Organic light emitting diode device and manufacturing method thereof
A technology for light-emitting diodes and a manufacturing method, which is applied in the manufacture of semiconductor/solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of film peeling, poor interface adhesion, and inability to bend, so as to block the penetration of gas molecules, improve the Surface adhesion, thickness reduction effect
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[0030] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0031] see figure 1 , is a schematic structural view of the organic light emitting diode device provided by the present invention. The OLED device 100 includes a substrate 1 , an OLED unit 2 disposed on the substrate 1 and an encapsulation structure 3 , the encapsulation structure 3 is connected to the substrate 1 for encapsulating the OLED unit 2 .
[0032] The substrate 1 is a rigid substrate or a flexible substrate, wherein the rigid substrate is glass, silicon wafer or other rigid materials; the flexible substrate is a plastic substrate, aluminum foil, ultra-thin metal or ultra-thin glass.
[0033] The OLED unit 2 includes a conductive anode, a hole transport layer, a light-emitting layer, an electron transport layer and a cathode deposited sequentially, and the cathode is electrically connected to the conductive anode. The conductive anode is for...
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