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Preparation method of hollow mesoporous silica microsphere-reinforced epoxy resin composite material

A mesoporous silica and epoxy resin technology, applied in the direction of silica, silicon oxide, etc., can solve the problems of affecting the dispersion and interface compatibility of the matrix resin, affecting material performance, and poor interface compatibility, etc., to achieve Solve the problem of interface compatibility, improve the overall performance, and reduce the cost

Inactive Publication Date: 2018-01-26
GUILIN UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the interfacial compatibility between the matrix resin and the nanoparticles is poor, which affects the performance of the material.
[0003] Studies have shown that the size of inorganic nanoparticles, as well as the dispersion and interfacial compatibility in the matrix resin play a crucial role in improving the performance of composite materials. It is difficult to interact with polymer molecular chains using traditional mesoporous molecular sieves. effect, which affects its dispersion and interfacial compatibility in the matrix resin

Method used

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  • Preparation method of hollow mesoporous silica microsphere-reinforced epoxy resin composite material
  • Preparation method of hollow mesoporous silica microsphere-reinforced epoxy resin composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] (1) Dissolve the soft templating agent and the hard templating agent in an aqueous solution of ethanol, add ammonia solution, and the absolute ethanol accounts for 25% by weight of the mixed solution, sonicate for 0.5h, stir at 30°C for 4h, and then use normal Ethyl silicate is used as a silicon source, and the mass ratio of ethyl orthosilicate to the hard template is 1:1, and is added dropwise to the mixed solution. The mass ratio of the soft template, the hard template, ammonia water and orthosilicate is 0.4:1.8:1:1.8, stirred at 40°C for 24h, then transferred the reaction product to a hydrothermal reaction kettle and placed in an oven at 60°C, crystallized for 24h, then washed, filtered, and dried at 60°C for 6h , the obtained powder was placed in a 550°C horse-boiling furnace and calcined for 500min to prepare hollow mesoporous silica microspheres.

[0024] (2) Dry the hollow mesoporous silica microspheres prepared in step (1) at 150°C for 3 hours, and then place th...

Embodiment 2

[0034] Except that the amount of coupling-treated hollow mesoporous silica microspheres prepared in step (2) used in step (3) was changed to 2.0 g, other steps were kept the same as in Example 1.

Embodiment 3

[0036] Except that the amount of coupling-treated hollow mesoporous silica microspheres prepared in step (2) used in step (3) was changed to 3.0 g, other steps were kept the same as in Example 1.

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Abstract

The invention discloses a preparation method of a hollow mesoporous silica microsphere-reinforced epoxy resin composite material. The preparation method comprises preparing hollow mesoporous silica microspheres, carrying out coupling treatment through a silane coupling agent, adding the coupled microspheres into an epoxy resin oligomer, carrying out vacuum mixing, ultrasonic treatment and vacuum-pumping treatment to obtain a hollow mesoporous silica microsphere / epoxy resin mixture, adding a curing agent and a promoter into the mixture, carrying out curing at 80-100 DEG C for 3-6h, and carryingout curing at 140-180 DEG C for 4-8h to obtain the hollow mesoporous silica microsphere-reinforced epoxy resin composite material. The preparation method has simple processes, realizes a low cost andeasily satisfies the requirements of industrial production. The hollow mesoporous silica microsphere-reinforced epoxy resin composite material has good comprehensive performances. Compared with the pure epoxy resin cured product, the composite material has higher glass-transition temperature, higher storage modulus, better tensile strength and better bending strength.

Description

technical field [0001] The invention belongs to the technical field of modified epoxy resin composite materials, and in particular relates to a preparation method of hollow mesoporous silica microsphere-reinforced epoxy resin composite materials. Background technique [0002] Epoxy resin (EP) has a highly cross-linked three-dimensional network structure, which endows it with excellent mechanical properties, electrical insulation, adhesion, good heat resistance, solvent resistance, easy processing and low cost And other advantages, so it is widely used as the matrix resin of adhesives, coatings and various composite materials. However, the highly cross-linked network structure also leads to its low impact resistance and crack resistance, which greatly limits the application of epoxy resin. Therefore, it is a common method to improve the comprehensive performance of epoxy resin by modifying it. At present, the modification of epoxy resin is mainly through toughening modificat...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/06C08K7/26C08G59/42C01B33/18
Inventor 余传柏高朋罗海强刘远立
Owner GUILIN UNIVERSITY OF TECHNOLOGY
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