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Thinning etching solution additive for AMOLED substrate glass

A glass thinning and etching solution technology is applied in the field of etching solution additives for AMOLED substrate glass thinning, which can solve the problems of difficult to etch the slope at the edge, less etching amount, and rough board surface, so as to achieve process stability and reduce usage. The effect of quantity and long service life

Inactive Publication Date: 2018-03-13
HEFEI HUIKE JINYANG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing etching solution has the following deficiencies in the production and use process: 1. The price is expensive; 2. The service life is short and the amount of etching is small; 3. The etched board surface is prone to coarse pitting, which requires subsequent processing; 4. Large-scale When etching the negative pattern on the surface, it is difficult to etch the slope at the edge

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Example 1 An additive for etching solution for AMOLED substrate glass thinning, which is composed of the following components according to weight percentage: 17% hydrofluoric acid, 8% phosphoric acid, 15% nitric acid, 7% sodium hypochlorite, 6% brightener, and Leveling agent 5%, surfactant 5%, solvent 38%.

[0014] The surfactant is a mixture composed of nonylphenol polyoxyethylene ether, polyether, ethylene glycol butyl ether and a pH regulator.

[0015] The brightener is one or a combination of N,N-dimethyldithioformamide propane sulfonate, polyethyleneimine alkyl compound.

[0016] The leveling agent is one or more combinations of aminotriethanol, polyethyleneimine alkyl compound, N,N-dimethyldithioformamide propanesulfonate and hydroxypropanesulfonate pyridinium salt .

[0017] The solvent is deionized water.

Embodiment 2

[0018] Example 2 An additive for etching solution for AMOLED substrate glass thinning, which is composed of the following components according to weight percentage: 21% hydrofluoric acid, 14% phosphoric acid, 24% nitric acid, 12% sodium hypochlorite, 13% brightener, and Leveling agent 9%, surfactant 10%, solvent 54%.

[0019] The surfactant is a mixture composed of nonylphenol polyoxyethylene ether, polyether, ethylene glycol butyl ether and a pH regulator.

[0020] The brightener is one or a combination of N,N-dimethyldithioformamide propane sulfonate, polyethyleneimine alkyl compound.

[0021] The leveling agent is one or more combinations of aminotriethanol, polyethyleneimine alkyl compound, N,N-dimethyldithioformamide propanesulfonate and hydroxypropanesulfonate pyridinium salt .

[0022] The solvent is deionized water.

Embodiment 3

[0023] Example 3 An additive for etching solution for AMOLED substrate glass thinning, which is composed of the following components according to weight percentage: 19% of hydrofluoric acid, 11% of phosphoric acid, 19% of nitric acid, 11% of sodium hypochlorite, 9% of brightener, and Leveling agent 7%, surfactant 8%, solvent 45%.

[0024] The surfactant is a mixture composed of nonylphenol polyoxyethylene ether, polyether, ethylene glycol butyl ether and a pH regulator.

[0025] The brightener is one or a combination of N,N-dimethyldithioformamide propane sulfonate, polyethyleneimine alkyl compound.

[0026] The leveling agent is one or more combinations of aminotriethanol, polyethyleneimine alkyl compound, N,N-dimethyldithioformamide propanesulfonate and hydroxypropanesulfonate pyridinium salt .

[0027] The solvent is deionized water.

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PUM

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Abstract

The invention discloses an etching solution additive for AMOLED substrate glass thinning, which is composed of the following components according to weight percentage: 17-21% of hydrofluoric acid, 8-14% of phosphoric acid, 15-24% of nitric acid, and 7-7% of sodium hypochlorite 12%, brightener 6-13%, leveling agent 5-9%, surfactant 5-10%, solvent 38-54%. The etching solution prepared by the additive of the present invention has long service life and stable process; the etching solution prepared by the additive of the present invention, the etched plate surface is smooth and smooth, and no subsequent processing is required; the etching solution prepared by the additive of the present invention can stabilize the etching rate and improve the etching coefficient ratio and uniformity, and the addition of surfactants can increase the etching speed; effectively reduce the amount of hydrochloric acid used, which is beneficial to production efficiency in the process, and is economical and practical, the preparation method is simple, and no harmful gas is generated during the etching process.

Description

technical field [0001] The invention relates to the technical field of AMOLED, in particular to an etchant additive for AMOLED substrate glass thinning. Background technique [0002] Acid etching is an important step in the production process of AMOLED glass substrates. As the etching progresses, the concentration of copper ions in the etching solution becomes higher and higher, and the etching speed becomes slower and slower. If it is not replaced, the etching progress and quality will be seriously affected. Acidic etching waste liquid not only contains a large amount of copper ions, but also contains other valuable chemical substances. Therefore, manufacturers will basically dispose of it by themselves or entrust qualified merchants to recycle it. [0003] The existing etching solution has the following deficiencies in the production and use process: 1. The price is expensive; 2. The service life is short and the amount of etching is small; 3. The etched board surface is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C15/00
CPCC03C15/00
Inventor 白航空
Owner HEFEI HUIKE JINYANG TECH
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