Cavity structure of reaction chamber used in solar cell dry method texturing technology

Abstract

The invention relates to the solar cell manufacturing equipment, plasma etching, and vacuum reaction chamber technology fields and especially relates to a cavity structure of a reaction chamber used in a solar cell dry method texturing technology. A cavity main body is formed through assembling and welding a plurality of stainless steel sheet materials. Surfaces of the stainless steel sheet materials are sprayed and plated with a teflon coating. A teflon coating surface is inlaid with a detachable aluminum alloy liner armor plate. The teflon coating is a PTFE, PFA or FEP material. Sand blasting is performed on the stainless steel sheet material surfaces. The aluminum alloy liner armor plate is an aluminum plate or an aluminum liner armor plate whose surface is processed through deep anodic oxidation. By using the cavity structure of the invention, processing difficulty is decreased and commissioning cost is reduced; deformation is small under vacuum pressure of a large-scale cavity; dismounting is convenient and a problem that connections between the reaction chamber and a gate valve, and the reaction chamber and other cavities are difficult is effectively solved; the aluminum alloy liner armor plate possesses chemical corrosion resistance performance; bombardment of high-energy particles to the coating can be effectively blocked and there is no metal ion pollution to a silicon wafer.

Description

technical field [0001] The invention relates to the technical fields of solar cell sheet manufacturing equipment, plasma etching, and vacuum reaction chambers, in particular to a chamber structure of a reaction chamber used in the dry texturing process of solar cells. Background technique [0002] Plasma etching (RIE) is widely used in the manufacture of microelectronic devices, including semiconductor chips, liquid crystal display thin-film transistor (TFT) drivers, micro-motor systems, solar dry texturing, etc. Its basic idea is that precursor gases containing fluorine and chlorine (such as SF 6 , CF 4 ,CCl 4 , Cl 2 etc.) Under the action of plasma, the free radicals and ions with strong chemical activity such as F and Cl are ionized to etch the substrate surface. In order to form a plasma, it needs to be realized in a vacuum chamber. In general, an effective material capable of withstanding vacuum pressure is steel. But steel or iron can react chemically with F or C...

AI Technical Summary

Problems solved by technology

The main disadvantages of this method are: (1) It is difficult and expensive to process a large reaction chamber; (2) Since the large chamber is under vacuum pressure, and the strength of the aluminum alloy is relatively low, the thickness of the chamber wall increases, and the overall size of the equipment (3) It is relatively difficult to connect the reaction chamber with the gate valve and other chambers

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