Trench gate charge storage-type IGBT device with clamp structure and manufacturing method thereof
A charge storage and trench gate technology, applied in semiconductor/solid-state device manufacturing, electrical solid-state devices, electrical components, etc., can solve problems such as reduced switching speed, increased charge/discharge time, and reduced device switching speed.
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Embodiment 1
[0078] This example proposes as figure 2 A trench gate charge storage type IGBT device with a clamping structure is shown, including: a collector structure, a drift region structure, an emitter structure and a trench gate structure; the collector structure includes a P+ collector region 12 and is located at The collector metal 13 on the lower surface of the P+ collector region 12; the drift region structure includes an N-type electric field stop layer 11 and an N-type drift region layer 10 located on the upper surface of the N-type electric field stop layer 11, and the N-type electric field stop layer 11 is located on the upper surface of the P+ collector region 12; the emitter structure includes an emitter metal 1, a P+ contact region 2, an N+ emitter region 3, a P-type base region 8 and an N-type charge storage layer 9, and the emitter structure Located on the top layer of the N-type drift region layer 10, the N-type charge storage layer 9 is located between the P-type base...
Embodiment 2
[0084] This example proposes as image 3 The trench gate charge storage type IGBT device with a clamping structure shown is the same as the embodiment 1 except that the clamping electrode dielectric layer 15 is thicker than the gate dielectric layer 7 .
[0085] Compared with Embodiment 1, this embodiment can further reduce the gate capacitance on the one hand, increase the switching speed of the device and reduce the switching loss, and on the other hand can further improve the electric field concentration effect at the bottom of the trench and increase the breakdown voltage of the device. , improve device reliability.
Embodiment 3
[0087] This example proposes as Figure 4 A trench gate charge storage type IGBT device with a clamping structure is shown, except that the shape of the clamping electrode 14 is different from that of the embodiment 1, and the rest of the structure is the same as that of the embodiment 1; in this embodiment, the clamping electrode 14 It is composed of connected first clamping electrode and second clamping electrode, the width of the first clamping electrode is larger than the width of the second clamping electrode, so that the two are connected with the N-type charge storage layer 9 and the N-type drift region 10 The thickness of the clamping electrode dielectric layer 15 is different. As can be seen from the figure, the clamping electrode dielectric layer 15 is stepped. This embodiment can further reduce the gate capacitance on the basis of Embodiment 1, thereby improving the device The switching characteristics, and can further improve the electric field concentration effect...
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