Halogen-free flame retardant epoxy resin used for electronic packaging material and preparation method of halogen-free flame retardant epoxy resin

Abstract

The invention discloses a halogen-free flame retardant epoxy resin used for an electronic packaging material and a preparation method of the halogen-free flame retardant epoxy resin. The flame retardant epoxy resin comprises the following components in parts by weight: 50-70 parts of liquid epoxy resin, 2-10 parts of a reactive diluent, 5-15 parts of a curing agent, 0.2-2 parts of a curing accelerator and 2-20 parts of phosphoric acid doped polyaniline nanometer material, wherein the phosphoric acid doped polyaniline nanometer material has the inflaming retarding effect in the epoxy resin, and a large number of P-N bond intermediates generated during the combustion process of the phosphoric acid doped polyaniline nanometer material is a phosphorylation agent which has better inflaming retarding effect than the conventional phosphorus compound; the nitrogen content of the prepared epoxy resin is 0.8-5 wt%, and the phosphorus content of the prepared epoxy resin is 0.2-3 wt%. According to the invention, the flame resistance of an aromatic nucleus, the flame retardance of a nitrogen heterocyclic ring and organic phosphorus as well as the toughening effect of a polyaniline nano-structure are combined, so that the synchronous improvement of the multiple properties of the material is realized, and further, the requirements on the toughness and halogen-free flame retardance of the electronic component packaging material are met.

Description

Technical field: [0001] The invention belongs to the field of electronic packaging materials, and in particular relates to a halogen-free flame-retardant epoxy resin electronic potting glue and a preparation method thereof. Background technique: [0002] Epoxy resin electronic potting adhesive has high strength, excellent adhesion, chemical corrosion resistance, electrical insulation, chemical corrosion resistance, good molding process, low shrinkage, small linear expansion coefficient, low cost, etc. It is widely used in the potting of electronic components and is one of the most important electronic packaging materials at present. However, epoxy resin, like most polymer materials, is a flammable substance and is easy to cause fire, so it needs to be treated with flame retardant and flame retardant added. In recent decades, halogenated flame retardants and antimony trioxide-based flame retardant additives have been used the most. Their advantages are high-efficiency flame ...

AI Technical Summary

Problems solved by technology

However, flame retardants such as antimony trioxide have been listed as carcinogens, while halogenated flame retardants release a large amount of hydrogen halide when burned, which is not only toxic but also highly corrosive, and will produce carcinogens such as dioxin As well as substances that destroy the ozone layer, which have seriously affected human health and the environment on which to live, they have been banned by countries around the world in recent years