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Reactive pressure-sensitive adhesive having performance of structural adhesive after being cured, and preparation method thereof

A pressure-sensitive adhesive, reactive technology, applied in the direction of adhesives, film/sheet adhesives, adhesive types, etc., can solve the problem that the bonding strength cannot reach the bonding level of structural adhesives and the existence of storage and other issues, to achieve the effect of good storage stability

Inactive Publication Date: 2013-09-04
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] At present, almost all similar patents at home and abroad introduce epoxy resin or epoxy compounds into acrylate photopolymers, and the bonding strength after curing is far below the bonding level of structural adhesives, and the storage performance is still low. There is a problem

Method used

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  • Reactive pressure-sensitive adhesive having performance of structural adhesive after being cured, and preparation method thereof
  • Reactive pressure-sensitive adhesive having performance of structural adhesive after being cured, and preparation method thereof
  • Reactive pressure-sensitive adhesive having performance of structural adhesive after being cured, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] 60 parts of butyl acrylate, 12 parts of styrene, 9 parts of methacrylic acid and 19 parts of methyl methacrylate were subjected to free radical polymerization and discharged. That is component a.

[0031] Take 50 parts of component a and dissolve in 50 parts of ethanol, and add 40 parts of bisphenol A epoxy resin E51 and 4 parts of latent curing agent dicyandiamide for epoxy resin.

[0032] Stir until completely dissolved.

[0033] The solvent-based pressure-sensitive adhesive was coated on a substrate made of clean 25 μm polyethylene terephthalate without inert treatment and a 25 μm polyethylene terephthalate coated with a release agent. ester, and then placed at room temperature for 2 hours, all covered with a 25 μm polyethylene terephthalate substrate coated with a release agent. Thereafter, it was cut into widths of 25 mm to make single-sided adhesive tapes and double-sided adhesive tapes with a thermosetting pressure-sensitive adhesive layer thickness of 30 μm. ...

Embodiment 2

[0035] 68 parts of butyl acrylate, 8 parts of styrene, 12 parts of methacrylic acid and 12 parts of methyl methacrylate were subjected to free radical polymerization and discharged. That is component a.

[0036] Take 50 parts of component a and dissolve in 60 parts of acetone, and add 46 parts of bisphenol A epoxy resin E51 and 2.6 parts of latent curing agent 2-methylimidazole for epoxy resin.

[0037] Stir until completely dissolved.

[0038] The solvent-based pressure-sensitive adhesive was coated on a substrate made of clean 25 μm polyethylene terephthalate without inert treatment and a 25 μm polyethylene terephthalate coated with a release agent. ester, and then placed at room temperature for 2 hours, all covered with a 25 μm polyethylene terephthalate substrate coated with a release agent. Thereafter, it was cut into widths of 25 mm to make single-sided adhesive tapes and double-sided adhesive tapes with a thermosetting pressure-sensitive adhesive layer thickness of 30...

Embodiment 3

[0040] 71 parts of butyl acrylate, 7 parts of styrene, 5 parts of methacrylic acid and 17 parts of methyl methacrylate were polymerized and discharged. That is component a.

[0041] Take 50 parts of component a and dissolve in 70 parts of toluene, and add 54 parts of bisphenol A epoxy resin E51 and 3 parts of latent curing agent 2-ethylimidazole for epoxy resin.

[0042] Stir until completely dissolved.

[0043] The solvent-based pressure-sensitive adhesive was coated on a substrate made of clean 25 μm polyethylene terephthalate without inert treatment and a 25 μm polyethylene terephthalate coated with a release agent. ester, and then placed at room temperature for 2 hours, all covered with a 25 μm polyethylene terephthalate substrate coated with a release agent. Thereafter, it was cut into widths of 25 mm to make single-sided adhesive tapes and double-sided adhesive tapes with a thermosetting pressure-sensitive adhesive layer thickness of 30 μm.

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Abstract

The invention relates to a reactive pressure-sensitive adhesive having the performance of a structural adhesive after being cured, and a preparation method thereof. The pressure-sensitive adhesive is prepared from the following materials in parts by weight: a) 100 parts of soluble acrylate copolymer; b) 80 to 120 parts of epoxy resin; and c) 8 to 12 parts of epoxy resin latency curing agent, wherein the soluble acrylate copolymer is formed by polymerizing the following raw materials in a free radical polymerization reaction manner: 50% to 65% of alkyl ester with the acrylic carbon atom number from 1 to 8, 5% to 15% of styrene, 10% to 15% of alkyl ester with the methylacrylic acid carbon atom number from 1 to 8 and 35% to 5% of alkyl acrylate. At the normal temperature, under the action of the plasticization of the epoxy resin to the acrylate polymer, the pressure sensitivity of the acrylate polymer is generated, so that the pressure-sensitive adhesive can be used as an ordinary pressure-sensitive adhesive. After the pressure-sensitive adhesive is heated, the curing agent reacts with the epoxy resin; and the cured epoxy resin is toughened by the acrylic ester, so that the pressure-sensitive adhesive has the adhesion strength of the structural adhesive.

Description

technical field [0001] The invention belongs to the technical research field of polymer materials, and particularly relates to a preparation method of a pressure-sensitive adhesive that can be cured into a high-strength structural adhesive at a later stage. The pressure-sensitive adhesive can be directly coated on the adhered material for direct use, and can also be used to make It can be used as pressure sensitive adhesive tape or double-sided tape. The reactive pressure-sensitive adhesive prepared by the invention can be used like ordinary pressure-sensitive adhesive tape before curing, and can be used for temporary positioning and fixing. After heating and curing, it can produce properties such as bonding strength at the level of structural adhesives. Background technique [0002] Pressure Sensitive Adhesive (PSA) is a kind of polymer material with its own special viscoelasticity, which can achieve considerable adhesive strength in a short period of time by applying a sma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/08C09J163/00C09J7/02
Inventor 张军营赵迎波程珏史翎林欣
Owner BEIJING UNIV OF CHEM TECH
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