Selective iron etching solution and etching method

Abstract

The invention discloses selective iron etching solution, comprising 4-250g / L of a water-soluble aromatic nitro-compound, 2-10mol / L of inorganic acid, 0.1-2g / L of a corrosion inhibitor and the balance of deionized water. A novel selective etching system is adopted; the etching method is fast in iron etching speed, stable in etching speed, even in etched surface, small in side corrosion, regular in side boundary and small in copper etching speed; the iron etching speed and the copper etching speed are greater than or equal to 200; the etching solution does not contain the materials with large volatility, such as hydracids or nitric acid; the etching solution is greener and more environment-friendly; and the etching solution is suitable for selective etching of the surface of a copper base material, and is also suitable for refined processing of carbon steel or low-alloy steel and members thereof.

Description

technical field [0001] The invention relates to the technical field of metal surface etching processing, in particular to a selective iron etching solution and an etching method. Background technique [0002] With the rapid development of the electronics industry, IC substrates have become an important electronic product. There are various manufacturing processes for carrier boards. Copper plating on iron substrates is an important process for making substrates. The process principle is as follows: first, one side of the cold-rolled carbon steel sheet, that is, the iron substrate, is plated with copper to form a contour pattern, and then the iron substrate is removed by chemical etching to retain the pure copper contour pattern, and further processed to form a carrier. [0003] There have been many reports on iron chemical etching solutions: the patent publication No. CN101173360A discloses a stainless steel etching solution, the main components of which include ferric chl...

AI Technical Summary

Problems solved by technology

Although this etching solution has the advantages of strong etching ability, high etching rate, and good uniformity in a large area, and the corrosion rate of this type of etching solution on copper is low, irritating gas is released during use. Unable to meet the clean environment required for IC substrate production

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