Cooling liquid for diamond cutting line to cut solar silicon chips

Abstract

The invention provides a cooling liquid for a diamond cutting line to cut solar silicon chips, which comprises the following components by mass percent: 10 to 90 percent of water, 2 to 86 percent of polyethylene glycol, 1 to 25 percent of dispersing agent, 0.1 to 20 percent of chelate, 0.5 to 15 percent of metal corrosion inhibitor and 0.1 to 2 percent of defoamer. The cooling liquid can be matched with the diamond cutting line for cutting, has good lubricating and cooling effects, effectively reduces the line breaking rate, has a good dispersant effect on silicon powder and iron tramp produced during the cutting process, guarantees the surface performance of the silicon chips, is low in cost and is pollution-free and environmentally friendly.

Description

technical field [0001] The invention relates to a cooling liquid for diamond wire cutting solar silicon wafers. Background technique [0002] With the rapid development of the world economy, energy consumption is increasing, and all countries in the world need the application and popularization of new energy. As the greenhouse gas effect caused by carbon dioxide emissions causes global warming and causes natural disasters, the demand for clean and renewable energy is particularly strong in countries around the world. Since the global crisis caused by the subprime mortgage crisis in the United States in 2007 has spread and expanded, in order to stimulate economic growth, countries have adopted more active measures to encourage the use of renewable energy. The Obama administration of the United States proposed to invest 150 billion US dollars in clean energy in the next 10 years; the European Union set a target to increase the proportion of renewable energy to 20% of the ener...

AI Technical Summary

Problems solved by technology

[0014] The technical problem to be solved by the present invention is to overcome the unsatisfactory dispersing effect of the existing water-based cooling liquid on the silicon powder and iron impurities produced in the cutting process, and provide a cooling liquid for diamond wire cutting of solar silicon wafers

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