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A treatment method for reducing warping of electrolytic copper foil

A treatment method, electrolytic copper foil technology, applied in electrolytic process, electroforming, metal material coating process, etc., can solve the problem of destroying crystal symmetry, achieve excellent oxidation resistance, realize warping, and increase anti-peeling strength Effect

Active Publication Date: 2020-05-08
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The arrangement of copper atoms deviates from the complete periodic lattice structure, which will destroy the symmetry of the crystal, resulting in the generation of internal stress

Method used

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  • A treatment method for reducing warping of electrolytic copper foil
  • A treatment method for reducing warping of electrolytic copper foil
  • A treatment method for reducing warping of electrolytic copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A treatment method for reducing warpage of electrolytic copper foil, the steps are as follows:

[0035] 1) Using 18μm HTE copper foil as the original foil, the diameter of the submerged transmission guide roller is 40cm, concentric arc-shaped titanium anode, and the pole distance is 5cm;

[0036] 2) Special roughening: The 18μm HTE original foil after pickling is subjected to special roughening treatment, the specific process conditions are: CuSO 4 ·5H 2 O 60g / L, H 2 SO 4 220g / L, additive 12g / L, temperature 30°C, current density 35A / dm 2 , time 2.7s;

[0037] 3) Special curing: the copper foil obtained in step 2) is subjected to special curing treatment, and the process conditions are: CuSO 4 ·5H 2 O240g / L, H 2 SO 4 130g / L, protein powder 18ppm, hydroxyethyl cellulose 10ppm, sodium polydithiodipropane sulfonate 5ppm, temperature 45°C, current density 20A / dm 2 , time 2.7s;

[0038] 4) roughening: the copper foil obtained in step 3) is roughened, and the proce...

Embodiment 2

[0044] A treatment method for reducing warpage of electrolytic copper foil, the steps are as follows:

[0045] 1) Use 18μm HTE copper foil as the original foil, the diameter of the submerged transmission guide roller is 50cm, concentric arc-shaped titanium anode, and the pole distance is 5cm;

[0046] 2) Special roughening: The 18μm HTE raw foil after pickling is subjected to special roughening treatment, and the process conditions are: CuSO 4 ·5H 2 O 90g / L, H 2 SO 4 200g / L, additive 9g / L, temperature 40°C, current density 20A / dm 2 , time 3.5s;

[0047] 3) Special curing: the copper foil obtained in step 2) is subjected to special curing treatment, and the process conditions are: CuSO 4 ·5H 2 O220g / L, H 2 SO 4 140g / L, 25ppm protein powder, 12ppm hydroxyethyl cellulose, 3.4ppm sodium polydithiodipropane sulfonate, temperature 45°C, current density 15A / dm 2 , time 3.5s;

[0048] 4) The copper foil obtained in step 3) is subjected to roughening, curing, galvanized nic...

Embodiment 3

[0050] A treatment method for reducing warpage of electrolytic copper foil, the steps are as follows:

[0051] 1) Using 18μm HTE copper foil as the original foil, the diameter of the submerged transmission guide roller is 30cm, concentric arc-shaped titanium anode, and the pole distance is 5cm;

[0052] 2) Special roughening: The 18μm HTE raw foil after pickling is subjected to special roughening treatment, and the process conditions are: CuSO 4 ·5H 2 O 110g / L, H 2 SO 4 170g / L, additive 15g / L, temperature 50℃, current density 35A / dm 2 , time 4.2s;

[0053] 3) Special curing: the copper foil obtained in step 2) is subjected to special curing treatment, and the process conditions are: CuSO 4 ·5H 2 O290g / L, H 2 SO 4 120g / L, protein powder 30ppm, hydroxyethyl cellulose 6ppm, sodium polydithiodipropane sulfonate 1.6ppm, temperature 45°C, current density 30A / dm 2 , time 4.2s;

[0054] 4) The copper foil obtained in step 3) is subjected to roughening, curing, zinc-nickel ...

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Abstract

The invention belongs to the technical field of copper foil treatment, and particularly relates to a treatment method for reducing warpage of an electrolytic copper foil. The method comprises acid washing, special coarsening, special curing, coarsening, curing, zinc-plated nickel alloy, anti-oxidation treatment, silane coupling agent treatment and drying. According to the treatment method for reducing warpage of the electrolytic copper foil, by special treatment on a rough surface of the copper foil, the surface pressure stress is increased, the stress on the two surfaces of the copper foil isfurther balanced, the residual stress of the copper foil is further reduced, and the warping degree of the copper foil is reduced; the electrolytic copper foil obtained by the treatment method, the rough surface is relatively large than the surface area, and the anti-stripping strength can be improved while the surface roughness is reduced; the electrolytic copper foil has excellent oxidation resistance, chemical resistance and etching resistance; and the treatment process is easy to control, and the product quality is stable.

Description

technical field [0001] The invention belongs to the technical field of copper foil treatment, and in particular relates to a treatment method for reducing warping of electrolytic copper foil. Background technique [0002] Electrolytic copper foil is one of the basic materials for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCB), and is widely used in electronic products. With the development trend of light, thin, short and small electronic products, the consumer market demand for ultra-thin electrolytic copper foil is increasing, and the domestic production capacity of electrolytic copper foil with a thickness of 18 μm and below is expanding year by year. The production of ultra-thin electrolytic copper foil has extremely strict requirements on equipment, technology and environment, and a slight mistake in the link may easily cause product defects such as pinholes, warping, mottling, and porous cross-section. [0003] Warpage is a common probl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04C25D7/06C25D5/48C25D5/12C25D3/38C25D3/56C23C22/68
CPCC23C22/68C23C2222/20C25D1/04C25D3/38C25D3/56C25D5/12C25D5/48C25D7/06
Inventor 孙云飞杨祥魁王维河王学江徐策徐好强谢锋薛伟宋佶昌王其伶张艳卫王先利
Owner SHANDONG JINBAO ELECTRONICS
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