A kind of surface protection agent for phenolic foam insulation board

Abstract

The invention relates to a surface protecting agent for a phenolic foam heat-insulating plate. The surface protecting agent is composed of the following raw materials in parts by weight: 50-55 parts of resin acrylic emulsion, 8-10 parts of an ethylene emulsion, 5-10 parts of drying oil, 5-10 parts of sodium substrate white bentonite, 2-3 parts of a dispersing agent, 1-2 parts of a wetting agent, 1-2 parts of a defoaming agent, 2-3 parts of a coalescing agent, 3-5 parts of a silane coupling agent, 6-10 parts of an inert filler, 3-5 parts of a coloring agent and 15-20 parts of clean water, which are stirred for 30 min until being stirred uniformly. The surface protecting agent enables the surface of the phenolic foam heat-insulating plate to be entirety closed, not only is the condition that moisture, in a polymer cement-based adhesive, cement-based plastering mortar or anti-crack mortar, or hydrated cement is alkaline, and is in contact with the acidic phenolic foam heat-insulating plate to react avoided, but also the bonding strength of the phenolic foam heat-insulating plate and the plastering mortar is improved, so that the construction is relatively convenient, and the exterior wall external heat-insulating system is enabled to be safe, stable and durable.

Description

technical field [0001] The invention relates to a non-cement-based concrete surface protection agent for a thin layer (film-forming thickness not greater than 1 mm) for phenolic foam insulation boards, which is sprayed, brushed or dipped on one side of the insulation board on the surface of the phenolic foam insulation board , Double-sided or hexahedral and dry, can prevent the phenolic foam insulation board from escaping acidic isolation or sealing technology after contact with any humidity. Background technique [0002] In recent years, the production technology of phenolic foam insulation board has developed rapidly. It is not only used in the fields of aviation, transportation, HVAC and air conditioning, but also widely used in the external insulation and fire protection requirements of buildings according to the development of energy-saving buildings and fire protection requirements. However, the application of phenolic foam insulation board also has the following defec...

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Problems solved by technology

[0003] 1. Especially in the continuous expansion of the application in the construction industry, the phenolic foam insulation board without interface treatment is bonded to the base of the wall with a general-purpose polymer cement-based adhesive, or with a general-purpose polymer cement-based plastering mortar. Engineering quality problems gradually appear in the application, the main reason is that after the acidity (pH ≤ 4) of the PF insulation board itself contacts with the cement (alkaline pH ≥ 12.5,), a chemical reaction occurs between the phases (acid-base neutralization) to reduce the adhesion Strength, which has led to many engineering quality accidents;

[0004] 2. At present, domestic synthetic phenolic foam insulation boards are modified phenolic foam insulation boards. Compared with polyurethane rigid foam and polystyrene insulation boards, phenolic foam insulation boards in various countries still have certain common problems of "sourness, brittleness, and powder". It is more serious when the phenolic foam insulation board is in contact with water, moisture, condensation or under the condition of sunlight;

[0005] 3. At present, there are mainly organic acrylic emulsions, styrene-acrylic emulsions, ethylene-vinyl acetate copolymer (EVA) emulsions or dispersible latex powders in China. After diluting with simple water, add a thickener and mix well before spraying. Or paint on the surface of the phenolic foam insulation board, relying on a large amount of water to volatilize and solidify into a film, the application effect is extremely poor, it is delaminated with the phenolic insulation board, the drawing strength is low, the drying film is slow, and there is stickiness, so it cannot be industrially produced continuously. The main disadvantage of this type of method is that the bonding strength between the coating film and the surface of the phenolic foam insulation board is extremely low, which instead becomes a reaction to the release of the film and seriously affects the quality of the building insulation project.

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