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Low-molecular weight siliceous acrylic resin for photosensitive silver paste and preparation method thereof

A low-molecular-weight, silico-acrylic technology, used in optomechanical equipment, optics, photolithography on patterned surfaces, etc., and can solve problems such as line adhesion.

Active Publication Date: 2018-10-12
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, regular acrylics can have issues with line adhesion

Method used

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  • Low-molecular weight siliceous acrylic resin for photosensitive silver paste and preparation method thereof
  • Low-molecular weight siliceous acrylic resin for photosensitive silver paste and preparation method thereof
  • Low-molecular weight siliceous acrylic resin for photosensitive silver paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The photosensitive silver paste described in this embodiment is prepared by the following method with low molecular weight silicon-containing acrylic resin:

[0034] Under a nitrogen atmosphere, 100g of dipropylene glycol methyl ether and 0.005g of benzoyl peroxide were packed into a 500mL four-necked flask with mechanical stirring, a thermometer and a reflux condenser, and placed in an oil bath at 60°C (such as figure 1 shown). 99.9 g of methyl methacrylate, 0.1 g of methacrylic acid, 0.005 g of acryloxypropyltrimethoxysilane, 0.01 g of initiator and 0.01 g of chain transfer agent were mixed and transferred to a constant pressure dropping funnel. When the temperature in the reaction flask reached 60°C, the constant pressure dropping funnel was opened, and the mixture was added dropwise and reacted for 1 h. Raise the temperature to 70°C for 1 hour, cool to room temperature and store in a PP plastic bottle; the photosensitive silver paste obtained in this example has a ...

Embodiment 2

[0036] The photosensitive silver paste described in this embodiment is prepared by the following method with low molecular weight silicon-containing acrylic resin:

[0037] Under a nitrogen atmosphere, 100g of n-butanol and 0.05g of benzoyl peroxide were packed into a 500mL four-neck flask with mechanical stirring, a thermometer and a reflux condenser, and placed in an oil bath at 70°C (such as figure 1 shown). 80g of methyl methacrylate, 10g of acrylic acid, 10g of butyl acrylate, 0.05g of acryloxypropyltriethoxysilane, 0.05g of initiator and 0.05g of chain transfer agent were mixed and transferred to a constant pressure dropping funnel. When the temperature in the reaction flask reached 70°C, the constant pressure dropping funnel was opened, and the mixture was added dropwise and reacted for 2 hours. Raise the temperature to 80°C for 2 hours, cool to room temperature and transfer to PP plastic bottle for storage. The molecular weight of the low molecular weight silicon-con...

Embodiment 3

[0039] The photosensitive silver paste described in this embodiment is prepared by the following method with low molecular weight silicon-containing acrylic resin:

[0040] Under a nitrogen atmosphere, 233g terpineol and 0.1g benzoyl peroxide were packed into a 500mL four-necked flask with mechanical stirring, a thermometer and a reflux condenser, and placed in an oil bath at 80°C (such as figure 1 shown). 70g methyl methacrylate, 50g maleic anhydride, 30g isobutyl methacrylate, 10g hydroxyethyl methacrylate, 0.1g methacryloxypropylmethyldimethoxysilane, 0.1g initiator Agent and 0.1g chain transfer agent were mixed and transferred to a constant pressure dropping funnel. When the temperature in the reaction flask reached 80°C, the constant pressure dropping funnel was opened, and the mixture was added dropwise and reacted for 3 hours. Raise the temperature to 90°C for 3 hours, cool to room temperature and transfer to PP plastic bottle for storage. The molecular weight of the...

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Abstract

The invention discloses low-molecular weight siliceous acrylic resin for photosensitive silver paste. The low-molecular weight siliceous acrylic resin contains the following components in percentage by mass: 30%-70% of solid components and 30%-70% of liquid components, wherein the solid components contain a non-silicon monomer, an organic silicon compound, an initiator and a chain transfer agent,the organic silicon compound accounts for 0.01%-2% of the mass of the monomer, the initiator accounts for 0.01%-2% of the mass of the monomer, and the chain transfer agent accounts for 0.01%-1% of themass of the monomer. The low-molecular weight siliceous acrylic resin has the beneficial effects that organic silicon is introduced into the small-molecular weight acrylic resin, a good developing effect is realized and also the adhesive force between an electrode and a membrane is improved. The invention also discloses a preparation method of the low-molecular weight siliceous acrylic resin forthe photosensitive silver paste.

Description

technical field [0001] The invention relates to an acrylic resin and a preparation method thereof, in particular to a low molecular weight silicon-containing acrylic resin for photosensitive silver paste and a preparation method thereof. Background technique [0002] Photosensitive silver paste is a kind of conductive silver paste. Electrodes are obtained through processes such as printing, drying, exposure, development, and sintering. It is one of the electrode preparation methods with a resolution lower than 30 microns. The composition of photosensitive silver paste includes developing resin, carrier resin, solvent, silver powder, etc., among which developing resin plays a key role in determining the electrode lines. Acrylic resin is often selected as photosensitive silver paste developing resin because of its carboxyl group, complete thermal decomposition, and good printability. Acrylic resin has a variety of structures, not only has a strong polar group, which can play ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F220/14C08F220/06C08F230/08C08F220/18C08F222/06C08F220/20G03F7/075
CPCG03F7/0758C08F220/14C08F222/02C08F220/1804C08F212/08C08F220/1808C08F230/08C08F220/06C08F222/06C08F220/20
Inventor 徐四喜曹秀华
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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