Adsorption carrier for vapor deposition material for vapor deposition of antifouling film
A technology of adsorption carrier and evaporation material, applied in vacuum evaporation coating, metal material coating process, sputtering coating, etc., can solve problems such as broken steel wool, spots of anti-fouling film, and difficult porosity management, and achieve The effect of improving the friction resistance and ensuring the uniformity
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Embodiment 1
[0037] In this embodiment, a sintered body formed with a single metal iron as a raw material is selected. The melting point of metallic iron is 1535°C, and the sintering temperature is 1000°C-1500°C. Will not react with vapor deposition materials. And it has good ductility and thermal conductivity, low price, and is suitable for mass industrial production.
[0038] Table 2
[0039]
[0040] Table 2 is the friction test result table of the antifouling film evaporated using the adsorption carrier of this embodiment, which records the water drop contact angle of the antifouling film after 0-27000 times of friction. It can be seen that when the antifouling film of the adsorption carrier of this embodiment is used After the film has been rubbed 17,000 times, the water droplet contact angle of the antifouling film still meets the requirements, and the number of rubbing times far exceeds that of the antifouling film vapor-deposited on the adsorption carrier of the prior art. ...
Embodiment 2
[0042] In this embodiment, a sintered body formed from a single metal material, stainless steel, is selected. Stainless steel is an alloy with iron and chromium as the main elements. It is also divided into different types of stainless steel because it contains nickel, carbon, molybdenum, titanium, columbium, selenium, etc. Generally speaking, stainless steel has a high melting point, a sintering temperature of 1000°C-1350°C, high strength, and a wide range of uses.
[0043] table 3
[0044]
[0045] Table 3 is the friction test result table of the antifouling film evaporated using the adsorption carrier of this embodiment, which records the water droplet contact angle of the antifouling film after 0-34000 times of friction. It can be seen that when the antifouling film of the adsorption carrier of this embodiment is used After the film has been rubbed 29,000 times, the water droplet contact angle of the anti-fouling film still meets the requirements, and the number of fr...
Embodiment 3
[0047] In this embodiment, a sintered body formed with a single metal copper as a raw material is selected. The melting point of metallic copper is about 1083°C, which is lower than that of iron and stainless steel. For the sintered body obtained from copper, the sintering temperature is relatively low, ranging from 500°C to 1050°C, so the sintering process is relatively simple.
[0048] Table 4
[0049]
[0050] Table 4 is the friction test result table of the antifouling film evaporated using the adsorption carrier of this embodiment, which records the water droplet contact angle of the antifouling film after 0-37000 times of friction. It can be seen that when the antifouling film of the adsorption carrier of this embodiment is used After the film has been rubbed for 26,000 times, the water drop contact angle of the antifouling film still meets the requirements, and with the increase of the number of subsequent frictions, the change of the water drop contact angle is ver...
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