High-strength diamond wire and production method thereof

Abstract

The invention discloses a high-strength diamond wire and a production method thereof. The high-strength diamond wire is prepared from, by weight, 10-18 parts of iron, 12-17 parts of carbon, 4-9 parts of copper, 3-10 parts of aluminum, 1-4 parts of tin, 0.5-2.8 parts of bismuth, 0.6-3.5 parts of chrome, 0.2-1.3 parts of zirconium, 0.17-0.85 part of strontium, 0.22-0.76 part of iridium, 0.15-0.66 part of silicon, 0.08-0.31 part of lead and 0.11-0.25 part of arsenic. The high-strength diamond wire has the beneficial effects that the defects of the prior art can be overcome, and the formula content and method design are reasonable and novel.

Description

technical field [0001] The invention relates to a high-strength diamond wire and a production method thereof, belonging to the field of metal processing. Background technique [0002] Diamond wire is the abbreviation of diamond cutting wire, some people call it diamond cutting wire or diamond wire. Many things in the industry are cut with cutting wires, such as polysilicon slices in the photovoltaic field. The material of the cutting wire is very important. At present, the mainstream silicon wafer cutting wire used in the photovoltaic field is an ultra-fine cutting steel wire with a diameter of about 100 microns. As the name suggests, diamond cutting wire is related to diamond. Generally, it is a diamond cutting wire made by inlaying tiny diamond particles on the wire. We know that diamond is a superhard and widely used cutting material. The diamond wire has diamond micro-sawtooth, which increases the cutting ability of the steel wire and can greatly speed up the cuttin...

AI Technical Summary

Problems solved by technology

Due to the limitation of the material of the existing diamond wire, it is difficult to reduce the diameter of the wire to less than 100 microns, because if the diameter of the diamond wire is too thin, the strength of the diamond wire will be affected, and the wire will be broken during the high-speed cutting process, which will affect the quality of the cutting operation. conduct