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A kind of manufacturing method of resin plug hole circuit board

A manufacturing method and resin plug hole technology, applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of low production efficiency, high production cost, long process, etc., to improve the quality, shorten the production cycle, and strengthen the depth. effect of ability

Active Publication Date: 2019-04-02
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention aims at the problems of long process flow, low production efficiency and high production cost of the existing resin plug hole circuit board, and provides a resin plug hole circuit board manufacturing method, which reduces the number of drilling times and optimizes the manufacturing process , improve the production efficiency of the circuit board, reduce the scrap rate and reduce the production cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0027] The manufacturing method of a resin plugged circuit board shown in this embodiment includes the following processing steps in sequence: material cutting→inner layer circuit making→pressing→drilling→copper sinking→full board electroplating→filling resin→sanding Belt grinding plate 1 → mask hole pattern → cover hole and reduce copper → abrasive belt grinding plate 2 → sink copper 2 → full plate electroplating 2 → outer layer circuit production → solder mask → silk screen characters → surface treatment → forming, the specific steps are as follows:

[0028] a. Cutting: cut out the core board according to the panel size 520mm×620mm, and the thickness of the core board is 1.2mm H / H;

[0029] b. Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat photosensitive film, the thickness of the photosensitive film is controlled to 8 μm, use a fully automatic exposure machine, and use a 5-6 grid exposure ruler (2...

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PUM

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Abstract

The invention discloses a manufacturing method of a resin plug-hole circuit board. The method comprises following steps of drilling through holes in a production board subjected to early-stage press fitting, wherein the through holes comprise holes to be filled with resin, holes to be metalized and non-metalized holes; metalizing the holes to be filled with resin and the holes to be metalized through copper deposition and full-board electroplating working procedures; filling the metalized holes to be filled with resin with resin; using a sand belt to grind plug-holes and removing resin protruding from the board face; manufacturing mask hole graphs on the production board and etching to reduce parts of thickness of copper faces which are not at the holes; retreating films and using the sand belt to grind the reduced copper faces and removing resin protruding from the board faces carrying out secondary copper deposition and full-board electroplating working procedures on the production board; and successively manufacturing an outer layer circuit, a welding resisting layer and silkscreen characters and carrying out surface treatment to manufacture the circuit board. According to the invention, drilling frequency is reduced; manufacturing processes are simplified; production efficiency of the circuit board is improved; and the rejection rate and the production cost are reduced.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for manufacturing a resin plugged circuit board. Background technique [0002] The production process of the existing resin plug hole circuit board is: pre-process→lamination→drilling resin plug hole→outer layer copper sinking→full board electroplating→outer layer plated hole pattern→plating hole→removing film→resin plug hole → Abrasive belt grinding plate → slice analysis → target hole → outer layer drilling → outer layer copper plating two → full board electroplating second → outer layer graphics → graphic electroplating → outer layer etching → post process, in which resin plug holes and outer layers The holes are drilled separately. [0003] The manufacturing method of the above-mentioned resin plugged circuit board has the following defects: [0004] (1) The resin plug hole circuit board process uses a plated hole process, and the resin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/40
CPCH05K3/0094H05K3/40H05K2201/0959
Inventor 黄宏波周文涛翟青霞
Owner SHENZHEN SUNTAK MULTILAYER PCB
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