Rigid layer of fixed abrasive polishing roll for Roll-to-Roll chemical-mechanical polishing machine and preparation method of rigid layer

Abstract

The invention discloses a rigid layer of a fixed abrasive polishing roll for a Roll-to-Roll chemical-mechanical polishing machine and a preparation method of the rigid layer. The rigid layer comprises components in percentage by weight as follow: 0.5%-10% of the abrasive, 5%-45% of light-cured resin, 5%-41% of a reactive diluent, 4%-7% of a photoinitiator, 0.05%-5% of an accelerant, 0.05%-3% of a surface performance regulator, 0.05%-5% of an adjuvant, 1%-4% of filler and 0.02% of pigments. The rigid layer of the fixed abrasive polishing roll for the Roll-to-Roll chemical-mechanical polishing machine and the preparation method of the rigid layer have the advantages of simple operation process, low cost, broad market prospect and remarkable economic and social benefits, and facilitates industrialization, popularization and application.

Description

Technical field [0001] The invention involves ultra-precision machining technology in the manufacturing of microelectronics, optoelectronics, and flexible display, especially the rigid layer and preparation method of the Roll-to-Roll chemical mechanical polishing machine. Background technique [0002] Microelectronics, optoelectronics, and integrated circuit manufacturing are one of the important signs to measure a national status and comprehensive national strength. It is the most intense and fastest areas of competition in the world today. Only by mastering advanced microelectronics and optoelectronics manufacturing technologyAnd expanding production scale can survive and develop in fierce market competition.The advanced manufacturing of microelectronics and optoelectronics, as the basic industry, pilot industry, pillar industry and strategic industries of the national economy, is playing an increasingly important role in my country's national economy, national security, people...

AI Technical Summary

Problems solved by technology

[0010] (1) When the Roll-to-Roll polishing machine adopts the traditional free abrasive chemical mechanical polishing technology to polish ultra-thin flexible substrate materials, the free abrasive particles are caused The unevenness of the distribution between the polishing roller and the workpiece makes the material removal rate of each part of the workpiece inconsistent and affects the surface flatness

(2) Since the polishing liquid contains abrasives, some abrasive particles will be embedded on the surface of the workpiece after polishing, which is not easy to clean

(3) Due to the complex composition of the polishing liquid, the removal of the residual polishing liquid on the surface of the workpiece after polishing is a difficult problem for cleaning after CMP

(4) The surface of the fixed abrasive polishing roller is prone to plastic deformation during polishing, and its surface gradually becomes smooth or the micropores are blocked, which reduces its ability to accommodate polishing fluid and remove waste debris, resulting in a decrease in material removal rate over time

Requires constant conditioning and wetting of the polishing pad to restore its surface roughness and porosity, resulting in inefficiencies

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