High-viscosity mortar cutting process for cutting silicon chip

Abstract

The invention discloses a high-viscosity mortar cutting process for cutting a silicon chip and belongs to the technical field of cutting of a solar cell silicon chip. The high-viscosity mortar cutting process comprises the following steps: a, preparing mortar by adopting cutting fluid and green silicon carbide sand particles and continuously stirring to prevent sedimentation; b, separating high-density mortar and low-density mortar out of the mortar by a centrifugal separator and continuously stirring the separated high-density mortar and low-density mortar to prevent sedimentation; c, feeding the high-density mortar into a cutting seam to participate in cutting for single crystal cutting and using the low-density mortar for jetting chips in a knife edge after cutting so as to solve the problem of an adhesion phenomenon; d, recovering the high-density mortar and the low-density mortar which are used in the step c together and feeding the recovered high-density mortar and low-density mortar into centrifugal separator again for repeated use. According to the high-viscosity mortar cutting process, high-viscosity mortar can be used in the cutting of the silicon chip so as to promote cutting capacity of the silicon chip and improve a finished product ratio of products and working efficiency.

Description

technical field [0001] The invention relates to the technical field of solar cell silicon wafer cutting. Background technique [0002] Silicon wafer cutting is the process of manufacturing solar photovoltaic cell substrates. At present, the mortar multi-wire cutting process is mainly used, and the steel wire mesh carries the mortar to cut single crystal or polycrystalline silicon rods into many thin slices. The main purpose of the mortar is to bring the abrasive sand into the cutting seam to participate in the cutting. [0003] The mortar is composed of cutting fluid and wear-resistant sand particles. The cutting fluid is generally made of polyethylene glycol (PEG) base or oil base with good wettability, strong removal ability and excellent dispersion characteristics for silicon carbide abrasives. compound. Generally, PEG with a molecular weight of 300-500 and a viscosity of 30-55mPa.s is used in photovoltaic slices. Due to the different cutting processes, the selected vis...

AI Technical Summary

Problems solved by technology

Therefore, the viscosity of the mortar cannot be increased, the processing efficiency cannot be improved, and quality problems such as line marks often occur due to the cutting ability.

Images