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An epoxy resin composition and prepregs and laminates using the same

A technology of epoxy resin and tough epoxy resin, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve low water absorption, heat and humidity resistance, dielectric properties, and incomplete phase separation , poor dielectric properties, etc., to improve toughness and processability, increase glass transition temperature, and excellent dielectric properties

Active Publication Date: 2018-05-29
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Phenolic resin curing epoxy resin is a mature technology, but in the process of reaction between phenolic resin and epoxy, secondary hydroxyl groups are formed, which leads to poor water absorption and dielectric properties of the system, and is relatively brittle.
[0004] In the reaction process of active ester and epoxy resin, there is no secondary hydroxyl group, which has low water absorption, moisture resistance and good dielectric properties, but its cost is relatively expensive, and its use as a single curing agent will lead to vitrification of the system lower transition temperature
[0005] CN101323698A adopts bisphenol A type novolac epoxy resin, brominated bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin and carbonyl-terminated liquid nitrile rubber prepolymer, novolac resin, tetrabromobisphenol A , although it has good toughness, but it has high water absorption and poor dielectric properties, and brominated bisphenol A epoxy resin and carbonyl-terminated liquid nitrile rubber prepolymer are prone to incomplete or non-optimal phase separation. In the best state, the inherent heat resistance and elastic modulus of the epoxy resin are reduced, and it is difficult to ensure that the brittleness and impact resistance are improved without sacrificing heat resistance, mechanical strength and chemical resistance.
[0006] CN103897350A adopts o-cresol phenolic resin, novolak resin and tetrabromobisphenol A, although it improves the excessive brittleness brought by o-cresol phenolic resin+novolak resin curing by adding more tetrabromobisphenol A problem, but the introduction of too much tetrabromobisphenol A will lead to poor heat resistance of the board, and the heat and humidity resistance, water absorption and dielectric properties cannot be guaranteed
[0007] For this reason, how to solve the technical problems of high water absorption, poor moisture resistance, poor dielectric properties and poor brittleness brought about by phenolic resin cured epoxy resin, and find a balance between them to achieve heat resistance and moisture resistance Sexual balance becomes one of the technical problems

Method used

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  • An epoxy resin composition and prepregs and laminates using the same
  • An epoxy resin composition and prepregs and laminates using the same
  • An epoxy resin composition and prepregs and laminates using the same

Examples

Experimental program
Comparison scheme
Effect test

preparation example

[0082] Preparation example: the synthesis of novolac epoxy resin with formula (6) structure

[0083] Add 200g of bisphenol A to a four-necked flask (500mL) equipped with a stirrer, a thermometer, and a condensing reflux device, and dissolve it in a water bath, weigh 2.0g of boron trifluoride ether, add it to a 500mL four-necked flask, and drop Add 60g of dicyclopentadiene to the liquid funnel, and control the dropping rate so that all the dicyclopentadiene is added dropwise within 2 hours, and the temperature is raised to 100°C, kept for 4 hours, and the reaction is completed, washed with water, filtered, recrystallized, and vacuum-dried. A phenolic resin of the following structure was obtained.

[0084]

[0085] Put 25g of the phenolic resin with the dicyclopentadiene bisphenol A structure obtained in the previous step into a four-necked flask, then weigh 100.0g of epichlorohydrin and slowly add it. Add 1 mol of NaOH solution with a mass fraction of 33%, control the speed...

Embodiment 1

[0088]Take a container, add 60 parts by weight of NC-3000H, add an appropriate amount of MEK, stir and dissolve, add 25 parts by weight of core-shell rubber toughened epoxy resin MX-395, 10 parts by weight of tetrabromobisphenol A epoxy resin 153, 5 parts by weight of four-functional modified epoxy resin 1031, 14 parts by weight of active ester curing HPC-8000-65T and 26 parts by weight of novolak resin 2812, stirring, adding an appropriate amount of curing accelerator 4-dimethylaminopyridine and 2 -Methyl-4-ethylimidazole, continue to stir evenly, and finally use a solvent to adjust the solid content of the liquid to 60% to 80% to make a glue. Soak the above glue with glass fiber cloth to form the glue. Use glass fiber cloth to impregnate the above glue solution, and control it to an appropriate thickness, then dry to remove the solvent to obtain a prepreg. The prepregs prepared by using several sheets are superimposed on each other, and a copper foil is laminated on both si...

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Abstract

Provided are an epoxy resin composition as well as a prepreg and a laminated plate using same. The epoxy resin composition comprises: phenol formaldehyde epoxy resin; core-shell rubber toughened epoxy resin and / or core-shell rubber; bromide bisphenol A-type epoxy resin: tetrafunctional epoxy resin: active ester and linear phenol formaldehyde resin composite curing agent. The prepreg and the laminated plate formed by using the epoxy resin composition have good thermal resistance, low dielectric loss, good humidity resistance, low water absorption and good toughness.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to an epoxy resin composition and a prepreg and a laminated board using the same. Background technique [0002] With the development of electronic components in the direction of small, light, thin, high performance and multifunctional, high frequency and high speed signal transmission is brought along. This requires that the dielectric constant and dielectric loss of electronic materials are relatively low, which are related to the structure of the material, and low dielectric constant and low dielectric loss resins generally have in structure: large free volume, low polarizability , Low water absorption, low dielectric constant structure and so on. [0003] Phenolic resin curing epoxy resin is a mature technology, but during the reaction process between phenolic resin and epoxy, secondary hydroxyl groups are formed, resulting in poor water absorption and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/02C08L63/04C08L27/18C08L81/02C08L81/06C08K3/36C08G59/38C08G59/62B32B15/092B32B15/20B32B27/04C08J5/24
CPCB32B15/092B32B25/02C08G59/62C08L63/00C08L63/04
Inventor 何烈相曾宪平
Owner GUANGDONG SHENGYI SCI TECH
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