Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sn-Cu-Ni-Ce-Cr lead-free solder and preparation method thereof

A sn-cu-ni-ce-cr, lead-free solder technology, applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of reducing solder slag rate, poor oxidation resistance, etc. The effect of improving high temperature oxidation resistance, improving wetting properties, reducing the possibility of chemical corrosion and galvanic corrosion

Inactive Publication Date: 2013-03-27
郴州金箭焊料有限公司
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to aim at the shortcoming of poor oxidation resistance of SnCuNiCe alloy solder, to propose a lead-free solder that maintains the original advantages of SnCuNiCe alloy solder such as low melting point, good wettability, and low cost, and can improve oxidation resistance and electrical properties , very well reduce the slag rate of solder

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sn-Cu-Ni-Ce-Cr lead-free solder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Get 50kg of tin-copper alloy ingots described in the preparation method provided by the invention, 10kg of tin-chromium alloy ingots, 10kg of tin-cerium alloy ingots, 1.5kg of tin-nickel alloy ingots and 28.5kg of the insufficient tin amount of the poor surplus tin and add stainless steel pot Carry out smelting in, cast into lead-free solder, obtain the product of the present invention that is originally made by tin 92.85%, copper 5%, chromium 1%, cerium 1%, nickel 0.15%.

Embodiment 2

[0022] Get 40kg of tin-copper alloy ingots described in the preparation method provided by the invention, 8kg of tin-chromium alloy ingots, 0.8kg of tin-cerium alloy ingots, 0.8kg of tin-nickel alloy ingots and 50.4kg of insufficient tin amount to add surplus tin and add stainless steel The pot is melted and cast into lead-free solder to obtain the product of the present invention made of 95.04% tin, 4% copper, 0.8% chromium, 0.08% cerium and 0.08% nickel as raw materials.

Embodiment 3

[0024] Get 30kg of tin-copper alloy ingots described in the preparation method provided by the invention, 5kg of tin-chromium alloy ingots, 8kg of tin-cerium alloy ingots, 1.2kg of tin-nickel alloy ingots and 55.8kg of insufficient tin amount to add surplus tin and add stainless steel pot Smelting in the furnace, casting into lead-free solder, obtaining the product of the present invention made of 95.58% tin, 3% copper, 0.5% chromium, 0.8% cerium, and 0.12% nickel as raw materials.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Melting pointaaaaaaaaaa
Login to View More

Abstract

The invention discloses a Sn-Cu-Ni-Ce-Cr lead-free solder which comprises the following components by weight percent: 0.5-5.0% of Cu, 0.06-1.0% of Cr, 0.01-1.0% of Ce, 0.01-0.15% of Ni and the balance of Sn. Further, the content of the Cr is 0.2-0.7% through optimization. The lead-free solder has the characteristics that the solder splash yield is high relative to a Sn-Cu-Ni-Ce solder, and the solder splash yield is increased by utilizing the properties of the Cr and adjusting the Cr content, so that the lead-free solder with good mechanical properties, good wettability and strong antioxidant ability are obtained, and can be widely applied to the technical field of electronic materials.

Description

technical field [0001] The invention relates to a tin-copper-based lead-free solder, in particular to a Sn-Cu-Ni-Ce-Cr lead-free solder. Background technique [0002] In the lead-free process of solder, lead-free solders mainly include SnAg-based, SnCu-based, SnZn-based, SnBi-based binary alloys, and SnAgCu-based ternary alloys. Compared with traditional SnPb solders, there are inherent disadvantages. SnAg (SnAgCu) solder is better than SnPb solder in terms of fatigue resistance and tensile strength, and has good creep and ductility, but it has a high melting point, more silver content, high cost, and poor oxidation and corrosion resistance. . Compared with other lead-free solders, SnCu solder has the lowest cost, but has deficiencies in alloy melting point, soldering reliability, process yield and oxidation resistance. SnBi solder has a low melting point, superior tensile strength and creep properties, and good wettability, but the cost is high and thermal stabili...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B23K35/34B23K35/40
Inventor 胡洁李曼娇
Owner 郴州金箭焊料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com