Superhigh-thermal-conductivity continuous diamond skeleton reinforced composite material and preparation method

Abstract

The invention provides a superhigh-thermal-conductivity continuous diamond skeleton reinforced composite material and a preparation method. The composite material is composed of a continuous diamond reinforced body and a base material. The continuous diamond reinforced body is prepared by depositing diamond films or diamond compound films on diamond particle preforms through a CVD method. The diamond compound films are graphene-wrapped diamond films or carbon-nanotube-wrapped diamond films. The base material is made of metal or polymer. Diamond powder is prepared into the performs, then the diamond films deposit on the surfaces of the performs through the CVD method, the diamond films are formed at the contact positions of adjacent diamond particles, and accordingly continuous heat conducting channels are formed between the isolated diamond particles. The deposited diamond films can serve as heat conducting bridges between the diamond particles, so that the dispersed diamond particles form a connection structure, accordingly high heat conductivity of diamond is fully used by the composite material, and the heat conductivity of the composite material is greatly improved.

Description

technical field [0001] The invention belongs to the field of composite materials, in particular to an ultrahigh thermal conductivity continuous diamond skeleton reinforced composite material and a preparation method thereof. Background technique [0002] In the mid-1960s, Gordon Moore, one of the founders of Intel, proposed the famous Moore's Law, that is, when the price remains constant, the number of components that can be accommodated on an integrated circuit will increase approximately every 18-24 months. Double the increase, and double the performance. In other words, the computer performance that each dollar can buy will more than double every 24 months. This law reveals the speed at which information technology advances. [0003] The trend described by this law has lasted for more than half a century, guiding the continuous development of electronic devices from experimental exploration, material design, to finished product production and marketing. In recent years...

AI Technical Summary

Problems solved by technology

Almost most of the existing research results are focused on diamond particle reinforced metal matrix composites, but the obtained thermal conductivity is far from expected

In 2004, O. Beffort and others used the traditional pressure infiltration method to prepare diamond particle reinforced aluminum matrix composites, but the thermal conductivity of the composites was only 130W / (m K)

In 2008, Russian Ekimov et al prepared a new type of diamond powder / copper composite material by high temperature and high pressure sintering under the limit condition that the mass fraction of diamond particles reached 90-95%. The matrix of this composite material is diamond powder (particle size The range is 0-500μm), copper is used as a binder to make the diamond form a continuous skeleton structure under high temperature and high pressure, and at such a high diamond volume content, the thermal conductivity of the composite material only reaches 900W / (m·K ), indicating that due to the presence of copper bonding phases between the grains, continuous heat conduction channels cannot be formed between diamonds, and the existence of thermal resistance at the interface between the copper bonding phase and diamond seriously affects the thermal enhancement effect of the diamond reinforcement phase

[0007] So far, there is no public report of continuous diamond skeleton reinforced metal matrix or polymer matrix composites