Semiconductor wafer surface protection tape and semiconductor wafer processing method

A processing method, semiconductor technology, applied in semiconductor/solid-state device manufacturing, metal processing equipment, film/sheet adhesive, etc., can solve problems such as residual glue, achieve easy peeling, suppress residual glue, prevent dust or The effect of penetration of grinding water

Active Publication Date: 2019-09-17
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the case of using a soft surface protection tape, although the followability is good, there are cases where the adhesive is soft when it is peeled off, and the adhesive may be caught on the uneven height difference on the surface of the semiconductor wafer, and the adhesive may be torn to form a residual adhesive.

Method used

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  • Semiconductor wafer surface protection tape and semiconductor wafer processing method
  • Semiconductor wafer surface protection tape and semiconductor wafer processing method
  • Semiconductor wafer surface protection tape and semiconductor wafer processing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0097] Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.

[0098] >

preparation example 1

[0100] 90 parts by mass of 2-ethylhexyl acrylate, 5 parts by mass of methyl methacrylate, and 5 parts by mass of methacrylic acid were reacted in ethyl acetate at 55° C. for 10 hours to polymerize. 100 parts by mass of a (meth)acrylic polymer having a weight average molecular weight of 500,000, 0.5 parts by mass of an isocyanate curing agent (manufactured by Nippon Polyurethane, trade name "Coronate L"), 0.5 parts by mass of an epoxy curing agent (manufactured by Mitsubishi Gas Chemical Co., Ltd. , trade name "Tetrad C") 0.6 parts by mass to obtain an adhesive composition. The hydroxyl value is 0mgKOH, and the acid value is 31mgKOH.

[0101] In addition, the measurement conditions by the GPC method of a weight average molecular weight are shown below.

[0102] [Measurement conditions by GPC method]

[0103] Equipment used: High performance liquid chromatography LC-20AD [manufactured by Shimadzu Corporation, trade name]

[0104] Column: Shodex Column GPC KF-805 [manufactured...

preparation example 2

[0110] Except having changed the compounding quantity of an epoxy curing agent into 2.2 mass parts, it carried out similarly to the preparation example 1, and obtained the adhesive composition.

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PUM

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Abstract

A semiconductor wafer surface-protecting tape having an adhesive layer on a base film, and a method of processing a semiconductor wafer using the tape, wherein the adhesive force to stainless steel at 23°C is 0.3N / 25mm~10N / 25mm, the adhesive force when heated to 50°C is 40% or less of the adhesive force at 23°C, and the contact angle immediately after pure water drops on the surface of the adhesive layer is 100° or more, and the contact angle of pure water 10 minutes after dropping is 65° or more.

Description

technical field [0001] The present invention relates to an adhesive tape for protecting the surface of a semiconductor wafer. In more detail, it is related with the processing method of the tape for semiconductor wafer surface protections used when grinding a semiconductor wafer, and a semiconductor wafer. Background technique [0002] A semiconductor package is manufactured by slicing a high-purity silicon single crystal or the like into a semiconductor wafer, and then forming an integrated circuit on the surface of the wafer by ion implantation, etching, etc., thereby manufacturing a semiconductor package. The semiconductor wafer is processed to a desired thickness by grinding, polishing, or the like on the back surface of the semiconductor wafer on which the integrated circuit is formed. At this time, in order to protect the integrated circuit formed on the surface of the semiconductor wafer, a tape for protecting the surface of the semiconductor wafer (hereinafter also ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304B24B7/22C09J7/20C09J7/38C09J133/00
CPCB24B7/22C09J133/00H01L21/304C09J7/20H01L21/67132H01L21/6836
Inventor 荒桥知未
Owner FURUKAWA ELECTRIC CO LTD
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