Consumer electronic panel machining process based on sapphire technology
A technology for consumer electronics and panel processing. It is applied in the direction of chassis/cabinet/drawer parts, etc. It can solve the problems of poor yield, difficult processing of large-screen sapphire panels, and low efficiency, and improve product strength and appearance. Good quality, improved thermal stress effect
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Embodiment 1
[0036] A consumer electronics panel processing technology based on sapphire technology, which provides a new processing technology for the existing large-screen sapphire panel processing difficulties, low efficiency, and poor yield, especially for processing 2.5D arc-edge contour resistance Abrasion and scratch-resistant consumer electronics panels, especially adopt the following setting methods: use cutting technology, tree technology and surface treatment technology to process sapphire materials into consumer electronics panels. Consumer electronics panels include mobile phone panels and tablet computer panels.
Embodiment 2
[0038] This embodiment is further optimized on the basis of the above-mentioned embodiments. In order to better realize the present invention, the following setting method is adopted in particular: the processing technology of the consumer electronics panel includes and the specific process flow:
[0039] 1) The sapphire is cut from the bar into pieces: the sapphire after quality inspection is cut into blocks, and then the blank margin is 0.15mm~0.2mm unilaterally refined according to the size of the consumer electronics panel, and the block corresponds to the panel The edges of the four corners are rounded, and the size of the rounded corners is 4.5~8R; then the block is cut into pieces by wire cutting equipment;
[0040] 2) Use a double-sided copper disc machine to grind and thin the sheet material on both sides to obtain a thinned panel sheet material. Among them, the unit surface pressure of the grinding machine and the upper plate is controlled at: 0.028kg / cm 2 , combined...
Embodiment 3
[0046]This embodiment is further optimized on the basis of any of the above-mentioned embodiments. In order to better realize the present invention, the following setting method is adopted in particular: the step 2) is specifically: using 2.5 μm diamond liquid, upper and lower The disk speed ratio is 3 / 10, the pressure is controlled at 200kg, the thickness of the thinned panel sheet is controlled at ±0.01mm, TTV≤8μm, WARP≤8μm, and Ra is 360nm.
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