Photocurable thermosetting resin composition, dry film and cured product thereof, and printed circuit board using them

A resin composition, photocurable technology, applied in printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve problems such as poor water resistance, achieve improved heat resistance, excellent heat resistance, and less change in physical properties Effect

Active Publication Date: 2017-05-10
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The above-mentioned epoxy acrylate modified resin has a large amount of hydroxyl groups derived from epoxy acrylate remaining, which inherently has the problem of poor water resistance.

Method used

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  • Photocurable thermosetting resin composition, dry film and cured product thereof, and printed circuit board using them
  • Photocurable thermosetting resin composition, dry film and cured product thereof, and printed circuit board using them
  • Photocurable thermosetting resin composition, dry film and cured product thereof, and printed circuit board using them

Examples

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Embodiment

[0169] The present invention will be specifically described below by showing examples and comparative examples, but the present invention is of course not limited to the following examples. In addition, "parts" and "%" described below are all mass standards unless otherwise stated.

Synthetic example 1

[0171] Add 119.4 parts of novolak-type cresol resin (manufactured by Showa Polymer Co., Ltd., trade name: "Shonol CRG951", OH equivalent : 119.4), 1.19 parts of potassium hydroxide and 119.4 parts of toluene, while stirring, nitrogen replacement was carried out in the system, and the temperature was raised. Then, slowly add 63.8 parts of propylene oxide dropwise, at 125~132℃, 0~4.8kg / cm 2 The reaction was carried out for 16 hours. Thereafter, it was cooled to room temperature, and 1.56 parts of 89% phosphoric acid was added and mixed in the reaction solution to neutralize potassium hydroxide to obtain a non-volatile content of 62.1%, a hydroxyl value of 182.2g / eq. Propane reaction solution. An average of 1.08 moles of alkylene oxide was added per 1 equivalent of phenolic hydroxyl group.

[0172] Then, the alkylene oxide reaction solution of 293.0 parts of gained novolac type cresol resins, 43.2 parts of acrylic acid, 11.53 parts of methanesulfonic acid, 0.18 parts of methyl...

Synthetic example 2

[0174] Into a 5-liter detachable flask equipped with a thermometer, a stirrer, and a reflux cooler, 1245 parts of polycaprolactone diol (PLACCEL208 manufactured by DAICEL CHEMICAL INDUSTRIES, LTD., molecular weight 830) as a polymer polyol, as 201 parts of dimethylolpropionic acid as a dihydroxy compound having a carboxyl group, 777 parts of isophorone diisocyanate as a polyisocyanate and 119 parts of 2-hydroxyethyl acrylate as a (meth)acrylate having a hydroxyl group, and 0.5 parts each of p-methoxyphenol and di-tert-butylhydroxytoluene. Heating to 60°C while stirring was stopped, and 0.8 parts of dibutyltin dilaurate was added. When the temperature in the reaction vessel begins to drop, heat it again, continue stirring at 80°C, and confirm the absorption spectrum of the isocyanate group (2280cm -1 ) disappears, the reaction ends, and a viscous liquid urethane acrylate compound is obtained. It adjusted to non-volatile matter=50 mass % using carbitol acetate. A resin soluti...

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PUM

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Abstract

The disclosed photocurable / thermosetting resin composition, which can be developed by an alkaline aqueous solution, can form a cured film that has properties important for a solder resist for semiconductor packages, namely PCT and HAST reliability and resistance to immersion gold plating and thermal shock. Said photocurable / thermosetting resin composition contains: (A) a carboxyl-containing resin (but not a carboxyl-containing resin made from an epoxy resin); (B) a photopolymerization initiator; and (C) a naphthalene-ring-containing epoxy resin. Preferably, the carboxyl-containing resin does not contain any hydroxyl groups and does contain a photosensitive group. Also disclosed is a printed circuit board on which the disclosed photocurable / thermosetting resin composition or a dry film thereof is used to form a cured film such as a solder resist.

Description

technical field [0001] The present invention relates to a photocurable thermosetting resin composition that can be developed by aqueous alkali solution, especially a composition for solder resist that is photocurable by ultraviolet exposure or laser exposure, its dry film and cured product, and a composition having a composition formed by using them. Printed circuit boards with cured film. Background technique [0002] At present, some printed circuit boards for commercial use and most of the solder resists for industrial printed circuit boards use heat and / or light irradiation to form images by developing after ultraviolet exposure from the viewpoint of high precision and high density. The final curing (mainly curing) liquid-developing solder resist, due to environmental considerations, the alkali-developing photo-solder resist that uses an aqueous alkali solution as the developer has become the mainstream, and it is widely used in the actual production of printed circuit b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/032G03F7/004G03F7/038H05K3/28
CPCH05K3/3452G03F7/038
Inventor 吉田贵大有马圣夫
Owner TAIYO HLDG CO LTD
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