A kind of low dielectric constant environment-friendly underfill glue and preparation method thereof
A technology of underfill glue and low dielectric constant, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of poor arc resistance, poor weather resistance, and poor electrical performance, and achieve high arc resistance, Excellent weather resistance and low dielectric constant effect
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Embodiment 1
[0027] 1) Weigh out 310 g of hydrogenated bisphenol A epoxy resin YS-GF015 (Nanjing Yuanshu Pharmaceutical), 120 g of hollow glass microspheres 8054 (Potters, USA), 240 g of spherical silicon micropowder FE920A-SQ (Admatechs, Japan), methyl tetra Diglycidyl hydrogen phthalate XY-813 (Xinyuan, Anhui) 50g, core-shell rubber epoxy resin BPF-307 (NIPPON SHOKUBAI, Japan) 90g, silane coupling agent KH-560 (Tianjin Reagent Factory) 3g, Defoamer AFCONA-2038 (Efcona, Malaysia) 3g, black color paste (PENNCOLOR, USA) 4g, put into the reaction kettle, the speed is 800 rpm, stirred for 3h, and mixed evenly;
[0028] 2) Add the mixture obtained in step 1) into the colloid mill JM-L50 (Wenzhou Longxin Machinery), adjust the equipment gap to 0.03mm, cut the grinding cycle for 2h, and fully grind;
[0029] 3) Cool the mixture obtained in step 2) to 20-30°C and weigh 180 g of the curing agent-modified spirocyclic diamine MY-HK-1 (Ajinomoto Japan) into the reaction kettle, with a rotating speed ...
Embodiment 2
[0031] 1) Weigh out 200 g of hydrogenated bisphenol A epoxy resin EP-4080E (ADEKA, Japan), 160 g of polycyclic aromatic epoxy resin HP-4032D (DIC, Japan), and 60 g of hollow glass beads G400 (3M, USA), spherical Silicon powder SO-E2 / 24C (Admatechs, Japan) 340g, pentaerythritol tetraglycidyl ether XY-634 (Xinyuan, Anhui) 30g, core-shell rubber epoxy resin BPF-307 (NIPPON SHOKUBAI, Japan) 80g, silane coupling agent KH -560 (Tianjin Reagent Factory) 3g, defoamer AFCONA-2270 (Malaysia Efcona) 3g, black color paste (American PENNCOLOR) 4g, put into the reaction kettle, rotate speed 800 rpm, stir for 3h, and mix well;
[0032] 2) Add the mixture obtained in step 1) into the colloid mill JM-L50 (Wenzhou Longxin Machinery), adjust the equipment gap to 0.03mm, cut the grinding cycle for 2h, and fully grind;
[0033] 3) Cool the mixture obtained in step 2) to 20-30°C and weigh 180 g of the curing agent-modified spirocyclic diamine MY-HK-1 (Ajinomoto Japan) into the reaction kettle, with...
Embodiment 3
[0035] 1) Weigh out 180 g of hydrogenated bisphenol A epoxy resin YS-GF015 (Nanjing Yuanshu Pharmaceutical), 120 g of biphenyl epoxy resin NC-3000 (Nippon Chemicals), 90 g of hollow glass beads 8054 (Potters, USA), Spherical silica powder FE920A-SQ (Admatechs, Japan) 320 g, diglycidyl methyltetrahydrophthalate XY-813 (Xinyuan, Anhui) 20 g, thermoplastic resin modified epoxy resin RA840 (CVC, USA) 60 g, Silane coupling agent KH-560 (Tianjin Reagent Factory) 3g, antifoaming agent AFCONA-2038 (Malaysia Efcona) 3g, black color paste (American PENNCOLOR) 4g, put into the reaction kettle, rotate speed 800 rpm, stir 3h, mix evenly;
[0036] 2) Add the mixture obtained in step 1) into the colloid mill JM-L50 (Wenzhou Longxin Machinery), adjust the equipment gap to 0.03mm, cut the grinding cycle for 2h, and fully grind;
[0037] 3) Cool the mixture obtained in step 2) to 20-30°C and weigh 200 g of curing agent phenol aralkyl and its derivative MEH-8000H (Mingwa Chemicals, Japan) into ...
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