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Thermosetting alkyl polyol glycidyl ether resin composition and application thereof

A technology of alkyl polyol and glycidyl ether, which is applied in the direction of synthetic resin layered products, circuit substrate materials, layered products, etc., can solve the problems of adverse effects on bonding performance, difficult processing, high cost, etc., and achieve excellent production process The effect of processing performance, simple production process, and simple production equipment

Active Publication Date: 2017-06-09
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the vigorous development of wireless transmission products and the leap forward of high-frequency transmission technology, higher requirements are placed on the dielectric properties of materials. The existing materials of epoxy resin and phenolic resin system can no longer meet advanced applications, especially Meet the requirements of high-frequency printed circuit boards
Fluorine-based resins are used as substrate materials for printed circuit boards with low dielectric loss, but such resins are expensive and difficult to process, and their applications are limited to military and aerospace fields
In addition, polyphenylene ether resin has good mechanical properties and excellent dielectric properties, and has increasingly become the preferred resin material for high-frequency printed circuit board substrates. However, at present, polyphenylene ether with double bonds is used to manufacture high-frequency and high-speed boards. Through the free radical reaction, special production equipment must be used, and the shelf life of the prepreg is short, the production process conditions are difficult to adjust, and the cost is high
[0003] CN101684191B proposes to use benzoxazine, styrene-maleic anhydride, and phosphorus-containing curing agent to compound and cure epoxy resin to obtain a cured product with lower dielectric constant and dielectric loss, but only with styrene-maleic anhydride When acid anhydride is used to reduce the dielectric properties of materials, there will inevitably be many other problems, especially the impact on adhesion, because the non-polar styrene structural unit in the molecular structure of styrene-maleic anhydride (SMA) reduces Modification of the polarity of the matrix resin weakens the interaction between the resin and the copper foil; at the same time, because a large number of benzene ring structures in SMA increase the brittleness of the resin cross-linked network, it also affects the bonding performance under dynamic conditions. Detrimentally affects the bonding strength between substrates and between substrates and copper foil
[0004] CN100523081C proposes to use benzoxazine, styrene-maleic anhydride and other curing agents to compound and cure phosphorus-containing and halogen-free and phosphorus-free epoxy compositions to obtain a cured product with lower dielectric constant and dielectric loss, but Using phosphorus-containing epoxy resin as the main resin, although it can achieve excellent flame retardancy, too much introduction of phosphorus will inevitably have a great impact on the water absorption of the substrate, which will inevitably have a negative impact on many other properties of the board
[0007] At present, for improving the properties of thermosetting epoxy resin compositions, most of the research focuses on the selection of curing agent or toughening agent to improve the properties of the resin composition, but for improving the performance of the composition through the selection and modification of the main resin components. rarely reported

Method used

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  • Thermosetting alkyl polyol glycidyl ether resin composition and application thereof
  • Thermosetting alkyl polyol glycidyl ether resin composition and application thereof
  • Thermosetting alkyl polyol glycidyl ether resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] Add 27 parts of 1,4-butanediol diglycidyl ether (Klamard reagent) and 73 parts of EF40 (styrene maleic anhydride copolymer, Sartomer, USA) into the beaker, add 50 parts of MEK (butanone) Or dissolve the above compounds in any solvent mentioned in the present invention, and use an appropriate amount of 2E4MI (2-ethyl-4-methylimidazole, Shikoku Chemicals, Japan) as a curing accelerator to prepare a glue with a solid content of 60-70%. Use 2116 glass fiber cloth to soak the glue solution, and remove the solvent in an oven at 155°C to obtain a prepreg sample.

[0063] Use 4 sheets of 2116 prepreg laminations, each with a 0.5 oz electrolytic copper foil on the top and bottom, and laminate through a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: (1) When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; (2) The pressure is set at 20kg / cm 2 ; (3) curing temperature at 200 ° C, and maintai...

Embodiment 2

[0065] Add 18 parts of 1,4-butanediol diglycidyl ether, 18 parts of HP7200H (dicyclopentadiene epoxy resin, Japan DIC) and 64 parts of EF40 into the beaker, add 50 parts of MEK or any solvent mentioned in the present invention Dissolve it, and use an appropriate amount of 2E4MI as a curing accelerator to make a glue solution with a solid content of 60-70%. Use 2116 glass fiber cloth to soak the glue solution, and remove the solvent in an oven at 155°C to obtain a prepreg sample.

[0066] Use 4 sheets of 2116 prepreg laminations, each with a 0.5 oz electrolytic copper foil on the top and bottom, and laminate through a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: (1) When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; (2) The pressure is set at 20kg / cm 2 ; (3) curing temperature at 200 ° C, and maintain this temperature for 90 minutes. The corresponding properties are shown in Table 1...

Embodiment 3

[0068] Add 23 parts of 1,4-butanediol diglycidyl ether, 10 parts of NC3000H (biphenyl epoxy resin, Japan DIC) and 67 parts of EF40 into the beaker, add 50 parts of MEK or any solvent mentioned in the present invention to dissolve the above The compound is prepared with an appropriate amount of 2E4MI as a curing accelerator to prepare a glue solution with a solid content of 60-70%. Use 2116 glass fiber cloth to soak the glue solution, and remove the solvent in an oven at 155°C to obtain a prepreg sample.

[0069] Use 4 sheets of 2116 prepreg laminations, each with a 0.5 oz electrolytic copper foil on the top and bottom, and laminate through a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: (1) When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; (2) The pressure is set at 20kg / cm 2 ; (3) curing temperature at 200 ° C, and maintain this temperature for 90 minutes. The corresponding proper...

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Abstract

The invention provides a thermosetting alkyl polyol glycidyl ether resin composition and application thereof. The resin composition is prepared by using epoxy resin as a main resin component, wherein the epoxy resin comprises alkyl polyol glycidyl ether which is 50-100 percent of mass of the main resin component. The composition is used for preparing prepregs, laminated boards, printed circuit boards and the like. Since the epoxy resin having an alkyl polyol glycidyl ether molecular structure is adopted as a main resin component, a prepared laminated board has relatively good thermal performance and adhesive performance, and has the advantages of low dielectric performance, low preparation cost, simple method and wide application prospect.

Description

technical field [0001] The invention belongs to an epoxy resin composition, and relates to a thermosetting alkyl polyol glycidyl ether resin composition and an application thereof. Background technique [0002] With the vigorous development of wireless transmission products and the leap forward of high-frequency transmission technology, higher requirements are placed on the dielectric properties of materials. The existing materials of epoxy resin and phenolic resin system can no longer meet advanced applications, especially Meet the requirements of high-frequency printed circuit boards. Fluorine-based resins are used as substrate materials for printed circuit boards with low dielectric loss, but such resins are expensive and difficult to process, and their applications are limited to military and aerospace fields. In addition, polyphenylene ether resin has good mechanical properties and excellent dielectric properties, and has increasingly become the preferred resin materia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/22C08G59/38B32B27/04H05K1/03
CPCC08G59/22C08L63/00
Inventor 袁婵娥罗鸿运
Owner GUANGDONG SHENGYI SCI TECH
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