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Separation and purification method of silicon wafer cutting waste mortar

A purification method and silicon wafer cutting technology, which are applied in chemical instruments and methods, silicon compounds, inorganic chemistry, etc. Well-designed effects

Inactive Publication Date: 2011-06-29
SHAANXI DESHENG NEW ENERGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a method for separating and purifying silicon wafer cutting waste mortar, which has reasonable design, simple method steps, simple operation, high efficiency, low input and operating costs, and is easy to process. Realized, the quality of the separated PEG, crystalline silicon powder and SiC micropowder is excellent, which can effectively solve the practical problems existing in the existing separation and purification methods that cannot achieve high efficiency, high yield and high quality recovery

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Examples

Experimental program
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Effect test

Embodiment 1

[0055] In the present embodiment, when the waste mortar is separated and purified, the separation and purification process is as follows:

[0056]Step 1. Solid-liquid separation of waste mortar: use heating equipment to heat the processed waste mortar in a stirring state until the processed waste mortar is heated to 65°C; after that, use pumping equipment to pump the heated waste mortar to The solid-liquid separation device performs solid-liquid separation, and obtains the liquid separation and the filter cake layer; then, pumps hot water at a temperature of 65°C into the solid-liquid separation device with pumping equipment to rinse the filter cake layer, And the flushing water is collected, and the volume of the pumped hot water is 6 times the volume of the liquid isolate; after the flushing is completed, the solid isolate and a mixed solution consisting of the liquid isolate and the collected flushing water are obtained.

[0057] In this embodiment, the solid-liquid separat...

Embodiment 2

[0080]In this example, the difference from Example 1 is that when the waste mortar to be treated is heated in step 1, the waste mortar to be treated is heated to 50°C and the stirring speed is 1000r / min. The water temperature of the water is 50°C and the volume of the pumped hot water is 4 times the volume of the liquid isolate; the pore size of the precision filter described in step 201 is 3 μm, and the pore size of the microporous filter or molecular sieve filter is 0.1 μm, The aperture of the ultrafiltration filter is 500 angstroms; the vacuum degree of the vacuum distillation equipment adopted in the step 203 is 2000Pa and the temperature is 50 ℃; in the step 301, the volume of pure water added in the solid isolate described in the step 1 is 2 times the volume of the solid isolate, the volume ratio of the added water-soluble surfactant to the solid-liquid mixture is 0.001%; ​​in step 301, the suspension on the upper part of the precipitation layer is pumped to the solid by ...

Embodiment 3

[0082] In this example, the difference from Example 1 is that when the waste mortar to be treated is heated in step 1, the waste mortar to be treated is heated to 80°C and the stirring speed is 500r / min, and the heat added during solid-liquid separation The temperature of the water is 80°C and the volume of the pumped hot water is 3 times the volume of the liquid isolate; the pore size of the precision filter described in step 201 is 7 μm, the pore size of the microporous filter or molecular sieve filter is 1 μm, ultra The pore diameter of filter filter is 1000 angstroms; The vacuum tightness of vacuum distillation equipment adopted in step 203 is 4900Pa and temperature is 90 ℃; In step 301, the volume of adding pure water in the solid isolate described in step 1 is described 6 times the volume of the solid isolate, the volume of the added water-soluble surfactant is 0.01% of the volume of the solid-liquid mixture; in step 301, the suspension on the upper part of the precipitat...

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Abstract

The invention discloses a separation and purification method of silicon wafer cutting waste mortar. The method comprises the following steps: 1) performing solid-liquid separation to waste mortar to obtain solid separated substance and mixed solution 1; 2) separating and recycling polyethylene glycol (PEG), namely performing tertiary filtration to the mixed solution 1, performing resin treatment and performing vacuum distillation to obtain PEG finished product; 3) separating and recycling crystalline silicon powder, namely performing multiple settlement sortings and solid-liquid separations to the solid separated substance, pickling the obtained solid separated substance, filtering, dewatering and drying to obtain crystalline silicon powder; and 4) separating and recycling SiC fine powder, namely performing multiple settlement sortings and solid-liquid separations to obtain a precipitation layer, pickling, performing solid-liquid separation, rinsing and drying to obtain SiC fine powder. The method of the invention has reasonable design, simple steps, convenient operations, high efficiency and low investment and operation cost, the large-scale production is easy to realize and the separated and purified PEG, crystalline silicon powder and SiC fine powder have good qualities.

Description

technical field [0001] The invention belongs to the technical field of recycling and processing waste mortar in silicon chip cutting in the solar photovoltaic industry and the recycling and processing of waste mortar in silicon chip cutting in the electronic industry, and in particular relates to a separation and purification method for silicon chip cutting waste mortar. Background technique [0002] In the process of cutting and preparing silicon wafers for solar cells in the photovoltaic industry and silicon substrates for integrated circuits in the electronics industry, the multi-wire cutting principle is used to cut high-purity monocrystalline silicon or polycrystalline silicon rods with steel wires driving a mortar composed of silicon carbide abrasives. While cutting silicon rods into silicon wafers, a certain amount of silicon shavings are also produced, and as the cutting process progresses, more and more silicon shavings are mixed into the cutting fluid, which eventua...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M175/00C01B33/037C01B31/36
Inventor 郭锐
Owner SHAANXI DESHENG NEW ENERGY
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