SMD diode preparation technology

Abstract

The invention relates to an SMD diode preparation technology, and the technology sequentially comprises the steps: scribing, acid pickling, welding, alkaline cleaning, glue pouring, glue curing, plastic packaging, post curing, electroplating, and testing. The technology is advantageous in that the technology employs O / J jacketing for an SMD diode through the adjustment of a conventional diode preparation process; from the technological aspect, the technology, compared with the GPP jacketing technology, saves a plurality of processes with higher requirements: light resistance, development and yellow light; on the basis of meeting the small-size and thinning packaging requirements, the technology is simpler in manufacturing process, is cheap in material, and is lower in cost; meanwhile, the SMD diode is designed into a unique construction, so as to facilitate the successful gluing.

Description

technical field [0001] The invention belongs to the technical field of microelectronic components, in particular to a preparation process of a chip diode. Background technique [0002] Diode, also known as crystal diode, is an electronic component with unidirectional conduction current. Because of its safety, high efficiency, environmental protection, long life, fast response, small size, and firm structure, it has been gradually promoted and is currently widely used. Used in indicator lights of various electronic products, light sources for optical fiber communication, indicators and lighting of various instruments. [0003] In the diode manufacturing process, it is necessary to protect the chip PN junction of the diode. There are two traditional chip PN junction sealing technologies: [0004] The first is the O / J type chip sheath. Wafer cutting is sliced ​​into grains after wafer diffusion. The edges of the grains are rough and the electrical properties are unstable. It i...

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Problems solved by technology

[0009] (1) Since SMD packaging mostly uses GPP chips, and the manufacturing process of GPP chips is relatively complicated, requiring three photoresist developing mask manufacturing processes, and when molding and slicing, there are often tiny cracks caused by cutting, and the edges show 90 The sharp angle shape is easy to be damaged by collision during processing;

[0010] (2) In addition, GPP glass only covers a part of the cutting surface, and cannot cover the entire cutting surface. Because the thickness of the cover glass is very thin, it can only withstand the reverse voltage of less than 1600V;

[0011] (3) In addition, the passivation glass of GPP chips inevitably contains heavy metals such as lead, which has an immeasurable impact on the environment

[0013] 1. In SMD packaging, due to the limitation of the structure of its pins, it cannot adopt the rubber rolling process in the traditional O / J chip manufacturing process (see Figure 5 ) for gluing, and the curing temperature of the silicone material is lower than the welding temperature, and it cannot be used in the form of gluing first and then soldering pins similar to the GPP chip manufacturing process;

[0014] 2. In the SMD package, due to the limitation of the structure of the pins, pickling cannot be guaranteed, that is, the pickling solution cannot avoid the lead frame, which will affect the performance of the diode

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