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Epoxy resin encapsulating material for dry type transformer and preparation method for epoxy resin encapsulating material

A dry-type transformer and epoxy resin technology, applied in the field of transformer materials, can solve the problems of polluting the environment, low adhesion, and difficulty in controlling molecular weight

Inactive Publication Date: 2016-03-02
WUHU JINNIU ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional epoxy resin has the following defects: strong odor, strong irritation, and pollutes the environment; it is difficult to control the molecular weight during the synthesis process, resulting in uneven batches and affecting batch stability; the process range is small, and the furnace temperature / The rotational speed has a great influence on the application requirements, and it is difficult to form a smooth surface; the adhesive force is too small, and there are inevitably gaps or air bubbles during use, which makes it difficult to ensure insulation performance, poor heat resistance, and is easily affected by electrothermal aging. The overall performance of the packaging material Decrease continuously, and finally affect the service life of the dry-type transformer

Method used

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Examples

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preparation example Construction

[0012] The invention provides a method for preparing an epoxy resin encapsulating material for dry-type transformers, including:

[0013] 1) Heat and melt epoxy resin, red brick powder, vinyl trimethoxysilane, nano aluminum nitride, nano aluminum oxide, bentonite, calcium carbide, carbon fiber, silk and polyethyl acrylate, and cool and solidify to prepare the modification Epoxy resin

[0014] 2) The modified epoxy resin, organic solvent, pentaerythritol triacrylate, dodecyl dimethyl tertiary amine, polyacrylic acid, zinc phosphate, silicon powder, flame retardant and plasticizer are mixed and heat treated, and then cooled , Grinding to obtain epoxy resin packaging material.

[0015] In step 1) of the present invention, the specific types of epoxy resin and polyethyl acrylate can be selected in a wide range, but in order to make the prepared epoxy resin encapsulating material have more excellent mechanical and electrical properties, Preferably, the epoxy resin is bisphenol A type ep...

Embodiment 1

[0026] 1) Combine epoxy resin (bisphenol A type), red brick powder (particle size of 2μm), vinyl trimethoxysilane, nano aluminum nitride (particle size of 15nm), nano alumina (particle size of 5nm) , Bentonite (particle size of 3nm), calcium carbide, carbon fiber, silk and polyethyl acrylate (weight average molecular weight of 5000) according to the weight ratio of 100:10:55:3:0.7:4:1:7:8:65 Mix, then heat and melt at 140℃ for 1.5h, then cool and solidify at 33℃ to prepare modified epoxy resin;

[0027] 2) The above modified epoxy resin, organic solvent (n-butanol), pentaerythritol triacrylate, dodecyl dimethyl tertiary amine, polyacrylic acid (weight average molecular weight is 7000), zinc phosphate, silicon powder (particles The diameter is 2mm), flame retardant (melamine polyphosphate) and plasticizer (polyamide resin with a weight average molecular weight of 1500) according to the weight of 100:160:30:20:18:20:10:1:1.5 The epoxy resin encapsulating material A1 is prepared by...

Embodiment 2

[0029] 1) Combine epoxy resin (bisphenol F type), red brick powder (particle size 1μm), vinyl trimethoxysilane, nano aluminum nitride (particle size 13nm), nano alumina (particle size 2nm) , Bentonite (particle size is 2nm), calcium carbide, carbon fiber, silk and polyethyl acrylate (weight average molecular weight is 3500) in accordance with the weight ratio of 100:7:40:2.5:0.3:3:0.8:5:6:55 Mix, then heat and melt at 135°C for 1h, then cool and solidify at 30°C to prepare modified epoxy resin;

[0030] 2) Combine the above modified epoxy resin, organic solvent (cyclohexanone), pentaerythritol triacrylate, dodecyl dimethyl tertiary amine, polyacrylic acid (weight average molecular weight of 8000), zinc phosphate, silicon powder (particles) Diameter of 3mm), flame retardant (dimethyl methyl phosphate) and plasticizer (polypropylene oxide rubber with a weight average molecular weight of 5500) according to 100:150:25:17:15:15:7:0.6: The mixture was mixed in a weight ratio of 0.3 an...

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Abstract

The invention discloses an epoxy resin encapsulating material for a dry type transformer and a preparation method for the epoxy resin encapsulating material. The preparation method comprises the steps: (1) carrying out heating melting on epoxy resin, red brick dust, vinyl trimethoxysilane, nano aluminum nitride, nano aluminum oxide, bentonite, calcium carbide, carbon fibers, natural silk and ethyl polyacrylate, and carrying out cooling curing, so as to prepare modified epoxy resin; and (2) mixing the modified epoxy resin, an organic solvent, pentaerythritol triacrylate, dodecyldimethyl tertiary amine, polyacrylic acid, zinc phosphate, silicon powder, a flame retardant and a plasticizer, carrying out heat treatment, and then, carrying out cooling and grinding, thereby preparing the epoxy resin encapsulating material. The epoxy resin encapsulating material prepared by the method has excellent electrical properties and mechanical properties.

Description

Technical field [0001] The invention relates to a transformer material, in particular to an epoxy resin packaging material for dry-type transformers and a preparation method thereof. Background technique [0002] Dry-type transformers are mainly composed of iron core, high voltage coil, low voltage coil, and encapsulation layer. Among them, the iron core, high voltage coil and low voltage coil need to be encapsulated by encapsulation materials to achieve insulation and fixation. At present, the most commonly used encapsulation layer material is epoxy resin. Epoxy resin is a widely used chemical raw material. It has flame-retardant, flame-retardant, and superior electrical properties. It has higher insulation strength than air and transformer oil. The molded transformer coil has high mechanical strength and superior moisture resistance. , Dustproof performance, widely used in urban power grids, especially in places with high requirements for fire prevention and safety. [0003] Tr...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L33/08C08L33/02C08L77/00C08K13/04C08K7/06C08K3/28C08K3/34C08K3/14C08K5/103C08K3/32C08K3/22
Inventor 卞传林高胜吴燕魏叶林彭益峰
Owner WUHU JINNIU ELECTRIC
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