;

[0075] PP sheet for lamination, thickness 0.08mm, for lamination of L1&L2, L3&L4;

[0076] PI reinforcement, thickness 0.1mm, attached to L2 layer;

[0077] Solder resist pad FR4, thickness 1.6mm.

[0078] According to the above-mentioned preparation process of the process, a four-layer rigid-flex board with a yield rate of 94.2% was finally produced.

[0079] Then, the comparison between the prep...

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PUM

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Abstract

The invention discloses a method for preparing a soft and hard combined circuit of a plug-and-pull finger dual camera module, comprising the following process steps of: material cutting, drilling, VCPblack holes, inner layer circuit producing, covering film pressing, high temperature oil printing, plasma cleaning, PP copper foil assembling, laminated vacuum pressure transmitting, drilling, VCP copper sinking, outer layer circuit producing, solder mask producing, high temperature ink printing, nickel gold grinding, high temperature ink removing, blue glue printing, and nickel palladium gold sandblasting. According to the method for preparing soft and hard combined circuit of plug-and-pull finger dual camera module, the problem of oxidation and dirt on the gold surface of the plug-and-pullfinger can be effectively solved and the yield can be increased from 0% to 95% by pushing the nickel gold process of inner plug-and-pull finger.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to the preparation of soft-hard combination boards for inserting and pulling out fingers in the inner layer. Background technique [0002] One type of rigid-flex board for dual-camera modules is to make plug-in fingers on the inner layer, and the nickel thickness of soft nickel is required to be 2-4um, while the wire bonding pad requires hard nickel and the thickness is 5-9um. Plating layers with different requirements and specifications on the same circuit board can only be selectively plated. The nickel-gold transition process of inserting and pulling out fingers is the first step in the preparation method of the prior art. The anti-plating materials include high-temperature glue and anti-plating ink. The blue glue can be peeled and printed, but when it is used alone in production, there will be glue residue, the ink on the gold surface will fall off from the nickel cylinde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4691
Inventor 李凯蒋有平
Owner ZHUHAI HAIXUN SOFT MULTILAYER PROTOTYPES
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