Magneto-rheological effect viscoelastic clamping electroceramic substrate flexible grinding and polishing device and method

Abstract

The invention relates to a magneto-rheological effect viscoelastic clamping electroceramic substrate flexible grinding and polishing device and a flexible grinding and polishing method. The device comprises a grinding head main shaft, a base plate, a magnetic sleeve, a high-magnetic-induction-intensity magnetic body, a grinding disc trimming sleeve, a grinding disc and a grinding disc main shaft, wherein the magnetic sleeve has the same shape and the same size as the ultra-thin hard crispy material substrate, the base plate provided with the high-magnetic-induction-intensity magnetic body is embedded and fixed onto the magnetic sleeve by fixing screws for forming the flexible grinding and polishing head, the grinding disc is fixedly arranged on the grinding disc main shaft, the grinding disc trimming sleeve is arranged on the grinding disc, and magneto-rheological work liquid is added onto the upper surface of the grinding disc through a circulation pipe. The electroceramic substrate flexible grinding and polishing device based on the magneto-rheological effect can be used for carrying out grinding and polishing on the small-thickness great-warping-deformation ultra-thin hard crispy material substrate which can easily fracture in the grinding processing process and is difficult to install and clamp, the design is reasonable, and convenience and practicability are realized. The magneto-rheological effect viscoelastic clamping electroceramic substrate flexible grinding and polishing method has the advantage that the operation is simple.

Description

technical field [0001] The invention relates to a flexible polishing device and method for an electric porcelain substrate clamped by magnetorheological effect and viscoelasticity, and belongs to the innovative technology of the flexible polishing device and method for electric porcelain substrate clamped by magnetorheological effect and viscoelasticity. Background technique [0002] With the development of microelectronic technology and MEMS (microelectronic system), in order to make full use of the electrical properties of materials, the materials for making microelectronic components have expanded from single crystal silicon materials to electronic ceramic materials, such as alumina ceramics, strontium titanate ceramics, Barium titanate ceramics, etc., such electronic ceramics generally meet their electrical performance requirements through the hard particles of the constituent phases and the interface structure of the bonding phase, and the electronic ceramic substrate is...

AI Technical Summary

Problems solved by technology

[0006] The problem existing in the existing grinding and processing of ultra-thin hard and brittle material substrates is that on the one hand, it is difficult to clamp: the pressureless sintered ultra-thin hard and brittle material substrate has a small thickness (the minimum thickness is 0.1mm, which is about one thousandth of the size of other two-dimensional directions. Five) large warping deformation, easy to break, difficult to clamp during grinding

With the current double-sided grinding of the planetary wheel cage, due to the small thickness of the substrate and the large warping deformation, it is difficult for the planetary wheel cage to drive the substrate to move stably. The substrate has a high breakage rate; the vacuum adsorption method cannot effectively clamp the substrate due to the warping deformation of the ultra-thin hard and brittle material; Effective clamping of hard and brittle material substrates makes it difficult to achieve low chipping rate and high-precision grinding of substrates

[0007] The problem existing in the existing grinding process of ultra-thin hard and brittle material substrates, on the other hand, is that the abrasive grains scratch the surface: the movement speed, trajectory, and residence time of free abrasive particles between the grinding disc and the workpiece cannot be effectively controlled. The free abrasives between the grinding disc and the workpiece interface only have larger-sized abrasive particles to produce processing effects, resulting in local scratches on the processed surface

For the method of using free abrasives for grinding processing, the key to improving the processing efficiency and processing accuracy of free abrasives is how to ensure uniform abrasive concentration distribution and as equal abrasive force as possible on the contact interface between the grinding disc and the workpiece. It is difficult to do this with chemical grinding methods, thus affecting the surface accuracy of grinding

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