Consolidation grinding material wire-electrode cutting method and cutting fluid

Abstract

The invention relates to a consolidation grinding material wire-electrode cutting method and dedicated cutting fluid. The existing consolidation grinding material wire-electrode cutting is bad in cutting surface quality, possesses a plurality of deep check lines and tiny damage and is high in surface roughness, and meanwhile, swarf and dropped grinding material grains are easily adhered between the cutting line surface and grinding material grains to lower cutting force of cutting lines. The invention provides the novel consolidation grinding material cutting method and the dedicated cutting fluid used for the consolidation grinding material cutting method. Due to the development of the cutting fluid formula, the consolidation grinding material wire-electrode cutting method and the dedicated cutting fluid used for the consolidation grinding material cutting method overcome the technical limits, obviously improve check lines and tiny damage of the cutting surface, reduce roughness, reduce phenomenon of swarf attachment, improve cutting efficiency, reduce surface modification processing requirements such as grinding, polishing and the like of the cutting surface after cut and reduce cutting cost and follow-up process cost.

Description

technical field [0001] The invention relates to a method for wire cutting of solid materials and a special cutting fluid for the method. Background technique [0002] Existing methods for wire cutting of solid materials, such as but not limited to hard and brittle crystal materials including silicon, aluminum oxide, silicon carbide, diamond, etc. It includes the steps: use one or more fixed abrasive cutting wires, arrange them through the wiring system, make them perform cutting motions to cut the object to be cut, and at the same time, make the cutting fluid infiltrate or immerse the cutting front of the object to be cut, that is, the cutting wire cuts into the object to be cut Cut the contact surface part of the object. Among them, the cutting is completed by the scraping and cutting action of the abrasive particles on the fixed abrasive cutting line; the cutting fluid infiltrates or immerses in the way of liquid flow flushing or flow immersion, disperses and takes away t...

AI Technical Summary

Problems solved by technology

[0003] Fixed abrasive wire cutting usually has high cutting efficiency, however, the quality of the cut surface is poor, usually with a large number of deep line marks, micro damage, and high surface roughness

At the same time, chips and dropped abrasive particles are easy to adhere between the abrasive particles on the surface of the cutting wire, which reduces the cutting force of the cutting wire, increases the amount of cutting wire, and costs more