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Transparent organic silicon resin for room temperature resin transfer moulding and preparation method of transparent organic silicon resin

A technology of resin transfer molding and silicone, applied in the field of transparent silicone resin for room temperature resin transfer molding and its preparation, to achieve excellent dielectric properties and thermal stability, wide source of raw materials, and good compatibility

Active Publication Date: 2013-05-08
扬州华上新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, silicone resins with good storage stability have not been reported

Method used

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  • Transparent organic silicon resin for room temperature resin transfer moulding and preparation method of transparent organic silicon resin
  • Transparent organic silicon resin for room temperature resin transfer moulding and preparation method of transparent organic silicon resin
  • Transparent organic silicon resin for room temperature resin transfer moulding and preparation method of transparent organic silicon resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] 1. Synthesis of polymethylphenyl vinyl siloxane

[0035] Under nitrogen atmosphere, after mixing 12.30 g methyltrimethoxysilane, 10.98 g diphenyldimethoxysilane and 43.90 g vinyltrimethoxysilane evenly, add it dropwise to 60 mL at a rate of 20 drops / min In a solvent mixed with ethanol and 15.90 g of deionized water, the pH was adjusted to 3 with hydrochloric acid, and the reaction was controlled at a temperature of 40° C. for 3 hours. Then 30.00 g of hexamethyldisiloxane and 3.33 g of deionized water were added to react at 40° C. for 1.5 hours, and then heated to 70° C. for 6 hours. Cooling, standing for stratification, and obtaining the oily substance in the lower layer, drying in vacuum, it is polymethylphenyl vinyl siloxane, its molecular weight is 4930, and Si-CH=CH is measured by iodometric method. 2 The content is 2.34×10 -3 mol / g, viscosity at 20°C is 2017 mPa.s. Its infrared spectrogram, proton nuclear magnetic resonance spectrum and silicon nuclear magn...

Embodiment 2

[0054] 1. Synthesis of polymethylphenyl vinyl siloxane

[0055] Under nitrogen atmosphere, after mixing 10.30 g methyltrimethoxysilane, 4.12 g diphenyldimethoxysilane and 10.30 g vinyltrimethoxysilane, dropwise added to 80 mL In a solvent mixed with ethanol and 5.15 g of deionized water, the pH was adjusted to 3.5 with hydrochloric acid, and the reaction was controlled at a temperature of 45° C. for 2.5 hours. Then 13.91 g of hexamethyldisiloxane and 2.58 g of deionized water were added to react at 45° C. for 1.5 hours, and then heated to 80° C. for 6 hours. Cooling, standing to separate layers, get the oily substance in the lower layer, dry it in vacuum, it is polymethylphenyl vinyl siloxane, its molecular weight is 5029, Si-CH=CH 2 The content is 2.26×10 -3 mol / g, the viscosity at 20°C is 2136 mPa.s.

[0056] 2. Synthesis of hyperbranched polysiloxane containing silicon hydrogen bond and silicon methyl group

[0057] Under a nitrogen atmosphere, after mixing 14....

Embodiment 3

[0061] 1. Synthesis of polymethylphenyl vinyl siloxane

[0062] Under nitrogen atmosphere, after mixing 13.40 g methyltrimethoxysilane, 8.04 g diphenyldimethoxysilane and 12.06 g vinyltrimethoxysilane evenly, add dropwise to 70 mL at a rate of 15 drops / min In a solvent mixed with ethanol and 6.80 g of deionized water, the pH was adjusted to 2.5 with hydrochloric acid, and the reaction was controlled at a temperature of 30° C. for 3 hours. Then 17.42 g of hexamethyldisiloxane and 2.68 g of deionized water were added to react at 30° C. for 2 hours, and then heated to 70° C. for 6 hours. Cooling, standing to separate layers, get the lower layer of oil, vacuum drying, that is, polymethylphenyl vinyl siloxane, its molecular weight is 5324, Si-CH=CH 2 The content is 2.35×10 -3 mol / g, viscosity at 20°C is 2260 mPa.s.

[0063] 2. Synthesis of hyperbranched polysiloxane containing silicon hydrogen bond and silicon methyl group

[0064]Under a nitrogen atmosphere, after mixing 16.0...

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Abstract

The invention relates to transparent organic silicon resin for room temperature resin transfer moulding and a preparation method of the transparent organic silicon resin. The transparent organic silicon resin is prepared by the reaction of polymethyl phenyl vinyl siloxane, a silicon-containing hydrogen bond, silicon methyl hyperbranched polysiloxane and a platinum catalyst. Si-CH=CH2 content of the polymethyl phenyl vinyl siloxane is (2.02-2.48)*(10-3)mol / g; Si-CH3 content of each of the silicon-containing hydrogen bond and the silicon methyl hyperbranched polysiloxane is (2.97-4.08)*(10-3)mol / g, and Si-H content is (2.45-3.25)*(10-3)mol / g. The organic silicon resin provided by the invention has a viscosity of 200-400mPa.s at room temperature, and the working life is longer than 4 months; when the organic silicon resin is applied to the room temperature resin transfer moulding process, the obtained condensate has excellent light transmission, dielectric performance and heat performance; and according to the preparation method adopted by the invention, the operation is simple, and environmental protection is realized.

Description

technical field [0001] The invention relates to a silicone resin and a preparation method thereof, in particular to a transparent silicone resin for room temperature resin transfer molding and a preparation method thereof. Background technique [0002] Resin Transfer Molding (Resin Transfer Molding, referred to as RTM) is a processing technology of resin-based composite materials developed rapidly in the 1990s. It injects a liquid low-viscosity, solvent-free thermosetting resin into a closed mold. It flows, impregnates the reinforced material that has been reasonably laid or preformed, and solidifies at a certain temperature. This technology can effectively reduce equipment cost and molding cost without prepreg and autoclave. The RTM molding process puts forward strict requirements on the manufacturability of the resin, that is, the viscosity of the resin at the molding temperature is 200-500 mPa.s, and the storage period of the resin is at least greater than 4 hours. In a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G81/00C08G77/20C08G77/12
Inventor 梁国正朱美云顾嫒娟袁莉
Owner 扬州华上新材料有限公司
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