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Tantalum-copper coating for bone implantation and preparation method of tantalum-copper coating

A technology of copper coating and bone implantation, which is applied in the field of joint replacement and filling materials for human tissue defects, and dental implants, to achieve the effects of reducing infection, preventing dissolution, and good biocompatibility

Inactive Publication Date: 2017-01-11
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of osteocompatibility and antibacterial properties of implants, the present invention provides a tantalum-copper coating for bone implants and its preparation method, which can be used in 3D printing porous titanium alloys by using plasma chemical vapor deposition technology. Metal tantalum-copper coatings are prepared on the scaffolds to solve the problem of biocompatibility of porous titanium alloys. The permanent implant materials obtained by this method are suitable for the mechanical performance requirements of various implant sites, and are conducive to the adhesion and ingrowth of bone cells. Cell growth provides sufficient three-dimensional growth space, and has excellent corrosion resistance, excellent biocompatibility, and has a bactericidal function

Method used

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  • Tantalum-copper coating for bone implantation and preparation method of tantalum-copper coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Put the porous titanium alloy (Ti-6Al-4V) sample into the deposition chamber furnace body 1; put the tantalum pentachloride and copper chloride powder into the evaporation chamber furnace body 2, and its mass ratio is tantalum pentachloride: copper chloride =15:1, then connect the air circuit, check the sealing condition, and pump the ultimate vacuum (10 -4Pa), the whole system was repeatedly purged 3 times with argon to ensure that the oxygen content was minimized. Set the deposition temperature to 350°C, the tantalum pentachloride and copper chloride source evaporation temperature to 200°C, the working vacuum to 5Pa, the hydrogen flow rate to 50SCCM, the plasma power to 100W, the deposition time to 1h, and the thickness of the deposited metal tantalum-copper layer to be 1μm , the proportion of copper is 3%, the compressive strength is 50Mpa, and the modulus of elasticity is 3Gpa.

Embodiment 2

[0035] Put the porous titanium alloy (Ti-6Al-4V) sample into the deposition chamber furnace body 1, put the tantalum pentachloride and copper chloride powder into the evaporation chamber furnace body 2, and its mass ratio is tantalum pentachloride: copper chloride =20:1, then connect the air circuit and clean the pipeline. The deposition temperature was set at 400°C, the evaporation temperature of the tantalum pentachloride and copper chloride sources was 220°C, the working vacuum was 10Pa, the hydrogen flow rate was 100SCCM, the plasma power was 100W, and the deposition time was 1h. Tantalum pentachloride has a melting point of 216°C and a boiling point of 242°C. Therefore, a high degree of vacuum is not required, and sufficient reaction sources can be provided under normal pressure. Stable tantalum pentachloride and copper chloride vapor can be provided at 220°C. In this embodiment, the thickness of the deposited metal tantalum-copper layer is 5 μm, and the proportion of c...

Embodiment 3

[0037] Put the flat titanium alloy (Ti-6Al-4V) sample into the deposition chamber furnace body 1, put the tantalum pentachloride and copper chloride powder into the evaporation chamber furnace body 2, and its mass ratio is tantalum pentachloride: copper chloride =10:1, then connect the air circuit and clean the pipeline. The deposition temperature was set at 450°C, the tantalum pentachloride and copper chloride source evaporation temperature was 240°C, the working vacuum was 10Pa, the hydrogen flow rate was 300SCCM, the plasma power was 150W, and the deposition time was 2h. In this embodiment, the thickness of the deposited metal tantalum-copper layer is 12 μm, and the proportion of copper is 7%. image 3 It is the SEM morphology of L-929 mouse fibroblasts after adhesion of titanium alloy substrate and tantalum coating. The cells on the titanium alloy substrate were round or spindle-shaped, and the growth state was normal, while the cells on the tantalum coating surface were ...

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Abstract

In order to solve problems on bone compatibility and antibacterial property of an implant, the invention provides a tantalum-copper coating for bone implantation and a preparation method of the tantalum-copper coating. The coating is 0.1-50 [mu]M in thickness; and the mass percentage of copper element Cu in the coating is less than or identical to 10% and is more than 0%. On the basis of plasma-enhanced chemical vapor deposition, halides of metallic tantalum and copper are reduced into pure metals by virtue of hydrogen and the pure metals are deposited on the surface of a substrate, so that the tantalum-copper coating is obtained; the problem on biocompatibility of such substrate materials as porous titanium alloy and the like can be solved; the permanent implant material (the tantalum-copper coating) prepared by the method can conform to the requirements of a plurality of implanting positions on mechanical performance, bring about benefits to bone cell adhesion and in-growth and offer a sufficient three-dimensional growth space for bone cells; the tantalum-copper coating is excellent in corrosion resistance and biocompatibility; and meanwhile, the tantalum-copper coating has a bactericidal function.

Description

technical field [0001] The invention relates to medical materials, especially suitable for the technical field of filling materials for dental implants, joint replacements and human tissue defects; in particular, it is a tantalum-copper coating material on the surface of implants and a preparation method thereof. Background technique [0002] Implants such as artificial joints only have a lifespan of 10-15 years due to adverse cell reactions caused by implant loosening and abrasion, which cannot meet the long-term use requirements. At the same time, as a common and disastrous postoperative complication, bacterial infection associated with implant materials has become an important problem to be solved urgently. In addition, both the strength and elastic modulus of clinically used solid implants are much higher than those of human bones, and a "stress shielding effect" will occur, which will lead to bone remodeling in the bones in the stress shielding area, thereby reducing bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61L27/30A61L27/50C23C16/513C23C16/06
Inventor 于晓明刘宗元谭丽丽万鹏任玲杨柯
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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