Tantalum-copper coating for bone implantation and preparation method of tantalum-copper coating
A technology of copper coating and bone implantation, which is applied in the field of joint replacement and filling materials for human tissue defects, and dental implants, to achieve the effects of reducing infection, preventing dissolution, and good biocompatibility
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Embodiment 1
[0033] Put the porous titanium alloy (Ti-6Al-4V) sample into the deposition chamber furnace body 1; put the tantalum pentachloride and copper chloride powder into the evaporation chamber furnace body 2, and its mass ratio is tantalum pentachloride: copper chloride =15:1, then connect the air circuit, check the sealing condition, and pump the ultimate vacuum (10 -4Pa), the whole system was repeatedly purged 3 times with argon to ensure that the oxygen content was minimized. Set the deposition temperature to 350°C, the tantalum pentachloride and copper chloride source evaporation temperature to 200°C, the working vacuum to 5Pa, the hydrogen flow rate to 50SCCM, the plasma power to 100W, the deposition time to 1h, and the thickness of the deposited metal tantalum-copper layer to be 1μm , the proportion of copper is 3%, the compressive strength is 50Mpa, and the modulus of elasticity is 3Gpa.
Embodiment 2
[0035] Put the porous titanium alloy (Ti-6Al-4V) sample into the deposition chamber furnace body 1, put the tantalum pentachloride and copper chloride powder into the evaporation chamber furnace body 2, and its mass ratio is tantalum pentachloride: copper chloride =20:1, then connect the air circuit and clean the pipeline. The deposition temperature was set at 400°C, the evaporation temperature of the tantalum pentachloride and copper chloride sources was 220°C, the working vacuum was 10Pa, the hydrogen flow rate was 100SCCM, the plasma power was 100W, and the deposition time was 1h. Tantalum pentachloride has a melting point of 216°C and a boiling point of 242°C. Therefore, a high degree of vacuum is not required, and sufficient reaction sources can be provided under normal pressure. Stable tantalum pentachloride and copper chloride vapor can be provided at 220°C. In this embodiment, the thickness of the deposited metal tantalum-copper layer is 5 μm, and the proportion of c...
Embodiment 3
[0037] Put the flat titanium alloy (Ti-6Al-4V) sample into the deposition chamber furnace body 1, put the tantalum pentachloride and copper chloride powder into the evaporation chamber furnace body 2, and its mass ratio is tantalum pentachloride: copper chloride =10:1, then connect the air circuit and clean the pipeline. The deposition temperature was set at 450°C, the tantalum pentachloride and copper chloride source evaporation temperature was 240°C, the working vacuum was 10Pa, the hydrogen flow rate was 300SCCM, the plasma power was 150W, and the deposition time was 2h. In this embodiment, the thickness of the deposited metal tantalum-copper layer is 12 μm, and the proportion of copper is 7%. image 3 It is the SEM morphology of L-929 mouse fibroblasts after adhesion of titanium alloy substrate and tantalum coating. The cells on the titanium alloy substrate were round or spindle-shaped, and the growth state was normal, while the cells on the tantalum coating surface were ...
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