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A bright cyanide-free silver plating solution and preparation method thereof

A cyanide-free silver plating and electroplating solution technology, which is applied in the field of electrochemical silver plating, can solve the problems that the process performance cannot meet the electroplating process, poor dispersibility of cyanide-free silver plating, inconvenient management and operation, etc., to improve the quality of the plating layer, combine Good power, good economic benefits and social benefits

Inactive Publication Date: 2011-12-07
NANJING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Some cyanide-free silver plating cannot be used for thick silver plating due to low current density and slow deposition rate, let alone high-speed electroplating
2) The stability of the plating solution
There are problems with the stability of many cyanide-free silver plating baths, whether it is alkaline bath or acidic bath or neutral bath, there are bath stability problems to varying degrees, which brings inconvenience to management and operation. cost also increased
3) The process performance cannot meet the needs of electroplating processing
Cyanide-free silver plating often has poor dispersion ability, low cathode current density, and easy passivation of the anode, which limits its application.

Method used

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  • A bright cyanide-free silver plating solution and preparation method thereof
  • A bright cyanide-free silver plating solution and preparation method thereof
  • A bright cyanide-free silver plating solution and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0024] A bright cyanide-free silver plating solution, the raw material formula is made up of each component of following mass concentration: 300 mg / L saccharin, 500 mg / L methionine, 30 g / L AgNO 3 , 180 g / L hydantoin, 17 g / L KNO 3 , 10 g / L NaOH.

[0025] The complexing agent hydantoin, supporting electrolyte KNO 3 Dissolve the pH regulator NaOH of the electroplating solution with part of the water, mix well; cool to room temperature, and then slowly add the silver ion source AgNO 3 , stir until the solution is clear; then add the brightener saccharin and methionine to it, and finally add the remaining water, stir evenly and let stand.

[0026] During the electroplating process, the bath was maintained at 50°C. Then, the pretreated metal substrate was connected to the circuit and immersed in the electroplating solution with a current density of 1 A / dm 2 , and the plating method was rack plating to obtain a silver-plated sample of a light-emitting diode lead frame. Rack plat...

Embodiment 2

[0028] A bright cyanide-free silver plating solution, the raw material formula is made up of each component of following mass concentration: 10 mg / L polyethylene glycol, 500 mg / L histidine, 42 g / L AgCl, 190 g / L 5 -Methylhydantoin, 24 g / L K 2 CO 3 , 14 g / L KOH.

[0029] Adopt above-mentioned formula and adopt the preparation method of embodiment 1 to prepare, obtain bright cyanide-free silver plating electroplating solution, temperature control 10~80 ℃, at 50-80 A / dm 2 Under the current density, the silver-plated sample of the integrated circuit lead frame is sprayed by spraying. Morphology and microstructure of IC lead frame plated parts at different current densities, such as figure 2 As shown, the frame leads of integrated circuits generally require high-speed electroplating with a soft, matte silver layer of 1~5mm. The silver layer requires stable properties and good solderability. Utilizing the invention of the invention, the high-speed cyanide-free silver plating of ...

Embodiment 3

[0031] A bright cyanide-free silver plating solution, the raw material formula is made up of each component of following mass concentration: 200 mg / L imidazole, 450 mg / L tryptophan, 25 g / L AgNO 3 , 160 g / L 5,5-dimethylhydantoin, 20 g / L K 2 CO 3 , 18 g / L NaOH.

[0032] Adopt above-mentioned formula and adopt the preparation method of embodiment 1 to prepare, obtain bright cyanide-free silver plating electroplating solution, temperature control 40 ℃, at 5 A / dm 2 Under the current density, rack plating of wire silver plating samples was carried out by rack plating.

[0033] Photos of silver-clad copper wires and electroplating effects of copper wires of different thicknesses, such as image 3 As shown, in the electronic industry, especially in the field of high-frequency communication, it is necessary to provide functional silver-plated wires with high conductivity due to the miniaturization of devices. The invention perfects the cyanide-free silver plating process on copper ...

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Abstract

The invention discloses non-cyanide bright silver electroplating bath, which consists of the following components in mass concentration: 50 to 800mg / L brightener, 25 to 60g / L silver ion source substance, 130 to 190g / L coordinating agent, 10 to 40g / L supporting electrolyte and 10 to 50g / L electroplating bath pH regulator, wherein the brightener is one or more kinds of amino acid compounds, imidazole, polyethylene glycol, quinoline derivatives and saccharin. Compared with the prior art, the non-cyanide bright silver electroplating bath has the outstanding advantages that: the electroplating bath is stable and low in toxicity; and an extremely small amount of brightener can obviously improve the performance of the electroplating bath and the quality of a coating. The coating has fine crystals, good bonding force, smooth and bright surface and high anti-tarnish property, can meet the requirement of application in multiple fields such as decorative electroplating, functional electroplatingand the like, has high practicability and can generate good economic and social benefits.

Description

technical field [0001] The invention belongs to the technical field of electrochemical silver plating, and relates to a cyanide-free electroplating solution for silver plating, in particular to a bright cyanide-free silver plating solution and a configuration method thereof. Background technique [0002] The silver-plated layer has high electrical and thermal conductivity, good welding performance, high chemical stability to organic acids and alkalis, and its price is cheaper than other precious metals. It has been widely used in the electronics industry, decorations, tableware and various A variety of handicrafts and other fields. Due to the advantages of high current efficiency, good dispersing ability, strong covering ability, and fine crystallization of the coating, so far, most of the silver plating processes at home and abroad still use the cyanide silver plating process to electroplate the silver layer. However, cyanide silver plating solution is highly toxic, seriou...

Claims

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Application Information

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IPC IPC(8): C25D3/46
Inventor 赵健伟
Owner NANJING UNIV
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