Rigid layer of fixed abrasive polishing roll for Roll-to-Roll chemical-mechanical polishing machine and preparation method of rigid layer

A technology of consolidated abrasives and chemical machinery, applied in the direction of grinding/polishing equipment, abrasives, grinding devices, etc.

Inactive Publication Date: 2015-12-16
HENAN INST OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] (1) When the Roll-to-Roll polishing machine adopts the traditional free abrasive chemical mechanical polishing technology to polish ultra-thin flexible substrate materials, the free abrasive particles are caused The unevenness of the distribution between the polishing roller and the workpiece makes the material removal rate of each part of the workpiece inconsistent and affects the surface flatness
(2) Since the polishing liquid contains abrasives, some abrasive particles will be embedded on the surface of the workpiece after polishing, which is not easy to clean
(3) Due to the complex composition of the polishing liquid, the removal of the residual polishing liquid on the surface of the workpiece after polishing is a difficult problem for cleaning after CMP
(4) The surface of the fixed abrasive polishing roller is prone to plastic deformation during polishing, and its surface gradually becomes smooth or the micropores are blocked, which reduces its ability to accommodate polishing fluid and remove waste debris, resulting in a decrease in material removal rate over time
Requires constant conditioning and wetting of the polishing pad to restore its surface roughness and porosity, resulting in inefficiencies

Method used

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  • Rigid layer of fixed abrasive polishing roll for Roll-to-Roll chemical-mechanical polishing machine and preparation method of rigid layer
  • Rigid layer of fixed abrasive polishing roll for Roll-to-Roll chemical-mechanical polishing machine and preparation method of rigid layer

Examples

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Effect test

example 1

[0056] The basic structure of the present invention is:

[0057] Both sides of the fixed abrasive polishing roller are respectively provided with a polishing roller left end support mechanism 1 and a polishing roller right end support mechanism 5, and the outer side of the fixed abrasive polishing roller 6 is provided with a fixed abrasive polishing roller matrix layer 4, and the fixed abrasive polishing roller An elastic layer 3 is provided on the outside of the base layer, a rigid layer 2 is provided on the outside of the elastic layer, and a photocuring mold 7 for the rigid layer of the consolidated abrasive polishing roller is set on the outside of the elastic layer.

[0058] The present invention designs and manufactures a rigid layer of a fixed abrasive polishing roller for a Roll-to-Roll chemical mechanical polishing machine, which is used for a rough polishing process, and the thickness of the rigid layer is 1.5 mm; the diameter of the fixed abrasive polishing roller is...

example 2

[0069] Example 2: Design and manufacture a rigid layer of a Roll-to-Roll chemical mechanical polishing machine with a fixed abrasive polishing roller for rough polishing process, the thickness of the rigid layer is 1.5mm; the fixed abrasive polishing roller has a diameter of 300mm and a width of 600mm ,Such as figure 1 shown.

[0070] To prepare 1000g of the mixture:

[0071] (1) Prepare a number of glassware and stirrers,

[0072] (2) Weigh 70g of white corundum abrasive with a particle size of 14μm, 150g of polyurethane acrylate (aliphatic) with a functionality of 4, 150g of polyurethane acrylate (aromatic) with a functionality of 4, and 120g of polyacrylate with a functionality of 4. Ester acrylate, 360g pentaerythritol triacrylate, 40g 2-hydroxy-2-methyl-1-phenylacetone, 10g 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 5g dimethicone , 20g modified polysiloxane, 25g polyethylene wax, 30g 2,6-di-tert-butyl p-cresol, 18g talcum powder, 2g pigment yellow (PY129).

[0...

example 3

[0080] Example 3: Design and manufacture a rigid layer of a Roll-to-Roll chemical mechanical polishing machine with a fixed abrasive polishing roller for rough polishing process, the thickness of the rigid layer is 1.5mm; the fixed abrasive polishing roller has a diameter of 300mm and a width of 600mm ,Such as figure 1 shown.

[0081] To prepare 1000g of the mixture:

[0082] (1) Prepare a number of glassware and stirrers,

[0083] (2) Weigh 60g of white corundum abrasive with a particle size of 7μm, 150g of polyurethane acrylate (aliphatic) with a functionality of 4, 150g of polyurethane acrylate with a functionality of 4 (aromatic), and 120g of modified epoxy acrylate , 200g pentaerythritol triacrylate, 170g pentaerythritol tetraacrylate, 40g 2-hydroxy-2-methyl-1-phenylacetone, 10g2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 10g poly(diphenyl) Methyl silicone oil, 20g modified polysiloxane, 15g aluminum stearate, 5g tung oil, 20g 2,6-di-tert-butyl-p-cresol, 18g talc, ...

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Abstract

The invention discloses a rigid layer of a fixed abrasive polishing roll for a Roll-to-Roll chemical-mechanical polishing machine and a preparation method of the rigid layer. The rigid layer comprises components in percentage by weight as follow: 0.5%-10% of the abrasive, 5%-45% of light-cured resin, 5%-41% of a reactive diluent, 4%-7% of a photoinitiator, 0.05%-5% of an accelerant, 0.05%-3% of a surface performance regulator, 0.05%-5% of an adjuvant, 1%-4% of filler and 0.02% of pigments. The rigid layer of the fixed abrasive polishing roll for the Roll-to-Roll chemical-mechanical polishing machine and the preparation method of the rigid layer have the advantages of simple operation process, low cost, broad market prospect and remarkable economic and social benefits, and facilitates industrialization, popularization and application.

Description

Technical field [0001] The invention involves ultra-precision machining technology in the manufacturing of microelectronics, optoelectronics, and flexible display, especially the rigid layer and preparation method of the Roll-to-Roll chemical mechanical polishing machine. Background technique [0002] Microelectronics, optoelectronics, and integrated circuit manufacturing are one of the important signs to measure a national status and comprehensive national strength. It is the most intense and fastest areas of competition in the world today. Only by mastering advanced microelectronics and optoelectronics manufacturing technologyAnd expanding production scale can survive and develop in fierce market competition.The advanced manufacturing of microelectronics and optoelectronics, as the basic industry, pilot industry, pillar industry and strategic industries of the national economy, is playing an increasingly important role in my country's national economy, national security, people...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/00B24D18/00
Inventor 苏建修李勇峰王占奎姚建国张骞王雅慧郑丽媛付成果
Owner HENAN INST OF SCI & TECH
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