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Hydrophilic epoxy resin binder and preparation method and application thereof

A technology of epoxy resin and adhesive, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of large amount of resin, low wet compressive strength of permeable products, etc., and achieve improved mechanical properties and durability performance, reduce groundwater pollution, and improve mechanical properties

Active Publication Date: 2012-11-14
杭锦旗亿嘉环境治理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, water-emulsified epoxy resins and hydantoin epoxy resins that are completely soluble in water have the disadvantages of large amount of resin and low wet compressive strength of water-permeable products.

Method used

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  • Hydrophilic epoxy resin binder and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Accurately weigh raw materials (Kg): bisphenol A epoxy resin E-44 is 750, surfactant Span S-80 is 60, surfactant Tween T-80 is 60, catalyst tetraethylammonium chloride is 0.003.

[0034] Preparation:

[0035] The preparation method of this hydrophilic epoxy resin adhesive is made up of the following steps:

[0036] (a) Add bisphenol A type epoxy resin into the reaction device and stir;

[0037] (b) According to the amount of epoxy groups in the bisphenol A epoxy resin, add the surfactant Span and the surfactant Tween, and stir for 15-30 minutes;

[0038] (c) Add the catalyst, stir for 15-30 minutes, and heat up to 70-120°C;

[0039] (d) Control the temperature in the reaction device between 70-120°C to carry out the reaction;

[0040] (e) Sampling and testing, the epoxy value is measured according to the hydrochloric acid-acetone method, when the epoxy value reaches the theoretical value of the reaction, the system cools down;

[0041] (f) After the reaction is com...

Embodiment 2

[0044] Accurately weigh raw materials (Kg):

[0045] The bisphenol A type epoxy resin E-44 is 650, the surfactant Span S-60 is 50, the surfactant Tween T-60 is 50, and the catalyst 2-methylimidazole is 0.002.

[0046] Preparation:

[0047] The preparation method of this hydrophilic epoxy resin adhesive is made up of the following steps:

[0048] (a) Add bisphenol A type epoxy resin into the reaction device and stir;

[0049] (b) According to the amount of epoxy groups in the bisphenol A epoxy resin, add the surfactant Span and the surfactant Tween, and stir for 15-30 minutes;

[0050] (c) Add the catalyst, stir for 15-30 minutes, and heat up to 70-120°C;

[0051] (d) Control the temperature in the reaction device between 70-120°C to carry out the reaction;

[0052] (e) Sampling and testing, the epoxy value is measured according to the hydrochloric acid-acetone method, when the epoxy value reaches the theoretical value of the reaction, the system cools down;

[0053] (f) A...

Embodiment 3

[0056] Accurately weigh raw materials (Kg):

[0057] Bisphenol A type epoxy resin E-35 850, surfactant Span S-40 100, surfactant Tween T-60 100, catalyst benzyl triethylammonium chloride 0.004.

[0058] Preparation:

[0059] The preparation method of this hydrophilic epoxy resin adhesive is made up of the following steps:

[0060] (a) Add bisphenol A type epoxy resin into the reaction device and stir;

[0061] (b) According to the amount of epoxy groups in the bisphenol A epoxy resin, add the surfactant Span and the surfactant Tween, and stir for 15-30 minutes;

[0062] (c) Add the catalyst, stir for 15-30 minutes, and heat up to 70-120°C;

[0063] (d) Control the temperature in the reaction device between 70-120°C to carry out the reaction;

[0064] (e) Sampling and testing, the epoxy value is measured according to the hydrochloric acid-acetone method, when the epoxy value reaches the theoretical value of the reaction, the system cools down;

[0065] (f) After the reaction...

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Abstract

The invention discloses a hydrophilic epoxy resin binder and a preparation method and an application thereof. The hydrophilic epoxy resin binder consists of the following components according to parts by weight: bisphenol A type epoxy resin, a surface active agent Span, a surface active agent Tween and a catalyst, wherein the catalyst can be tetraethyl ammonium chloride, butyl triphenyl phosphonium bromide, benzyl triethyl ammonium bromide, benzyl triethyl ammonium chloride, 2-methyl imidazole or any combination thereof; the bisphenol A type epoxy resin can be bisphenol A type epoxy resin E-44, E-42, E-35, E-31, E-20, E-14, E-12, E-06, E-03 or any combination thereof; the surface active agent Span can be S-20, S-40, S-60, S-80, S-85 or any combination thereof; and the surface active agent Tween can be T-20, T-40, T-60, T-80, T-85 or any combination thereof. The hydrophilic epoxy resin binder is applied in the preparation process of water permeable pavement materials and high-strength cement products.

Description

technical field [0001] The invention relates to a hydrophilic epoxy resin binder and its preparation method and application. Background technique [0002] At present, due to the needs of the development of the urban ecological environment, the urban ground is gradually covered by impermeable materials such as cement and asphalt to be covered by permeable pavement materials. The traditional method is composed of large particle skeleton and epoxy resin. However, during the use of epoxy resin, due to its lipophilicity and hydrophobicity on the surface, in order to make epoxy resin hydrophilic, it is necessary to try to introduce a hydrophilic molecular segment into its molecular chain or to prepare a complete solution. epoxy resin in water. However, the water-emulsified epoxy resins and hydantoin epoxy resins that are completely soluble in water have the disadvantages of large amount of resin and low wet compressive strength of water-permeable products. Invention content: ...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J11/06C04B28/00
Inventor 高双之康杰
Owner 杭锦旗亿嘉环境治理有限公司
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