Preparation method of adhesive for architectural engineering
A configuration method, construction engineering technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., to achieve the effect of strong practicability
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Embodiment 1
[0015] (1) Stir 110kg ethylene glycol dimethacrylate and 0.06kg p-quinone at 40-50°C for 2 hours at a speed of 300-600r / min to dissolve the reactants completely;
[0016] (2) Add 0.3kg of saccharin, 0.5kg of 1,2,3,4-tetrahydroquinoline and 0.2kg of p-toluenesulfonic acid and stir until completely dissolved;
[0017] (3) Add 11kg of colloidal silicon dioxide, 14kg of polyethylene glycol dioctyl ester, and 15kg of polystyrene. After stirring and dissolving completely, cool to room temperature;
[0018] (4) Add 3.4kg cumene hydroperoxide and stir for 1 hour to make it evenly dispersed;
[0019] The glue solution formulated in step (4) is filled in an opaque polyethylene container, filled into half of the volume of the container, sealed and stored for later use.
Embodiment 2
[0021] (1) Stir 120kg of ethylene glycol dimethacrylate and 0.09kg of p-benzoquinone at 40-50°C for 2 hours at a speed of 300-600r / min to completely dissolve the reactants;
[0022] (2) Add 0.3kg of saccharin, 0.7kg of 1,2,3,4-tetrahydroquinoline and 0.4kg of p-toluenesulfonic acid and stir until completely dissolved;
[0023] (3) Add 10kg of colloidal silicon dioxide, 13kg of polyethylene glycol dioctyl ester, and 16kg of polystyrene. After stirring and dissolving completely, cool to room temperature;
[0024] (4) Add 5.8kg cumene hydroperoxide and stir for 1 hour to make it evenly dispersed;
[0025] The glue solution formulated in step (4) is filled in an opaque polyethylene container, filled into half of the volume of the container, sealed and stored for later use.
Embodiment 3
[0027] (1) Stir 100kg ethylene glycol dimethacrylate and 0.06kg p-quinone at 40-50°C for 2 hours at a speed of 300-600r / min to completely dissolve the reactants;
[0028] (2) Add 0.5kg saccharin, 0.6kg 1,2,3,4-tetrahydroquinoline and 0.2kg p-toluenesulfonic acid and stir until completely dissolved;
[0029] (3) Add 10kg of colloidal silicon dioxide, 12kg of polyethylene glycol dioctyl ester, and 15kg of polystyrene. After stirring and dissolving completely, cool to room temperature;
[0030] (4) Add 6.2kg cumene hydroperoxide and stir for 1 hour to make it evenly dispersed;
[0031] The glue solution formulated in step (4) is filled in an opaque polyethylene container, filled into half of the volume of the container, sealed and stored for later use.
PUM
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Abstract
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Application Information
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